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HS25 100R F Equivalent & Substitute Parts
Part Overview
The HS25 100R F is a 100 Ohms ±1% 25W wirewound chassis mount resistor manufactured by Ohmite in the ARCOL HS series. This component is designed for high-power applications requiring precision resistance values with stable performance across operating conditions. The part is currently active in production with 1,068 units in stock. Equivalent and substitute parts are identified to provide procurement flexibility, support supply chain continuity, and accommodate specific application requirements such as packaging format or thermal performance specifications.
Substiute Parts
Key Parameters
| Parameter | Value |
|---|---|
| Resistance | 100 Ohms |
| Tolerance | ±1% |
| Power Rating | 25W |
| Composition | Wirewound |
| Mounting Feature | Flanges |
| Lead Style | Solder Lugs |
| Housing Type | Aluminum |
| RoHS Status | ROHS3 Compliant |
Substitute Part Grouping Explanation
The substitute part 825F100E is qualified as a direct equivalent based on the following critical parameters:
- Electrical Specifications: Identical resistance value (100 Ohms) and tolerance (±1%)
- Power Rating: Matching 25W power dissipation capability
- Construction Type: Wirewound composition with aluminum housing
- Mechanical Interface: Flanged mounting with solder lug termination
- Regulatory Compliance: ROHS3 compliant, REACH unaffected, EAR99 classification
The 825F100E belongs to the Metal-Mite®89 series and is manufactured by Ohmite. This part maintains functional equivalence for applications requiring the specified electrical and mechanical characteristics.
Parameter Comparison
| Parameter | HS25 100R F | 825F100E |
|---|---|---|
| Manufacturer | Ohmite | Ohmite |
| Resistance | 100 Ohms | 100 Ohms |
| Tolerance | ±1% | ±1% |
| Power Rating | 25W | 25W |
| Composition | Wirewound | Wirewound |
| Temperature Coefficient | ±100ppm/°C | ±20ppm/°C |
| Operating Temperature Range | Not specified | -55°C ~ 275°C |
| Housing Type | Aluminum | Aluminum |
| Mounting Feature | Flanges | Flanges |
| Lead Style | Solder Lugs | Solder Lugs |
| Package Type | Axial, Box (Bulk) | Axial, Box (Tray) |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Inventory Status | 1,068 Pcs In Stock | 798 Pcs In Stock |
Engineering Selection Recommendations
Both the HS25 100R F and 825F100E meet ROHS3 compliance requirements and are classified as REACH unaffected components. Selection between these parts should be based on:
- Packaging Requirements: The HS25 100R F is supplied in bulk packaging, while the 825F100E is supplied in tray format. Choose based on assembly process and handling requirements.
- Temperature Coefficient Performance: The 825F100E exhibits superior temperature stability (±20ppm/°C) compared to the HS25 100R F (±100ppm/°C). Applications requiring tighter thermal drift specifications should prioritize the 825F100E.
- Specified Operating Temperature: The 825F100E provides an explicit operating temperature range of -55°C to 275°C. Applications with defined thermal operating windows should reference this specification.
- Inventory Availability: Both parts maintain active production status with adequate stock levels for procurement planning.
Frequently Asked Questions (FAQ)
Q: Can the 825F100E directly replace the HS25 100R F in existing designs?
A: Yes. Both parts share identical electrical specifications (100 Ohms ±1%, 25W), wirewound construction, aluminum housing, and flanged solder lug termination. The primary difference is packaging format (bulk versus tray) and temperature coefficient performance. Physical dimensions differ slightly; verify mounting clearances in your specific application.
Q: What is the significance of the temperature coefficient difference?
A: The HS25 100R F has a temperature coefficient of ±100ppm/°C, while the 825F100E is ±20ppm/°C. This means the 825F100E's resistance value changes less with temperature variations. For precision applications operating across wide temperature ranges, the 825F100E provides superior stability.
Q: Are there packaging considerations when switching between these parts?
A: Yes. The HS25 100R F is supplied in bulk packaging, while the 825F100E uses tray packaging. Bulk packaging is suitable for manual assembly or small-volume production, while tray packaging is optimized for automated pick-and-place assembly. Confirm your assembly process compatibility before substitution.
Q: Do both parts meet current regulatory requirements?
A: Yes. Both the HS25 100R F and 825F100E are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory standards for electronic component procurement.
Q: What are the physical dimension differences?
A: The HS25 100R F measures 1.075" L × 0.559" W (27.30mm × 14.20mm) with a seated height of 0.583" (14.80mm). The 825F100E measures 1.062" L × 1.094" W (26.98mm × 27.79mm) with a seated height of 0.556" (14.12mm). Verify clearances in your PCB layout and enclosure design before substitution.
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