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HS3104-ML1 Equivalent & Substitute Parts
Part Overview
The HS3104-ML1 is a humidity and temperature sensor module manufactured by Renesas Electronics Corporation. This integrated circuit module combines dual sensing capabilities with I2C digital output, designed for applications requiring simultaneous environmental monitoring across 0–100% RH and -40°C to 125°C operating ranges. The HS3104-ML1 is classified as an obsolete product, necessitating identification of active equivalent alternatives for new designs and ongoing production requirements. The part features through-hole mounting in a 4-SIP module package with ±3.5% RH accuracy and 6-second response time.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Manufacturer Part Number | HS3104-ML1 |
| Manufacturer | Renesas Electronics Corporation |
| Series | HS310x-ML1 |
| Product Status | Obsolete |
| Sensor Type | Humidity, Temperature |
| Humidity Range | 0–100% RH |
| Output Type | I2C |
| Output Resolution | 14-bit |
| Accuracy | ±3.5% RH |
| Response Time | 6 s |
| Voltage Supply Range | 2.3V–5.5V |
| Operating Temperature | -40°C–125°C |
| Mounting Type | Through Hole |
| Package / Case | 4-SIP Module |
Substitute Part Grouping Explanation
Substitution eligibility for the HS3104-ML1 is determined by the following critical parameters:
Functional Compatibility Parameters:
- Sensor Type: Humidity and Temperature dual sensing
- Output Type: I2C digital interface
- Output Resolution: 14-bit
- Humidity Range: 0–100% RH
- Voltage Supply Range: 2.3V–5.5V
- Operating Temperature Range: -40°C–125°C
- Response Time: 6 seconds
Acceptable Variation Parameters:
- Accuracy: ±3.5% RH or better (lower tolerance values are acceptable)
- Mounting Type: Through Hole or Surface Mount (design-dependent)
- Package / Case: Different package types permitted if electrical and functional specifications align
The HS3103-ML1 qualifies as a substitute part within the HS310x-ML1 series. Both parts share identical functional specifications for sensor type, output interface, resolution, humidity range, supply voltage, operating temperature, and response time. The HS3103-ML1 provides improved accuracy (±2.5% RH versus ±3.5% RH) and active product status, offsetting the mounting type and package differences.
Parameter Comparison
| Parameter | HS3104-ML1 (Main Part) | HS3103-ML1 (Substitute) | Compatibility |
|---|---|---|---|
| Manufacturer | Renesas Electronics Corporation | Renesas Electronics Corporation | Identical |
| Series | HS310x-ML1 | HS310x-ML1 | Identical |
| Product Status | Obsolete | Active | Substitute is active |
| Sensor Type | Humidity, Temperature | Humidity, Temperature | Identical |
| Humidity Range | 0–100% RH | 0–100% RH | Identical |
| Output Type | I2C | I2C | Identical |
| Output Resolution | 14-bit | 14-bit | Identical |
| Accuracy | ±3.5% RH | ±2.5% RH | Substitute is superior |
| Response Time | 6 s | 6 s | Identical |
| Voltage Supply Range | 2.3V–5.5V | 2.3V–5.5V | Identical |
| Operating Temperature | -40°C–125°C | -40°C–125°C | Identical |
| Mounting Type | Through Hole | Surface Mount | Different (design-dependent) |
| Package / Case | 4-SIP Module | 6-VDFN | Different (design-dependent) |
Engineering Selection Recommendations
The HS3103-ML1 is the designated manufacturer-recommended substitute for the obsolete HS3104-ML1. Selection of the HS3103-ML1 is appropriate for the following conditions:
Product Lifecycle Considerations: The HS3104-ML1 carries obsolete status, indicating discontinued manufacturing and limited long-term availability. The HS3103-ML1 maintains active product status with confirmed inventory (744 pieces in stock), ensuring supply chain continuity and future component availability.
Functional Equivalence: Both parts operate within identical electrical and functional parameters across all critical specifications: I2C interface, 14-bit resolution, 0–100% RH humidity measurement, 2.3V–5.5V supply voltage, -40°C–125°C operating temperature, and 6-second response time. No functional degradation occurs with substitution.
Performance Enhancement: The HS3103-ML1 provides improved measurement accuracy at ±2.5% RH compared to the HS3104-ML1 at ±3.5% RH. This represents a 29% reduction in humidity measurement uncertainty, beneficial for applications requiring tighter environmental control.
Design Integration Requirements: Substitution requires evaluation of mounting and packaging constraints. The HS3104-ML1 uses through-hole mounting (4-SIP), while the HS3103-ML1 uses surface-mount technology (6-VDFN / 6-LGA 3x2.41). PCB layout, assembly process, and mechanical integration must accommodate these differences.
Frequently Asked Questions (FAQ)
Q: Can the HS3103-ML1 directly replace the HS3104-ML1 without circuit modifications?
A: Electrical substitution is direct. Both parts share identical I2C interface specifications, supply voltage range (2.3V–5.5V), and output resolution (14-bit). No circuit modifications are required for I2C communication or power supply. However, PCB layout changes are necessary due to different mounting types (through-hole versus surface-mount) and package geometries (4-SIP versus 6-VDFN).
Q: What are the key differences between these parts?
A: The primary differences are: (1) Product Status—HS3104-ML1 is obsolete; HS3103-ML1 is active; (2) Accuracy—HS3104-ML1 is ±3.5% RH; HS3103-ML1 is ±2.5% RH; (3) Mounting—HS3104-ML1 is through-hole; HS3103-ML1 is surface-mount; (4) Package—HS3104-ML1 is 4-SIP; HS3103-ML1 is 6-VDFN. All other specifications are identical.
Q: Is the improved accuracy of the HS3103-ML1 significant for my application?
A: The HS3103-ML1 provides ±2.5% RH accuracy versus ±3.5% RH for the HS3104-ML1. This 1% RH improvement represents a 29% reduction in maximum measurement error. Significance depends on application requirements. Applications with tight humidity control specifications benefit from this improvement; applications with loose tolerances experience no practical difference.
Q: What is the impact of switching from through-hole to surface-mount packaging?
A: Through-hole mounting (HS3104-ML1) uses pins inserted into PCB holes and soldered on the reverse side, suitable for manual assembly and prototyping. Surface-mount (HS3103-ML1) uses solder pads on the PCB surface, requiring automated pick-and-place assembly and reflow soldering. This affects manufacturing process, PCB design, assembly equipment, and production volume economics. Evaluate manufacturing capabilities before substitution.
Q: Are there any I2C protocol differences between these parts?
A: No. Both parts implement identical I2C digital output with 14-bit resolution. I2C bus timing, addressing, and data format are equivalent. Firmware and software interfaces require no modification.
Q: What is the 6-VDFN package specification for the HS3103-ML1?
A: The HS3103-ML1 uses a 6-pin Very Thin Dual Flat No-Lead (VDFN) package, also designated as 6-LGA (Land Grid Array) with dimensions 3mm × 2.41mm. This is a compact surface-mount package with exposed pads on the bottom surface for solder connection. Verify PCB footprint compatibility and reflow soldering parameters with your assembly partner.
Q: Is the HS3103-ML1 available in through-hole configuration?
A: No. The HS3103-ML1 is manufactured exclusively in surface-mount 6-VDFN package. If through-hole mounting is mandatory for your design, the HS3104-ML1 remains the only option within the HS310x-ML1 series, subject to obsolescence constraints and inventory limitations.
Q: What inventory status should I consider for long-term production?
A: The HS3104-ML1 (obsolete) has 724 pieces in current stock. The HS3103-ML1 (active) has 744 pieces in current stock. For ongoing production beyond current inventory, the HS3103-ML1 is the only viable option due to active manufacturing status. Plan design transitions accordingly.
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