HSMP-389F-TR2G Equivalent & Substitute Parts

Part Overview

The HSMP-389F-TR2G is an RF PIN diode manufactured by Broadcom Limited, designed for RF switching and attenuation applications. This component features a 1 Pair Common Cathode configuration with a peak reverse voltage rating of 100V and maximum current handling of 1A in an SC-70/SOT-323 package. The product is currently obsolete, making identification of suitable substitute components essential for ongoing design support and production continuity.

Substiute Parts

HSMP-389F-TR2G

Broadcom LimitedIn Stock: 1157HSMP-389F-TR2G Datasheet

Current PartRFQ

DAN235UT106

Rohm SemiconductorIn Stock: 83296DAN235UT106 Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the HSMP-389F-TR2G is determined by the following critical parameters:

Package Compatibility: Both the main part and substitute must use SC-70/SOT-323 package format to ensure mechanical and electrical compatibility with existing PCB layouts.

Diode Configuration: The 1 Pair Common Cathode configuration must be maintained to preserve circuit functionality and pin assignments.

Electrical Performance Window: Substitute parts must operate within the application's voltage and current requirements. The HSMP-389F-TR2G operates at 100V peak reverse voltage with 1A maximum current. Substitute components with lower voltage ratings (such as 35V) are acceptable only when the application circuit operates within the substitute's electrical limits.

Frequency Characteristics: Capacitance and resistance parameters at RF frequencies (1MHz and 100MHz respectively) define the diode's switching performance. Substitutes with different capacitance and resistance values will exhibit different RF characteristics and must be evaluated for the specific application frequency range.

Thermal Rating: Operating temperature range affects component reliability in the target application environment.

Parameter Comparison

Engineering Selection Recommendations

The DAN235UT106 from Rohm Semiconductor is listed as a manufacturer-recommended substitute for the HSMP-389F-TR2G. Both components share the same package format (SC-70/SOT-323) and 1 Pair Common Cathode configuration, ensuring mechanical and pin-level compatibility.

The DAN235UT106 is currently in active production status, providing supply chain continuity for the obsolete HSMP-389F-TR2G. Both parts maintain MSL 1 (Unlimited) moisture sensitivity rating and REACH compliance status.

Key differences exist in electrical specifications: the DAN235UT106 has a lower peak reverse voltage rating (35V versus 100V) and higher capacitance (1.2pF versus 0.3pF at comparable conditions). The substitute exhibits lower forward resistance (900mOhm versus 2.5Ohm) and operates at a lower maximum junction temperature (125°C versus 150°C).

Selection of the DAN235UT106 requires verification that the application circuit operates within the 35V peak reverse voltage limit and that the higher capacitance and lower resistance characteristics are compatible with the intended RF frequency and switching performance requirements.

Frequently Asked Questions (FAQ)

Q: Can the DAN235UT106 be used as a direct replacement for the HSMP-389F-TR2G?

A: Both components share identical package format (SC-70/SOT-323) and diode configuration (1 Pair Common Cathode), enabling mechanical and pin-level compatibility. Electrical compatibility depends on whether the application circuit operates within the DAN235UT106's 35V peak reverse voltage specification and accepts the higher capacitance and lower resistance characteristics.

Q: What are the main electrical differences between these parts?

A: The HSMP-389F-TR2G operates at 100V peak reverse voltage with 0.3pF capacitance and 2.5Ohm resistance. The DAN235UT106 operates at 35V peak reverse voltage with 1.2pF capacitance and 900mOhm resistance. These differences affect voltage handling capability and RF switching performance.

Q: Are both parts available in the same package?

A: Yes. Both the HSMP-389F-TR2G and DAN235UT106 use the SC-70/SOT-323 package format, ensuring identical PCB footprint and land pattern compatibility.

Q: What is the impact of the lower operating temperature rating on the DAN235UT106?

A: The DAN235UT106 has a maximum junction temperature of 125°C compared to 150°C for the HSMP-389F-TR2G. Applications requiring operation above 125°C junction temperature cannot use the DAN235UT106.

Q: How do the capacitance differences affect circuit performance?

A: The DAN235UT106 exhibits 4 times higher capacitance (1.2pF versus 0.3pF) at comparable measurement conditions. This higher capacitance affects RF switching speed and frequency response characteristics. Applications sensitive to capacitance values must evaluate compatibility with the substitute's specifications.

Q: Are there compliance or supply chain advantages to using the DAN235UT106?

A: The DAN235UT106 is in active production status, whereas the HSMP-389F-TR2G is obsolete. Both parts maintain identical MSL 1 (Unlimited) moisture sensitivity and REACH compliance status. The active production status of the DAN235UT106 provides improved long-term supply availability.