HSMP-386C-TR1 Equivalent & Substitute Parts

Part Overview

The HSMP-386C-TR1 is an RF PIN diode manufactured by Broadcom Limited, designed for RF switching and attenuation applications. It features a 50V peak reverse voltage rating and 1A maximum current capability in a compact SC-70/SOT-323 package. The part is classified as obsolete, making identification of suitable substitute components essential for ongoing design support and procurement continuity.

Substiute Parts

HSMP-386C-TR1
Broadcom LimitedIn Stock: 824HSMP-386C-TR1 Datasheet
HSMP-386C-TR1
Current Part
RN779FFHT106
Rohm SemiconductorIn Stock: 4199RN779FFHT106 Datasheet
RN779FFHT106
MFR Recommended

Key Parameters

Parameter Value
Diode Type PIN - 1 Pair Series Connection
Voltage - Peak Reverse (Max) 50V
Current - Max 1 A
Capacitance @ Vr, F 0.2pF @ 50V, 1MHz
Resistance @ If, F 1.5Ohm @ 100mA, 100MHz
Operating Temperature 150°C (TJ)
Package / Case SC-70, SOT-323
Product Status Obsolete
RoHS Status RoHS non-compliant

Substitute Part Grouping Explanation

Substitution eligibility for the HSMP-386C-TR1 is determined by the following critical parameters:

  • Diode Type: PIN - 1 Pair Series Connection (functional topology requirement)
  • Voltage - Peak Reverse (Max): 50V minimum (electrical stress rating)
  • Package / Case: SC-70/SOT-323 (physical and thermal compatibility)
  • Operating Temperature: 150°C (TJ) maximum (thermal envelope)

The RN779FFHT106 from Rohm Semiconductor qualifies as a substitute based on matching these core parameters. While secondary electrical characteristics such as capacitance and resistance differ, they remain within acceptable operational ranges for RF PIN diode applications where the primary function is RF switching and signal control.

Parameter Comparison

Parameter HSMP-386C-TR1 (Broadcom) RN779FFHT106 (Rohm)
Diode Type PIN - 1 Pair Series Connection PIN - 1 Pair Series Connection
Voltage - Peak Reverse (Max) 50V 50V
Current - Max 1 A 50 mA
Capacitance @ Vr, F 0.2pF @ 50V, 1MHz 0.9pF @ 35V, 1MHz
Resistance @ If, F 1.5Ohm @ 100mA, 100MHz 7Ohm @ 10mA, 100MHz
Operating Temperature 150°C (TJ) 150°C (TJ)
Package / Case SC-70, SOT-323 SC-70, SOT-323
Product Status Obsolete Active
RoHS Status RoHS non-compliant ROHS3 Compliant

Engineering Selection Recommendations

The RN779FFHT106 is an active product with ROHS3 compliance and AEC-Q101 automotive qualification, providing regulatory and supply chain advantages over the obsolete HSMP-386C-TR1. The substitute maintains identical voltage and temperature ratings with compatible packaging.

Current rating differences (1A vs. 50mA) and secondary electrical characteristics (capacitance and resistance) must be evaluated against specific circuit requirements. Applications requiring the full 1A current capability of the original part may require circuit redesign or alternative component selection.

Frequently Asked Questions (FAQ)

Q: Can the RN779FFHT106 directly replace the HSMP-386C-TR1 in existing designs?

A: Physical and thermal compatibility is confirmed through matching SC-70/SOT-323 packaging and 150°C operating temperature ratings. Electrical compatibility depends on circuit current requirements and RF performance specifications. The 50mA maximum current rating of the RN779FFHT106 is lower than the 1A rating of the HSMP-386C-TR1.

Q: What are the key differences between these parts?

A: The primary differences are product status (active vs. obsolete), RoHS compliance (ROHS3 vs. non-compliant), and electrical characteristics including current rating, capacitance, and resistance. Both parts share identical diode topology, voltage rating, temperature rating, and package type.

Q: Is the RN779FFHT106 suitable for high-current RF switching applications?

A: The RN779FFHT106 is rated for 50mA maximum current. Applications requiring 1A operation require evaluation of alternative components or circuit modification.

Q: Are there packaging or moisture sensitivity concerns with substitution?

A: Both parts feature SC-70/SOT-323 packaging with MSL 1 (Unlimited) moisture sensitivity rating, eliminating packaging-related substitution barriers.

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