HS1B Equivalent & Substitute Parts

Part Overview

The HS1B is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 100 V DC reverse voltage and 1 A average rectified current in a surface mount DO-214AC (SMA) package. This diode is classified as a fast recovery device with a reverse recovery time of 50 ns, suitable for standard rectification applications requiring moderate switching speeds. The part is currently Active in product status with RoHS3 compliance and unlimited moisture sensitivity level (MSL 1).

Equivalent and substitute parts are identified based on matching electrical performance parameters, package compatibility, and operational specifications. Alternative sources become necessary when the primary part experiences supply constraints, discontinuation, or when design flexibility permits selection from multiple qualified manufacturers.

Key Parameters

Parameter	Value	Unit
Voltage - DC Reverse (Vr) (Max)	100	V
Current - Average Rectified (Io)	1	A
Voltage - Forward (Vf) (Max) @ If	1	V @ 1 A
Speed Classification	Fast Recovery ≤ 500ns, > 200mA (Io)	—
Reverse Recovery Time (trr)	50	ns
Current - Reverse Leakage @ Vr	5	µA @ 100 V
Package / Case	DO-214AC, SMA	—
Mounting Type	Surface Mount	—
Operating Temperature - Junction	-55 to 150	°C
RoHS Status	ROHS3 Compliant	—
Moisture Sensitivity Level (MSL)	1 (Unlimited)	—

Substitute Part Grouping Explanation

Substitute parts for the HS1B are qualified based on the following electrical and mechanical criteria:

Primary Matching Criteria:

Voltage - DC Reverse (Vr) (Max): 100 V
Current - Average Rectified (Io): 1 A
Voltage - Forward (Vf) (Max) @ If: 1 V @ 1 A
Speed Classification: Fast Recovery ≤ 500ns, > 200mA (Io)
Package / Case: DO-214AC, SMA
Mounting Type: Surface Mount
Operating Temperature - Junction: -55°C to 150°C
RoHS Status: ROHS3 Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)

Secondary Parameters (Allowable Variation):

Reverse Recovery Time (trr): 35 ns to 50 ns
Current - Reverse Leakage @ Vr: 1 µA to 10 µA @ 100 V
Capacitance @ Vr, F: 15 pF to 20 pF @ 4V, 1MHz

All substitute parts listed maintain identical voltage and current ratings, package configuration, and temperature range. Variations in reverse recovery time and leakage current remain within acceptable engineering tolerances for general-purpose rectification applications. Packaging format (Tape & Reel or Cut Tape) does not affect electrical equivalence but may influence procurement and assembly logistics.

Parameter Comparison

Part Number	Manufacturer	Vr (Max) [V]	Io [A]	Vf (Max) @ If [V]	trr [ns]	Ir @ Vr [µA]	C @ Vr [pF]	Package	Status	Packaging Format
HS1B	Taiwan Semiconductor Corporation	100	1	1 @ 1 A	50	5 @ 100 V	20 @ 4V, 1MHz	DO-214AC, SMA	Active	Tape & Reel (TR)
HS1B R3G	Taiwan Semiconductor Corporation	100	1	1 @ 1 A	50	5 @ 100 V	15 @ 4V, 1MHz	DO-214AC, SMA	Discontinued at DiGi Electronics	Not Specified
US1B R3G	Taiwan Semiconductor Corporation	100	1	1 @ 1 A	50	5 @ 100 V	15 @ 4V, 1MHz	DO-214AC, SMA	Discontinued at DiGi Electronics	Cut Tape (CT)
ES1B-HF	Comchip Technology	100	1	1 @ 1 A	35	5 @ 100 V	15 @ 4V, 1MHz	DO-214AC, SMA	Active	Tape & Reel (TR)
US1B-E3/5AT	Vishay General Semiconductor - Diodes Division	100	1	1 @ 1 A	50	10 @ 100 V	15 @ 4V, 1MHz	DO-214AC, SMA	Active	Tape & Reel (TR)
US1B-E3/61T	Vishay General Semiconductor - Diodes Division	100	1	1 @ 1 A	50	10 @ 100 V	15 @ 4V, 1MHz	DO-214AC, SMA	Active	Tape & Reel (TR)
US1B_R1_00001	Panjit International Inc.	100	1	1 @ 1 A	50	1 @ 100 V	17 @ 4V, 1MHz	DO-214AC, SMA	Active	Tape & Reel (TR)

Engineering Selection Recommendations

Active Status Parts (Recommended for New Designs):

The following substitute parts maintain Active product status and are suitable for new design implementations:

ES1B-HF (Comchip Technology): Active status with improved reverse recovery time of 35 ns, providing faster switching performance compared to the HS1B. Tape & Reel packaging supports high-volume production. RoHS3 compliant.
US1B-E3/5AT (Vishay General Semiconductor - Diodes Division): Active status with extensive inventory availability (6769 pcs). Tape & Reel packaging. RoHS3 and REACH compliant. Reverse leakage current of 10 µA remains within acceptable tolerance.
US1B-E3/61T (Vishay General Semiconductor - Diodes Division): Active status with highest inventory availability (62425 pcs). Tape & Reel packaging. RoHS3 and REACH compliant. Identical electrical specifications to US1B-E3/5AT with superior supply continuity.
US1B_R1_00001 (Panjit International Inc.): Active status with superior reverse leakage current specification of 1 µA @ 100 V, representing the lowest leakage among all listed substitutes. Tape & Reel packaging. RoHS3 and REACH compliant.

Discontinued Parts (Not Recommended for New Designs):

HS1B R3G (Taiwan Semiconductor Corporation): Discontinued at DiGi Electronics. Suitable only for legacy system maintenance or repair applications where original part sourcing is required.
US1B R3G (Taiwan Semiconductor Corporation): Discontinued at DiGi Electronics. Cut Tape packaging format. Suitable only for legacy system maintenance or repair applications.

Compliance Verification:

All listed substitute parts maintain RoHS3 compliance, REACH unaffected status, and MSL 1 (Unlimited) moisture sensitivity level, ensuring compatibility with current manufacturing and environmental regulations.

Frequently Asked Questions (FAQ)

Q: Can I substitute the HS1B with any of the listed equivalent parts without circuit modification?

A: Yes. All listed substitute parts maintain identical voltage ratings (100 V), current ratings (1 A), forward voltage characteristics (1 V @ 1 A), and package configuration (DO-214AC, SMA). No circuit modifications are required for electrical equivalence. Verify PCB footprint compatibility with the DO-214AC (SMA) package specification.

Q: What is the difference between Tape & Reel (TR) and Cut Tape (CT) packaging?

A: Tape & Reel (TR) packaging is supplied on continuous carrier tape wound on reels, suitable for automated pick-and-place assembly equipment. Cut Tape (CT) packaging is supplied as individual segments cut from the carrier tape, typically used for lower-volume manual assembly or prototyping. Both formats contain electrically identical components. Selection depends on assembly process requirements and volume.

Q: Why do some substitute parts have different reverse recovery times (trr)?

A: Reverse recovery time varies by manufacturer design and process technology. The HS1B specifies 50 ns, while ES1B-HF specifies 35 ns. Both values fall within the Fast Recovery classification (≤ 500 ns). Faster recovery times (35 ns) provide improved switching performance and reduced switching losses in high-frequency applications. Slower recovery times (50 ns) are acceptable for standard rectification applications. Selection should be based on circuit switching frequency requirements.

Q: What does reverse leakage current (Ir) represent, and why does it vary among substitutes?

A: Reverse leakage current is the small DC current that flows through the diode when reverse-biased at rated voltage. The HS1B specifies 5 µA @ 100 V. Substitutes range from 1 µA (US1B_R1_00001) to 10 µA (US1B-E3/5AT, US1B-E3/61T). Lower leakage current indicates superior reverse-bias blocking characteristics and reduced power dissipation in standby conditions. All values remain acceptable for general-purpose rectification. Selection should consider power budget and leakage-sensitive applications.

Q: Are all substitute parts RoHS3 compliant?

A: Yes. All listed substitute parts are RoHS3 compliant and MSL 1 (Unlimited), meeting current environmental and manufacturing standards. REACH compliance status is either "REACH Unaffected" or not specified, indicating no regulatory restrictions on use.

Q: Which substitute part offers the best availability?

A: US1B-E3/61T (Vishay General Semiconductor - Diodes Division) offers the highest inventory availability with 62425 pcs in stock, followed by ES1B-HF (Comchip Technology) with 4142 pcs. Both parts are Active status and suitable for immediate procurement.

Q: Can I use discontinued parts (HS1B R3G, US1B R3G) in new designs?

A: No. Discontinued parts are not recommended for new designs due to uncertain long-term availability and potential supply discontinuation. These parts are suitable only for legacy system maintenance, repair, or replacement applications where original part sourcing is required. For new designs, select from Active status substitutes: ES1B-HF, US1B-E3/5AT, US1B-E3/61T, or US1B_R1_00001.

Q: What is the operating temperature range, and are all substitutes identical?

A: All listed parts, including the HS1B and all substitutes, operate across the identical junction temperature range of -55°C to 150°C. This specification is consistent across all manufacturers and part numbers, ensuring thermal compatibility in all operating environments.

Q: How do I verify package compatibility before substitution?

A: All substitute parts use the DO-214AC (SMA) package, identical to the HS1B. Verify that your PCB footprint is designed for DO-214AC (SMA) surface mount package dimensions. Consult the manufacturer's package outline drawing to confirm lead spacing, pad dimensions, and placement requirements. Packaging format (Tape & Reel vs. Cut Tape) does not affect PCB footprint compatibility.

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