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HS1AL RTG Equivalent & Substitute Parts
Part Overview
The HS1AL RTG is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, rated for 50 V DC reverse voltage and 1 A average rectified current in a Sub SMA surface mount package. This component is classified as a fast recovery diode with a reverse recovery time of 50 ns, suitable for standard switching and rectification applications. The part maintains Active product status and is RoHS3 compliant with unlimited moisture sensitivity rating (MSL 1).
Substitute parts are identified when equivalent electrical performance and mechanical compatibility are required due to inventory constraints, supply chain considerations, or packaging format preferences while maintaining identical functional specifications.
Substiute Parts
Key Parameters
| Parameter | Value | Unit |
|---|---|---|
| Voltage - DC Reverse (Vr) Maximum | 50 | V |
| Current - Average Rectified (Io) | 1 | A |
| Voltage - Forward (Vf) Maximum @ If | 950 mV @ 1 A | mV |
| Reverse Recovery Time (trr) | 50 | ns |
| Current - Reverse Leakage @ Vr | 5 | µA @ 50 V |
| Capacitance @ Vr, F | 20 | pF @ 4V, 1MHz |
| Package / Case | DO-219AB | — |
| Mounting Type | Surface Mount | — |
| Operating Temperature - Junction | -55 to 150 | °C |
| Technology | Standard | — |
| Speed Classification | Fast Recovery ≤ 500ns, > 200mA (Io) | — |
Substitute Part Grouping Explanation
Substitution of the HS1AL RTG is determined by strict equivalence across all critical electrical and mechanical parameters. The substitute part HS1AL RVG maintains identical specifications in the following key areas:
- Reverse voltage rating: 50 V DC
- Forward current capacity: 1 A average rectified
- Forward voltage drop: 950 mV maximum at 1 A
- Reverse recovery time: 50 ns
- Reverse leakage current: 5 µA at 50 V
- Junction capacitance: 20 pF at 4 V, 1 MHz
- Package designation: DO-219AB Sub SMA
- Surface mount configuration
- Temperature range: -55°C to 150°C junction
- RoHS3 compliance and MSL 1 rating
The only distinction between the main part and substitute is the packaging format: HS1AL RTG is supplied in standard packaging, while HS1AL RVG is supplied in Cut Tape (CT) format. Both parts share the identical base product number HS1A and maintain equivalent functional performance for all rectification and switching applications.
Parameter Comparison
| Parameter | HS1AL RTG | HS1AL RVG | Match Status |
|---|---|---|---|
| Manufacturer | Taiwan Semiconductor Corporation | Taiwan Semiconductor Corporation | Identical |
| Category | Diodes, Rectifiers | Diodes, Rectifiers | Identical |
| Voltage - DC Reverse (Vr) Maximum | 50 V | 50 V | Identical |
| Current - Average Rectified (Io) | 1 A | 1 A | Identical |
| Voltage - Forward (Vf) Maximum @ If | 950 mV @ 1 A | 950 mV @ 1 A | Identical |
| Reverse Recovery Time (trr) | 50 ns | 50 ns | Identical |
| Current - Reverse Leakage @ Vr | 5 µA @ 50 V | 5 µA @ 50 V | Identical |
| Capacitance @ Vr, F | 20 pF @ 4V, 1MHz | 20 pF @ 4V, 1MHz | Identical |
| Package / Case | DO-219AB | DO-219AB | Identical |
| Mounting Type | Surface Mount | Surface Mount | Identical |
| Operating Temperature - Junction | -55°C to 150°C | -55°C to 150°C | Identical |
| Technology | Standard | Standard | Identical |
| Speed Classification | Fast Recovery ≤ 500ns, > 200mA | Fast Recovery ≤ 500ns, > 200mA | Identical |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant | Identical |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | Identical |
| REACH Status | REACH Unaffected | REACH Unaffected | Identical |
| Packaging Format | Standard | Cut Tape (CT) | Different |
Engineering Selection Recommendations
Both HS1AL RTG and HS1AL RVG are Active products from Taiwan Semiconductor Corporation with full RoHS3 compliance and REACH unaffected status. Selection between these parts is based on packaging and supply requirements rather than electrical performance.
HS1AL RTG is selected when standard packaging format is required for inventory management or when existing supply chain processes specify this packaging configuration.
HS1AL RVG is selected when Cut Tape (CT) packaging format is required for automated assembly processes or when tape-and-reel delivery is specified in procurement requirements.
Both parts are suitable for identical circuit applications with no functional differentiation. The choice between them is determined by downstream assembly and handling requirements, not by electrical or thermal performance characteristics.
Frequently Asked Questions (FAQ)
Q: Can HS1AL RVG be used as a direct replacement for HS1AL RTG in circuit design?
A: Yes. Both parts are electrically and mechanically identical. They share the same DO-219AB Sub SMA package, identical electrical ratings, and equivalent performance specifications. The only difference is the packaging format (Cut Tape versus standard packaging).
Q: What is the difference between HS1AL RTG and HS1AL RVG?
A: The parts are identical in all electrical and mechanical specifications. HS1AL RTG is supplied in standard packaging, while HS1AL RVG is supplied in Cut Tape (CT) format. This distinction affects only the delivery and handling method, not the component itself.
Q: Are both parts suitable for the same operating temperature range?
A: Yes. Both HS1AL RTG and HS1AL RVG operate across the identical junction temperature range of -55°C to 150°C.
Q: Do both parts meet the same compliance standards?
A: Yes. Both parts are RoHS3 compliant, REACH unaffected, and carry MSL 1 (unlimited moisture sensitivity) rating.
Q: Which part should be selected for automated assembly?
A: HS1AL RVG in Cut Tape (CT) format is typically preferred for automated pick-and-place assembly processes. HS1AL RTG in standard packaging may be used when manual assembly or alternative handling methods are employed.
Q: Are the reverse recovery times identical between both parts?
A: Yes. Both HS1AL RTG and HS1AL RVG have a reverse recovery time of 50 ns, classifying them as fast recovery diodes.
Q: Can inventory be interchanged between HS1AL RTG and HS1AL RVG?
A: Interchangeability depends on assembly process requirements. If the assembly process accepts both packaging formats, parts are interchangeable. If the process is configured for a specific packaging format, the corresponding part number must be used.
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