ICA-648-SGG Equivalent & Substitute Parts

Part Overview

The ICA-648-SGG is a 48-position DIP socket manufactured by Samtec Inc., designed for through-hole mounting applications requiring gold-plated beryllium copper contacts. This component is classified as an active product and serves as an interconnection solution for dual-in-line integrated circuits with 0.6" row spacing and 0.100" pitch.

Substitute parts become necessary when the primary component reaches end-of-life status, inventory constraints occur, or when design requirements permit alternative contact materials and performance specifications within acceptable electrical and mechanical tolerances.

Substiute Parts

ICA-648-SGG

Samtec Inc.In Stock: 667ICA-648-SGG Datasheet

Current PartRFQ

848-AG10D

TE Connectivity AMP ConnectorsIn Stock: 1085848-AG10D Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the ICA-648-SGG is determined by strict alignment of the following critical parameters:

Mandatory Matching Parameters:

• Number of Positions: 48 (2 x 24)
• Row Spacing: 0.6" (15.24mm)
• Pitch - Mating: 0.100" (2.54mm)
• Pitch - Post: 0.100" (2.54mm)
• Mounting Type: Through Hole
• Termination: Solder
• Contact Finish - Mating: Gold
• Material Flammability Rating: UL94 V-0
• Contact Resistance: 10mOhm

Allowable Variations:

• Contact Material (Mating): Beryllium Copper or Copper Alloy
• Contact Finish Thickness (Mating): 25.0µin to 30.0µin
• Operating Temperature Range: Minimum -55°C, Maximum 105°C or higher
• Current Rating: Equal to or greater than 1 A
• Product Status: Active or Obsolete (with compliance verification)
• RoHS Compliance: ROHS3 or RoHS Compliant

The 848-AG10D qualifies as a direct substitute based on these parameters, with documented variations in contact material composition and maximum operating temperature.

Parameter Comparison

Engineering Selection Recommendations

ICA-648-SGG Selection Criteria:

• Primary choice for new designs requiring active product status
• Specified when maximum operating temperature of 125°C is required
• Preferred when beryllium copper contact material is explicitly required by design specification
• Recommended for applications where ROHS3 compliance is mandatory

848-AG10D Selection Criteria:

• Acceptable for applications with maximum operating temperature requirement of 105°C or lower
• Suitable for designs where copper alloy contact material meets functional requirements
• Applicable when higher current rating (3 A) provides design margin
• Usable in legacy system replacements where RoHS Compliant status is acceptable
• Note: Product status is Obsolete; verify long-term availability before design commitment

Critical Consideration: The 848-AG10D operates at a maximum temperature of 105°C compared to the ICA-648-SGG at 125°C. Applications operating continuously above 105°C require the primary part. Both components maintain identical contact resistance (10mOhm) and mechanical compatibility for PCB mounting and IC insertion.

Frequently Asked Questions (FAQ)

Q: Can the 848-AG10D replace the ICA-648-SGG in all applications?

A: The 848-AG10D is mechanically and electrically compatible for applications where the maximum operating temperature does not exceed 105°C. Applications requiring sustained operation above 105°C must use the ICA-648-SGG. Verify your application's thermal requirements before substitution.

Q: What is the difference between beryllium copper and copper alloy contacts?

A: Both materials provide the specified 10mOhm contact resistance and gold plating. Beryllium copper (ICA-648-SGG) and copper alloy (848-AG10D) are both acceptable for standard DIP socket applications. Material selection does not affect electrical performance within the specified parameters.

Q: Why is the 848-AG10D listed as Obsolete?

A: Obsolete status indicates the manufacturer has discontinued production. While existing inventory may be available, long-term sourcing cannot be guaranteed. For new designs, the ICA-648-SGG (Active status) is the recommended choice.

Q: Are the gold plating thicknesses functionally equivalent?

A: Yes. The ICA-648-SGG specifies 30.0µin (0.76µm) and the 848-AG10D specifies 25.0µin (0.63µm). Both thicknesses exceed minimum requirements for contact durability and electrical performance in standard DIP socket applications.

Q: Does the higher current rating of the 848-AG10D (3 A vs 1 A) affect compatibility?

A: No. Higher current rating indicates greater capability and does not affect compatibility. The 848-AG10D can be used in applications rated for 1 A without performance degradation.

Q: What are the RoHS compliance differences?

A: The ICA-648-SGG is ROHS3 Compliant (most recent standard). The 848-AG10D is RoHS Compliant (earlier standard). Both meet hazardous substance restrictions. Verify your procurement requirements specify which RoHS version is acceptable.

Q: Can I use these parts interchangeably on the same PCB?

A: Yes, provided your application's maximum operating temperature does not exceed 105°C. Both parts have identical 0.100" pitch, 0.6" row spacing, and through-hole solder termination, making them mechanically interchangeable on standard DIP socket footprints.