HSEC8-113-01-S-DV-A-L2-K Equivalent & Substitute Parts

Part Overview

The HSEC8-113-01-S-DV-A-L2-K is a 26-position female card edge connector from Samtec Inc.'s Edge Rate™ HSEC8 series. This dual-edge connector features a 0.031" (0.80mm) pitch and is designed for surface mount applications with solder termination. The connector is currently in active production status and maintains full ROHS3 compliance with MSL Level 1 rating, making it suitable for applications requiring high-reliability interconnection across dual card edges. Substitute parts are identified to address packaging format requirements while maintaining identical electrical and mechanical specifications.

Substiute Parts

HSEC8-113-01-S-DV-A-L2-K
Samtec Inc.In Stock: 1089HSEC8-113-01-S-DV-A-L2-K Datasheet
HSEC8-113-01-S-DV-A-L2-K
Current Part
HSEC8-113-01-S-DV-A-L2-K-TR
Samtec Inc.In Stock: 1872HSEC8-113-01-S-DV-A-L2-K-TR Datasheet
HSEC8-113-01-S-DV-A-L2-K-TR
MFR Recommended

Key Parameters

Parameter Specification
Manufacturer Part Number HSEC8-113-01-S-DV-A-L2-K
Manufacturer Samtec Inc.
Series Edge Rate™ HSEC8
Number of Positions 26 (13 per row, 2 rows)
Pitch 0.031" (0.80mm)
Card Thickness 0.062" (1.57mm)
Gender Female
Card Type Non Specified - Dual Edge
Contact Material Beryllium Copper
Contact Finish Gold (30.0µin / 0.76µm)
Mounting Type Surface Mount
Termination Solder
Operating Temperature -55°C to 125°C
Insulation Material Liquid Crystal Polymer (LCP)
RoHS Status ROHS3 Compliant
MSL Rating 1 (Unlimited)
Product Status Active

Substitute Part Grouping Explanation

Substitution for the HSEC8-113-01-S-DV-A-L2-K is determined by strict equivalence across all electrical and mechanical parameters. The primary substitute differs only in packaging format, transitioning from Tray packaging to Tape & Reel (TR) format. This substitution is valid because the following critical parameters remain identical:

  • Number of positions: 26
  • Pitch: 0.031" (0.80mm)
  • Card thickness: 0.062" (1.57mm)
  • Contact material: Beryllium Copper
  • Contact finish: Gold at 30.0µin thickness
  • Mounting type: Surface Mount
  • Termination method: Solder
  • Operating temperature range: -55°C to 125°C
  • Insulation material: Liquid Crystal Polymer (LCP)
  • RoHS and MSL compliance levels

The packaging format change from Tray to Tape & Reel does not affect connector functionality, electrical performance, or mechanical compatibility. This substitution accommodates different procurement and assembly workflows while maintaining full specification equivalence.

Parameter Comparison

Parameter HSEC8-113-01-S-DV-A-L2-K (Tray) HSEC8-113-01-S-DV-A-L2-K-TR (Tape & Reel)
Manufacturer Samtec Inc. Samtec Inc.
Series Edge Rate™ HSEC8 Edge Rate™ HSEC8
Number of Positions 26 26
Pitch 0.031" (0.80mm) 0.031" (0.80mm)
Card Thickness 0.062" (1.57mm) 0.062" (1.57mm)
Gender Female Female
Contact Material Beryllium Copper Beryllium Copper
Contact Finish Gold (30.0µin) Gold (30.0µin)
Mounting Type Surface Mount Surface Mount
Termination Solder Solder
Operating Temperature -55°C to 125°C -55°C to 125°C
Insulation Material Liquid Crystal Polymer (LCP) Liquid Crystal Polymer (LCP)
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited)
Product Status Active Active
Packaging Format Tray Tape & Reel (TR)

Engineering Selection Recommendations

Both the HSEC8-113-01-S-DV-A-L2-K and HSEC8-113-01-S-DV-A-L2-K-TR maintain active product status with full ROHS3 compliance and MSL Level 1 rating. Selection between these parts should be based on procurement and assembly requirements:

The Tray-packaged variant (HSEC8-113-01-S-DV-A-L2-K) is appropriate for lower-volume applications, manual assembly processes, or situations where individual component handling is required.

The Tape & Reel variant (HSEC8-113-01-S-DV-A-L2-K-TR) is suitable for high-volume production environments utilizing automated pick-and-place assembly equipment. This format provides improved handling efficiency and reduced material waste in manufacturing operations.

Both variants deliver identical electrical performance, mechanical compatibility, and environmental specifications. The choice between packaging formats does not impact connector functionality, reliability, or compliance certifications.

Frequently Asked Questions (FAQ)

Q: Are the Tray and Tape & Reel versions electrically identical?

A: Yes. Both HSEC8-113-01-S-DV-A-L2-K and HSEC8-113-01-S-DV-A-L2-K-TR are electrically and mechanically identical. The only difference is the packaging format used for shipment and handling.

Q: Can I use the Tape & Reel version in place of the Tray version?

A: Yes. The Tape & Reel variant is a direct substitute. All electrical specifications, mechanical dimensions, contact materials, and environmental ratings are identical. The substitution is valid for any application using the Tray version.

Q: What is the difference between Tray and Tape & Reel packaging?

A: Tray packaging presents individual components in a plastic tray suitable for manual handling and lower-volume assembly. Tape & Reel packaging winds components onto a continuous tape on a reel, optimized for automated assembly equipment and high-volume production.

Q: Do both versions have the same compliance certifications?

A: Yes. Both variants are ROHS3 compliant with MSL Level 1 rating. Compliance certifications and environmental specifications are identical regardless of packaging format.

Q: What is the operating temperature range for this connector?

A: The operating temperature range is -55°C to 125°C for both variants.

Q: Are there any inventory differences between the two versions?

A: Inventory levels may vary. The Tray version currently has 1000 pieces in stock, while the Tape & Reel version has 1803 pieces available. Verify current availability with your supplier for your specific procurement timeline.

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