HSMP-489B-TR2G Equivalent & Substitute Parts

Part Overview

The HSMP-489B-TR2G is an RF Diode PIN - Single manufactured by Broadcom Limited, rated for 100V peak reverse voltage and 1 A maximum current in an SOT-323 package. This component is classified as Obsolete, making identification of functionally equivalent alternatives necessary for ongoing design support and procurement continuity. The part operates at a maximum junction temperature of 150°C and exhibits a capacitance of 0.375pF at 5V, 1MHz with a resistance of 2.5Ohm at 5mA, 100MHz.

Substiute Parts

HSMP-489B-TR2G

Broadcom LimitedIn Stock: 1115HSMP-489B-TR2G Datasheet

Current PartRFQ

CLA4611-085LF

Skyworks Solutions Inc.In Stock: 2240CLA4611-085LF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the HSMP-489B-TR2G is determined by the following electrical and mechanical criteria:

Electrical Compatibility Requirements:

• Diode Type: PIN - Single (functional category match)
• Voltage - Peak Reverse (Max): Must equal or exceed 100V
• Current - Max: Must equal or exceed 1 A
• Capacitance and Resistance characteristics: Must be compatible with RF circuit operating frequencies

Mechanical Compatibility Requirements:

• Package form factor compatibility with SOT-323 footprint or equivalent land pattern

The CLA4611-085LF meets these substitution criteria with superior electrical ratings (180V peak reverse voltage, 1.5 A maximum current) and enhanced thermal performance (175°C operating temperature), while maintaining PIN diode functionality suitable for RF applications.

Parameter Comparison

Engineering Selection Recommendations

The CLA4611-085LF is an active, production-supported substitute for the obsolete HSMP-489B-TR2G. Selection is based on the following factors:

Product Status: The HSMP-489B-TR2G is obsolete; the CLA4611-085LF is active and currently manufactured, ensuring long-term availability and supply chain stability.

Electrical Performance: The CLA4611-085LF exceeds the electrical requirements of the HSMP-489B-TR2G across all critical parameters: peak reverse voltage (180V vs. 100V), maximum current (1.5 A vs. 1 A), and operating temperature range (175°C vs. 150°C). These superior ratings provide design margin and enhanced reliability.

Compliance & Certifications: The CLA4611-085LF is ROHS3 Compliant and carries improved moisture sensitivity classification (MSL 1 vs. MSL 2A), reducing handling and storage constraints.

Regulatory Status: Both components share identical REACH and ECCN classifications (REACH Unaffected, EAR99), maintaining regulatory compliance in substitution.

Frequently Asked Questions (FAQ)

Q: Can the CLA4611-085LF directly replace the HSMP-489B-TR2G in existing designs?

A: The CLA4611-085LF is electrically superior and functionally compatible as a PIN diode for RF applications. However, package differences (3-QFN vs. SOT-323) require PCB layout modification. Verify footprint compatibility and land pattern requirements before implementation.

Q: What are the key differences between these two parts?

A: The primary differences are product status (active vs. obsolete), package form factor (3-QFN vs. SOT-323), and electrical ratings. The CLA4611-085LF provides higher voltage and current ratings, lower on-state resistance, and improved thermal performance.

Q: Are there any compliance concerns with substitution?

A: Both parts maintain identical REACH and ECCN classifications. The CLA4611-085LF offers improved RoHS compliance (ROHS3 Compliant) and reduced moisture sensitivity, presenting no compliance barriers to substitution.

Q: How do the RF characteristics compare?

A: Both components are PIN diodes suitable for RF applications. The CLA4611-085LF exhibits lower capacitance (0.35pF vs. 0.375pF) and significantly lower resistance (1.2Ohm vs. 2.5Ohm), with measurement conditions at higher frequency (500MHz vs. 100MHz), indicating superior high-frequency performance.

Q: What packaging considerations apply?

A: The HSMP-489B-TR2G uses SOT-323 packaging; the CLA4611-085LF uses 3-QFN (2x2) packaging. These are physically distinct packages requiring separate PCB designs. Verify component placement, thermal management, and assembly process compatibility.