HS2FA R3G Equivalent & Substitute Parts

Part Overview

The HS2FA R3G is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 300 V DC reverse voltage and 1.5 A average rectified current in a surface mount DO-214AC (SMA) package. This part is discontinued at DiGi Electronics, necessitating identification of equivalent and substitute components for ongoing design requirements and production needs. Equivalent parts maintain identical electrical and mechanical specifications, while substitute parts offer similar functionality within acceptable parameter variations for the application.

Key Parameters

Parameter	Value	Unit
Voltage - DC Reverse (Vr) (Max)	300	V
Current - Average Rectified (Io)	1.5	A
Voltage - Forward (Vf) (Max) @ If	1	V @ 1.5 A
Speed	Fast Recovery ≤ 500ns, > 200mA (Io)	-
Reverse Recovery Time (trr)	50	ns
Current - Reverse Leakage @ Vr	5	µA @ 300 V
Package / Case	DO-214AC, SMA	-
Mounting Type	Surface Mount	-
Operating Temperature - Junction	-55 to 150	°C
RoHS Status	ROHS3 Compliant	-

Substitute Part Grouping Explanation

Substitution of the HS2FA R3G is determined by matching critical electrical parameters: reverse voltage rating (300 V), average rectified current capacity (1.5 A), forward voltage drop (1 V @ 1.5 A), reverse recovery time (50 ns), and reverse leakage current (5 µA @ 300 V). Package compatibility requires surface mount technology in DO-214AC (SMA) or equivalent form factor. Operating temperature range and RoHS compliance status are secondary considerations for substitution validity.

Substitute parts are classified into two categories:

Parametric Equivalents maintain all critical electrical specifications and package requirements identical to the HS2FA R3G.

Similar Parts offer comparable functionality with acceptable variations in current rating, forward voltage, or reverse recovery time, suitable for applications where the HS2FA R3G specifications exceed minimum requirements.

Parameter Comparison

Parameter	HS2FA R3G (Main)	HS2FA (SURGE)	US2FA (onsemi)	MURA230T3G (onsemi)	UFS130JE3/TR13 (Microchip)
Manufacturer	Taiwan Semiconductor	SURGE	onsemi	onsemi	Microchip Technology
Voltage - DC Reverse (Vr) (Max)	300 V	300 V	300 V	300 V	300 V
Current - Average Rectified (Io)	1.5 A	1.5 A	1.5 A	2 A	1 A
Voltage - Forward (Vf) (Max) @ If	1 V @ 1.5 A	1 V @ 1.5 A	1 V @ 1.5 A	1.3 V @ 2 A	1.1 V @ 1 A
Speed	Fast Recovery ≤ 500ns, > 200mA	Fast Recovery ≤ 500ns, > 200mA	Fast Recovery ≤ 500ns, > 200mA	Fast Recovery ≤ 500ns, > 200mA	Fast Recovery ≤ 500ns, > 200mA
Reverse Recovery Time (trr)	50 ns	50 ns	50 ns	65 ns	50 ns
Current - Reverse Leakage @ Vr	5 µA @ 300 V	5 µA @ 300 V	5 µA @ 300 V	5 µA @ 300 V	10 µA @ 300 V
Package / Case	DO-214AC, SMA	DO-214AC, SMA	DO-214AC, SMA	DO-214AC, SMA	DO-214BA
Operating Temperature - Junction	-55 to 150°C	-55 to 150°C	-55 to 150°C	-65 to 175°C	-55 to 175°C
RoHS Status	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant	ROHS3 Compliant
Product Status	Discontinued	Active	Not For New Designs	Active	Active

Engineering Selection Recommendations

HS2FA (SURGE) is the primary parametric equivalent for HS2FA R3G. This part maintains identical electrical specifications, package configuration, and operating temperature range. Product status is Active, ensuring long-term availability. RoHS3 compliance and MSL 1 rating match the original part. Selection of HS2FA (SURGE) is appropriate for direct replacement in existing designs without circuit modification.

US2FA (onsemi) is a parametric equivalent with identical electrical and mechanical specifications. However, product status is listed as Not For New Designs, indicating onsemi has designated this part for legacy applications only. This part carries AEC-Q101 automotive qualification and is suitable for replacement in existing production where automotive-grade components are required. New design implementations should prioritize HS2FA (SURGE) or MURA230T3G.

MURA230T3G (onsemi) is a similar substitute with higher current rating (2 A versus 1.5 A) and slightly elevated forward voltage (1.3 V @ 2 A versus 1 V @ 1.5 A). Reverse recovery time is 65 ns compared to 50 ns. This part is Active and suitable for applications where the HS2FA R3G current specification exceeds circuit requirements. Extended operating temperature range (-65 to 175°C) provides additional thermal margin. MURA230T3G is recommended for new designs requiring 300 V, 1.5 A to 2 A rectification capability.

UFS130JE3/TR13 (Microchip Technology) is a similar substitute with reduced current rating (1 A versus 1.5 A) and different package form factor (DO-214BA versus DO-214AC). Reverse leakage current is elevated to 10 µA. This part is suitable only for applications where circuit current requirements do not exceed 1 A and PCB layout accommodates DO-214BA package geometry. Selection of UFS130JE3/TR13 requires circuit validation to confirm current margin adequacy.

Frequently Asked Questions (FAQ)

Q: Can HS2FA (SURGE) be used as a direct replacement for HS2FA R3G?

A: Yes. HS2FA (SURGE) is a parametric equivalent with identical voltage rating (300 V), current rating (1.5 A), forward voltage (1 V @ 1.5 A), reverse recovery time (50 ns), and package configuration (DO-214AC, SMA). No circuit modification is required.

Q: What is the difference between HS2FA R3G and US2FA?

A: Electrical specifications are identical. US2FA is manufactured by onsemi and carries AEC-Q101 automotive qualification. US2FA product status is Not For New Designs, restricting its use to legacy applications. HS2FA R3G is discontinued, making US2FA suitable for existing production requiring automotive-grade components.

Q: Is MURA230T3G a suitable replacement for HS2FA R3G?

A: MURA230T3G is a similar substitute, not a parametric equivalent. It provides higher current capacity (2 A versus 1.5 A) and extended temperature range (-65 to 175°C versus -55 to 150°C). Forward voltage is slightly higher (1.3 V @ 2 A). MURA230T3G is suitable for applications where HS2FA R3G current rating exceeds requirements. Circuit validation is not required if the application operates at or below 1.5 A.

Q: Why is UFS130JE3/TR13 listed as a substitute if it has lower current rating?

A: UFS130JE3/TR13 maintains the 300 V reverse voltage rating and fast recovery speed. The 1 A current rating is lower than HS2FA R3G, making it suitable only for applications where circuit current does not exceed 1 A. Package form factor differs (DO-214BA versus DO-214AC), requiring PCB layout verification. This part is included as a substitute for current-limited applications only.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. HS2FA (SURGE), US2FA, MURA230T3G, and UFS130JE3/TR13 are all ROHS3 compliant, matching the environmental compliance status of HS2FA R3G.

Q: What is the difference between DO-214AC and DO-214BA packages?

A: Both are surface mount diode packages with similar footprints. DO-214AC (SMA) is the package used by HS2FA R3G, HS2FA (SURGE), US2FA, and MURA230T3G. DO-214BA is used by UFS130JE3/TR13 and has slightly different lead geometry. PCB layout and assembly equipment compatibility must be confirmed before selecting UFS130JE3/TR13.

Q: Can I use MURA230T3G in a circuit designed for 1.5 A operation?

A: Yes. MURA230T3G is rated for 2 A average rectified current, providing 33% margin above the 1.5 A requirement. Forward voltage is slightly elevated (1.3 V @ 2 A versus 1 V @ 1.5 A), resulting in approximately 0.3 V additional voltage drop. Circuit thermal design must account for this increased dissipation.

Q: Which substitute part is recommended for new designs?

A: MURA230T3G (onsemi) is recommended for new designs. It is Active, provides higher current capacity with thermal margin, and offers extended operating temperature range. HS2FA (SURGE) is recommended for direct replacement in existing production where parametric equivalence is required.

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