HS3M Equivalent & Substitute Parts

Part Overview

The HS3M is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 1000 V DC reverse voltage and 3 A average rectified current in a Surface Mount DO-214AB (SMC) package. This component is classified as a fast recovery diode with a reverse recovery time of 75 ns, suitable for standard rectification applications requiring moderate current handling and high voltage blocking capability. The part maintains Active product status with full RoHS3 compliance and unlimited moisture sensitivity rating (MSL 1).

Equivalent and substitute parts are identified to provide design flexibility, accommodate supply chain variations, and support component procurement strategies while maintaining electrical and mechanical compatibility within specified parameter tolerances.

Substiute Parts

HS3M

Taiwan Semiconductor CorporationIn Stock: 30168HS3M Datasheet

Current PartRFQ

HS3M

SURGEIn Stock: 30151HS3M Datasheet

DirectRFQ

UF3M_R1_00001

Panjit International Inc.In Stock: 1907UF3M_R1_00001 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the HS3M are identified based on strict electrical and mechanical parameter matching within the rectifier diode category. The substitution logic is based on the following critical parameters:

Electrical Compatibility Criteria:

• Voltage - DC Reverse (Vr) Maximum: 1000 V (exact match required)
• Current - Average Rectified (Io): 3 A (exact match required)
• Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io) (required)
• Operating Temperature Range - Junction: -55°C to 150°C (exact match required)

Mechanical Compatibility Criteria:

• Package / Case: DO-214AB, SMC (exact match required)
• Mounting Type: Surface Mount (exact match required)

Compliance Criteria:

• RoHS Status: ROHS3 Compliant (required)
• Moisture Sensitivity Level (MSL): 1 (Unlimited) (required)

Parts meeting all electrical, mechanical, and compliance criteria are classified as direct substitutes. Variations in secondary parameters such as reverse recovery time (trr), reverse leakage current, and capacitance do not disqualify substitution when primary parameters align within specification.

Parameter Comparison

Engineering Selection Recommendations

Direct Substitutes (Electrical and Mechanical Equivalence):

Both HS3M (SURGE) and UF3M_R1_00001 (Panjit International Inc.) meet the critical electrical and mechanical parameters required for substitution with the primary HS3M (Taiwan Semiconductor Corporation) component. All three parts share identical voltage ratings (1000 V), current ratings (3 A), speed classification (Fast Recovery ≤ 500ns), operating temperature range (-55°C to 150°C), package type (DO-214AB, SMC), and mounting configuration (Surface Mount).

Compliance Alignment:

All substitute parts maintain ROHS3 compliance and MSL 1 (Unlimited) moisture sensitivity rating, ensuring compatibility with standard manufacturing and storage protocols. The primary HS3M and UF3M_R1_00001 both carry EAR99 ECCN classification and REACH Unaffected status. The SURGE variant lists ECCN as 3A001 and REACH status as Vendor Undefined; these differences do not affect electrical substitution but may require verification for export or regulatory documentation purposes.

Secondary Parameter Variations:

The UF3M_R1_00001 exhibits a reverse recovery time of 100 ns compared to 75 ns for the primary HS3M and SURGE variant. This 25 ns difference remains within fast recovery diode classification and does not compromise functional compatibility. The UF3M_R1_00001 demonstrates lower reverse leakage current (1 µA versus 10 µA) and slightly higher capacitance (63 pF versus 50 pF), representing improved performance characteristics in these secondary parameters.

Packaging and Inventory Considerations:

The primary HS3M and UF3M_R1_00001 are supplied in Tape & Reel (TR) packaging, while the SURGE variant is supplied in Bag packaging. Packaging selection depends on assembly process requirements and handling procedures. Inventory levels show 30100 units available for both HS3M variants and 1850 units for UF3M_R1_00001, supporting procurement flexibility based on supply chain requirements.

Frequently Asked Questions (FAQ)

Q: Can the HS3M (SURGE) be used as a direct replacement for the HS3M (Taiwan Semiconductor Corporation)?

A: Yes. Both parts share identical electrical specifications (1000 V, 3 A, 75 ns reverse recovery time), mechanical packaging (DO-214AB, SMC, Surface Mount), and compliance certifications (ROHS3, MSL 1). The primary difference is packaging format (Bag versus Tape & Reel) and regulatory classification documentation.

Q: Is the UF3M_R1_00001 (Panjit) electrically equivalent to the HS3M?

A: Yes. The UF3M_R1_00001 meets all critical electrical parameters: 1000 V reverse voltage, 3 A average rectified current, fast recovery speed classification, and -55°C to 150°C operating temperature range. The reverse recovery time of 100 ns remains within fast recovery diode specifications. All mechanical and compliance requirements are satisfied.

Q: What is the significance of the 25 ns difference in reverse recovery time between HS3M (75 ns) and UF3M_R1_00001 (100 ns)?

A: Both parts are classified as fast recovery diodes with reverse recovery time ≤ 500 ns. The 25 ns difference represents a secondary parameter variation and does not affect functional compatibility or circuit performance in standard rectification applications. Selection between these parts depends on application-specific switching speed requirements.

Q: Does the lower reverse leakage current of UF3M_R1_00001 (1 µA) provide an advantage over HS3M (10 µA)?

A: The UF3M_R1_00001 exhibits improved reverse leakage characteristics, which may provide benefits in high-impedance or low-current applications. However, both specifications are within acceptable ranges for general-purpose rectification. Selection should be based on specific circuit requirements and application sensitivity to leakage current.

Q: Are there packaging compatibility considerations when substituting between Tape & Reel and Bag formats?

A: Packaging format selection depends on assembly process capabilities. Tape & Reel (TR) packaging is optimized for automated pick-and-place assembly, while Bag packaging requires manual handling or alternative feeding systems. Both formats contain identical components; selection is determined by manufacturing equipment and process requirements.

Q: Do all substitute parts meet the same RoHS and moisture sensitivity requirements?

A: Yes. All three parts (HS3M from Taiwan Semiconductor, HS3M from SURGE, and UF3M_R1_00001 from Panjit) are ROHS3 compliant and carry MSL 1 (Unlimited) moisture sensitivity rating, ensuring compatibility with standard manufacturing, storage, and handling protocols.

Q: What inventory levels are available for each substitute part?

A: The primary HS3M (Taiwan Semiconductor) and HS3M (SURGE) each have 30100 units in stock. The UF3M_R1_00001 (Panjit) has 1850 units available. Inventory levels support procurement decisions based on supply chain requirements and lead time considerations.

Q: Can the HS3M be used in applications requiring the UF3M_R1_00001 specifications?

A: Yes. The HS3M meets or exceeds the electrical and mechanical requirements of the UF3M_R1_00001. The HS3M provides identical voltage and current ratings, faster reverse recovery time (75 ns versus 100 ns), and equivalent operating temperature range. Substitution is electrically valid.