ICA-308-WGG DIP Socket Equivalent & Substitute Parts

Part Overview

The ICA-308-WGG is an 8-position DIP socket manufactured by Samtec Inc., designed for through-hole mounting applications requiring gold-plated beryllium copper contacts. This socket accommodates dual inline package (DIP) integrated circuits with 0.3" row spacing and 0.100" pitch. The product is currently active in production with 827 units in stock.

Equivalent and substitute parts are identified to provide design flexibility, support supply chain continuity, and accommodate specific application requirements such as termination method preferences or contact resistance specifications.

Substiute Parts

ICA-308-WGG

Samtec Inc.In Stock: 913ICA-308-WGG Datasheet

Current PartRFQ

123-13-308-41-001000

Mill-Max Manufacturing Corp.In Stock: 946123-13-308-41-001000 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the ICA-308-WGG is determined by strict alignment of the following critical parameters:

Mandatory Matching Parameters:

• Number of Positions: 8 (2 x 4)
• Row Spacing: 0.3" (7.62mm)
• Pitch - Mating: 0.100" (2.54mm)
• Contact Finish - Mating: Gold
• Contact Material - Mating: Beryllium Copper
• Mounting Type: Through Hole
• Operating Temperature Range: -55°C ~ 125°C

Allowable Variations:

• Termination method (Solder vs. Wire Wrap)
• Contact finish thickness on post
• Contact material on post (Brass vs. Brass Alloy)
• Housing material composition
• Current rating (when equal or greater)

The substitute part 123-13-308-41-001000 meets all mandatory matching parameters and qualifies as a direct equivalent for applications where termination method flexibility is acceptable.

Parameter Comparison

Engineering Selection Recommendations

ICA-308-WGG Selection Criteria:

• Applications requiring solder termination to PCB
• Designs with UL94 V-0 flammability rating requirement
• Standard current requirements up to 1 A per contact
• Glass-filled polyester housing preference

123-13-308-41-001000 Selection Criteria:

• Applications utilizing wire wrap termination technology
• Higher current capacity requirement (3 A per contact)
• PCT/Polyester housing material compatibility
• Moisture Sensitivity Level 1 (Unlimited) requirement

Both parts maintain ROHS3 compliance and identical mating contact specifications. Selection between these equivalents depends on termination method compatibility with the target PCB assembly process and current rating requirements of the application circuit.

Frequently Asked Questions (FAQ)

Q: Can the 123-13-308-41-001000 be used as a direct replacement for the ICA-308-WGG in existing designs?

A: The 123-13-308-41-001000 is mechanically and electrically compatible for DIP socket applications with identical pin count, spacing, and pitch. However, the termination method differs (Wire Wrap vs. Solder). Substitution requires PCB design compatibility with wire wrap termination posts. The higher current rating (3 A vs. 1 A) does not restrict substitution in lower-current applications.

Q: What are the key differences between these two socket types?

A: The primary differences are termination method, post contact finish thickness, and current rating. The ICA-308-WGG uses solder termination with 30.0µin post finish thickness and 1 A current rating. The 123-13-308-41-001000 uses wire wrap termination with 10.0µin post finish thickness and 3 A current rating. Both maintain identical mating contact specifications and operating temperature range.

Q: Are both parts RoHS compliant?

A: Both the ICA-308-WGG and 123-13-308-41-001000 are ROHS3 compliant, meeting current environmental and hazardous substance restrictions.

Q: What is the significance of the 0.3" row spacing specification?

A: The 0.3" (7.62mm) row spacing is the distance between the two parallel rows of contact positions in the DIP socket. This dimension is critical for mechanical compatibility with standard DIP integrated circuit packages. Both substitute parts maintain this specification.

Q: Can these sockets accommodate different DIP package sizes?

A: These 8-position sockets are designed specifically for 8-pin DIP packages with 0.3" row spacing and 0.100" pitch. They are not compatible with different pin counts or row spacing configurations.