HSMS-282F-TR1G Equivalent & Substitute Parts

Part Overview

The HSMS-282F-TR1G is an RF Schottky diode manufactured by Broadcom Limited, configured as a 1 Pair Common Cathode device in SOT-323 packaging. This component is designed for RF applications requiring low capacitance and fast switching characteristics at 15V peak reverse voltage with 1A maximum current rating. The part is currently classified as obsolete, making identification of suitable substitutes essential for ongoing design support and production continuity.

Substiute Parts

HSMS-282F-TR1G
Broadcom LimitedIn Stock: 5890HSMS-282F-TR1G Datasheet
HSMS-282F-TR1G
Current Part
1PS70SB85,115
Nexperia USA Inc.In Stock: 43331PS70SB85,115 Datasheet
1PS70SB85,115
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number HSMS-282F-TR1G
Manufacturer Broadcom Limited
Category Diodes
Diode Type Schottky - 1 Pair Common Cathode
Package / Case SC-70, SOT-323
Voltage - Peak Reverse (Max) 15V
Current - Max 1 A
Capacitance @ Vr, F 1pF @ 0V, 1MHz
Resistance @ If, F 12Ohm @ 5mA, 1MHz
Operating Temperature (TJ) 150°C
Product Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the HSMS-282F-TR1G is determined by the following critical parameters:

Configuration Match: Both the main part and substitute must maintain 1 Pair Common Cathode diode configuration to preserve circuit topology and pinout compatibility.

Package Compatibility: The SOT-323 (SC-70) surface mount package is mandatory for mechanical and thermal compatibility with existing PCB layouts.

Voltage Rating: Maximum reverse voltage must be 15V or greater to ensure safe operation within the original design envelope.

Current Handling: The substitute must support the application's current requirements. The original part specifies 1A maximum; substitutes with lower current ratings (such as 30mA) are acceptable only when the actual circuit current demand does not exceed the substitute's rating.

Diode Technology: Schottky technology must be maintained to preserve RF performance characteristics, switching speed, and forward voltage drop behavior.

The 1PS70SB85,115 from Nexperia USA Inc. meets these substitution criteria through matching configuration, package, voltage rating, and technology classification.

Parameter Comparison

Parameter HSMS-282F-TR1G (Broadcom) 1PS70SB85,115 (Nexperia)
Diode Configuration 1 Pair Common Cathode 1 Pair Common Cathode
Technology Schottky Schottky
Package / Case SC-70, SOT-323 SC-70, SOT-323
Voltage - DC Reverse (Max) 15V 15V
Current Rating 1 A (Max) 30mA (DC) per Diode
Voltage - Forward (Max) @ If Not specified 700 mV @ 30 mA
Current - Reverse Leakage @ Vr Not specified 200 nA @ 1 V
Operating Temperature (Max) 150°C (TJ) 125°C (TJ)
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited)
Product Status Obsolete Active

Engineering Selection Recommendations

The 1PS70SB85,115 is the qualified substitute for the HSMS-282F-TR1G based on the following engineering criteria:

Functional Equivalence: Both parts are Schottky diode pairs in common cathode configuration with identical SOT-323 packaging, ensuring direct pinout and circuit topology compatibility.

Voltage Compatibility: Both devices are rated for 15V maximum reverse voltage, maintaining the original design's voltage margin.

Current Derating Consideration: The substitute is rated for 30mA per diode versus the original 1A maximum. Selection of this substitute is appropriate only when the actual circuit current does not exceed 30mA per diode. Applications requiring higher current must identify alternative substitutes with higher current ratings.

Product Status Advantage: The substitute is classified as Active, ensuring continued availability and manufacturing support, whereas the original part is Obsolete.

Compliance & Qualification: The substitute carries AEC-Q100 automotive qualification and ROHS3 compliance, providing additional quality assurance for regulated applications.

Temperature Derating: The substitute's maximum junction temperature is 125°C compared to the original 150°C. Thermal design review is required for applications operating near the upper temperature limit.

Frequently Asked Questions (FAQ)

Q: Can the 1PS70SB85,115 be used as a direct replacement in all applications using HSMS-282F-TR1G?

A: Direct replacement is valid only when the circuit current per diode does not exceed 30mA. Applications requiring higher current must identify alternative substitutes with appropriate current ratings. Pinout and package compatibility are identical.

Q: What is the impact of the lower current rating on circuit performance?

A: The 30mA rating of the substitute is a maximum specification. If the actual circuit current is below this threshold, there is no performance impact. If the application requires sustained current above 30mA, the substitute will not provide adequate current handling and an alternative part must be selected.

Q: Are there packaging differences between the original and substitute?

A: Both parts use SOT-323 (SC-70) surface mount packaging. Mechanical dimensions, pin spacing, and PCB footprint are identical, allowing direct PCB layout compatibility without modification.

Q: How does the temperature rating difference affect long-term reliability?

A: The substitute's 125°C maximum junction temperature is 25°C lower than the original. For applications operating below 125°C junction temperature, there is no reliability impact. Thermal analysis is required for designs operating near or above 125°C to confirm the substitute is suitable.

Q: What compliance certifications does the substitute carry?

A: The 1PS70SB85,115 is AEC-Q100 qualified and ROHS3 compliant. The original part's compliance status is not specified in the provided data. For regulated or automotive applications, the substitute's certifications provide documented quality assurance.

Q: Is the substitute available in the same packaging format as the original?

A: Yes. The substitute is supplied in Tape & Reel (TR) format in SOT-323 packaging, matching the original supply format for automated assembly compatibility.

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