HSMP-3830-TR1G RF PIN Diode Equivalent & Substitute Parts

Part Overview

The HSMP-3830-TR1G is an RF PIN diode manufactured by Broadcom Limited, designed for RF switching and attenuation applications. This single PIN diode operates at 200V peak reverse voltage with 250 mW power dissipation in a compact SOT-23-3 surface-mount package. The part is classified as obsolete, making identification of functionally equivalent substitutes necessary for ongoing design support and procurement continuity.

Key Parameters

Parameter	Value
Diode Type	PIN - Single
Voltage - Peak Reverse (Max)	200V
Current - Max	1 A
Power Dissipation (Max)	250 mW
Capacitance @ Vr, F	0.3pF @ 50V, 1MHz
Resistance @ If, F	1.5Ohm @ 100mA, 100MHz
Package / Case	TO-236-3, SC-59, SOT-23-3
Operating Temperature	150°C (TJ)
Product Status	Obsolete

Substitute Part Grouping Explanation

Substitution for the HSMP-3830-TR1G is determined by strict equivalence across the following electrical and mechanical parameters:

Diode Type: PIN - Single configuration
Voltage - Peak Reverse (Max): 200V minimum
Resistance @ If, F: 1.5Ohm @ 100mA, 100MHz
Package compatibility: SOT-23-3 form factor or equivalent footprint
Power Dissipation: Minimum 250 mW

Two substitute parts meet these criteria with varying performance enhancements and package options. The SMP1302-001LF maintains identical packaging and electrical characteristics within the SOT-23-3 envelope. The SMP1302-085LF offers enhanced power dissipation (3 W) and current handling (1.5 A) in a 3-QFN package, suitable for applications requiring higher thermal performance.

Parameter Comparison

Parameter	HSMP-3830-TR1G (Main)	SMP1302-001LF (Substitute)	SMP1302-085LF (Substitute)
Manufacturer	Broadcom Limited	Skyworks Solutions Inc.	Skyworks Solutions Inc.
Diode Type	PIN - Single	PIN - Single	PIN - Single
Voltage - Peak Reverse (Max)	200V	200V	200V
Current - Max	1 A	Not specified	1.5 A
Power Dissipation (Max)	250 mW	250 mW	3 W
Capacitance @ Vr, F	0.3pF @ 50V, 1MHz	0.3pF @ 30V, 1MHz	0.35pF @ 30V, 1MHz
Resistance @ If, F	1.5Ohm @ 100mA, 100MHz	1.5Ohm @ 100mA, 100MHz	1.5Ohm @ 100mA, 100MHz
Package / Case	TO-236-3, SC-59, SOT-23-3	TO-236-3, SC-59, SOT-23-3	2-VDFN Exposed Pad, 3-QFN (2x2)
Operating Temperature	150°C (TJ)	-65°C ~ 150°C (TA)	-40°C ~ 150°C (TA)
Product Status	Obsolete	Obsolete	Active
RoHS Status	Not specified	ROHS3 Compliant	ROHS3 Compliant
Moisture Sensitivity Level (MSL)	1 (Unlimited)	1 (Unlimited)	1 (Unlimited)

Engineering Selection Recommendations

SMP1302-001LF provides direct functional equivalence to the HSMP-3830-TR1G with identical SOT-23-3 packaging and electrical performance. This substitute maintains the same 250 mW power dissipation and 1.5Ohm forward resistance. The part is classified as obsolete but carries ROHS3 compliance certification. Selection of this substitute is appropriate for applications requiring pin-for-pin compatibility and existing PCB layouts designed for SOT-23-3 packages.

SMP1302-085LF represents an enhanced alternative with active product status and ROHS3 compliance. This part increases power dissipation to 3 W and maximum current to 1.5 A, accommodating higher thermal and current demands. The 3-QFN (2x2) package requires PCB layout modification but provides superior thermal performance through an exposed pad design. This substitute is suitable for new designs or redesigns where enhanced thermal management is beneficial.

Both substitutes maintain the critical 200V peak reverse voltage and 1.5Ohm forward resistance specifications required for RF switching applications. Selection between them depends on package constraints and thermal requirements of the target application.

Frequently Asked Questions (FAQ)

Q: Can SMP1302-001LF be used as a direct replacement for HSMP-3830-TR1G without PCB modification?

A: Yes. The SMP1302-001LF maintains identical SOT-23-3 packaging, pin configuration, and electrical characteristics. No PCB layout changes are required for this substitution.

Q: What are the key differences between SMP1302-001LF and SMP1302-085LF?

A: The primary differences are package type and power handling. SMP1302-001LF uses SOT-23-3 packaging with 250 mW dissipation, matching the original part. SMP1302-085LF uses 3-QFN (2x2) packaging with 3 W dissipation and 1.5 A maximum current. Both maintain identical forward resistance and peak reverse voltage specifications.

Q: Is PCB redesign necessary to use SMP1302-085LF?

A: Yes. The 3-QFN (2x2) package footprint differs from the SOT-23-3 package of the original part. PCB layout modification is required, including trace routing and thermal pad design for the exposed pad feature.

Q: Do both substitutes meet RoHS compliance requirements?

A: SMP1302-001LF and SMP1302-085LF are both ROHS3 compliant. The original HSMP-3830-TR1G does not specify RoHS status.

Q: What is the operating temperature range difference between substitutes?

A: HSMP-3830-TR1G specifies 150°C junction temperature (TJ). SMP1302-001LF operates from -65°C to 150°C ambient (TA). SMP1302-085LF operates from -40°C to 150°C ambient (TA). Verify ambient temperature requirements for your application.

Q: Are there inventory considerations for these substitutes?

A: SMP1302-001LF is obsolete with 29,300 units in stock. SMP1302-085LF is active with 1,437 units in stock. Long-term availability is more assured with the active SMP1302-085LF.

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