HS1F R3G Equivalent & Substitute Parts

Part Overview

The HS1F R3G is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 300 V DC reverse voltage and 1 A average rectified current in a surface mount DO-214AC (SMA) package. This component is classified as discontinued at DiGi Electronics, necessitating identification of equivalent and substitute parts for ongoing design requirements and procurement needs. Equivalent parts maintain identical electrical and mechanical specifications, while substitute parts provide functional alternatives with minor parameter variations within acceptable engineering tolerances.

Substiute Parts

HS1F R3G

Taiwan Semiconductor CorporationIn Stock: 775HS1F R3G Datasheet

Current PartRFQ

HS1F

SURGEIn Stock: 7885HS1F Datasheet

Parametric EquivalentRFQ

UFS130JE3/TR13

Microchip TechnologyIn Stock: 1125UFS130JE3/TR13 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of rectifier diodes is determined by equivalence in the following critical parameters: maximum reverse voltage (Vr), average rectified current (Io), forward voltage drop (Vf), reverse recovery time (trr), and package compatibility. Parts are grouped into two categories based on these criteria:

Parametric Equivalent (HS1F by SURGE): Maintains identical specifications across all critical electrical parameters and uses the same DO-214AC (SMA) package footprint. This classification indicates direct interchangeability without circuit redesign.

Similar Substitute (UFS130JE3/TR13 by Microchip Technology): Meets the primary voltage and current ratings but differs in forward voltage (1.1 V vs. 1.0 V), reverse leakage current (10 µA vs. 5 µA), and package type (DO-214BA vs. DO-214AC). The extended operating temperature range (-55°C to 175°C vs. -55°C to 150°C) provides additional thermal margin. Package differences require PCB layout verification for mechanical compatibility.

Parameter Comparison

Engineering Selection Recommendations

For Direct Replacement: The HS1F manufactured by SURGE is the primary equivalent for the discontinued HS1F R3G. Both parts are ROHS3 compliant, carry MSL 1 rating, and maintain identical electrical specifications and DO-214AC package geometry. This part is currently active in production with 7800 units in stock, ensuring supply continuity.

For Functional Substitution: The UFS130JE3/TR13 from Microchip Technology is suitable where the application tolerates a 0.1 V increase in forward voltage drop and a 5 µA increase in reverse leakage current. The extended operating temperature range to 175°C provides additional thermal headroom for high-temperature applications. However, the DO-214BA package differs from the DO-214AC footprint and requires PCB layout verification. This part is active with 1064 units in stock.

Compliance Considerations: All three parts maintain ROHS3 compliance and MSL 1 moisture sensitivity ratings. The HS1F by SURGE carries vendor-undefined REACH status, whereas both the original HS1F R3G and UFS130JE3/TR13 are REACH Unaffected. For applications with strict REACH compliance requirements, the Microchip part provides documented compliance assurance.

Frequently Asked Questions (FAQ)

Q: Can the HS1F by SURGE be used as a direct drop-in replacement for the HS1F R3G?

A: Yes. The SURGE HS1F maintains identical electrical specifications (300 V, 1 A, 1 V forward voltage, 50 ns recovery time) and uses the same DO-214AC (SMA) surface mount package. No circuit modifications or PCB layout changes are required.

Q: What are the key differences between the HS1F R3G and the UFS130JE3/TR13?

A: The primary differences are forward voltage (1.0 V vs. 1.1 V), reverse leakage current (5 µA vs. 10 µA), package type (DO-214AC vs. DO-214BA), and maximum operating temperature (150°C vs. 175°C). All three parts share identical reverse voltage, current rating, and recovery time specifications.

Q: Does the package difference between DO-214AC and DO-214BA affect compatibility?

A: Package footprints differ between DO-214AC (SMA) and DO-214BA. While both are surface mount diodes with similar form factors, PCB pad layouts and land patterns are not identical. Physical verification against the PCB design is required before substitution.

Q: What is the impact of the 0.1 V forward voltage difference in the UFS130JE3/TR13?

A: The increased forward voltage drop (1.1 V vs. 1.0 V) results in slightly higher power dissipation in the diode. For a 1 A circuit, this represents an additional 0.1 W of heat generation. Applications with tight thermal budgets or high-frequency switching should evaluate this parameter against circuit requirements.

Q: Are all three parts RoHS compliant?

A: Yes. The HS1F R3G, HS1F by SURGE, and UFS130JE3/TR13 are all ROHS3 compliant. The SURGE part carries vendor-undefined REACH status, while the other two are REACH Unaffected.

Q: Which part should be selected for new designs?

A: For new designs, the HS1F by SURGE is recommended as the primary choice due to complete electrical equivalence, active production status, and high inventory availability (7800 units). The UFS130JE3/TR13 is suitable where extended temperature operation (-55°C to 175°C) is required and package compatibility is confirmed.