HS1AL R3G Equivalent & Substitute Parts

Part Overview

The HS1AL R3G is a general-purpose rectifier diode manufactured by Taiwan Semiconductor Corporation, classified as a fast recovery diode in the DO-219AB (Sub SMA) surface mount package. This component is rated for 50 V DC reverse voltage and 1 A average rectified current, with a reverse recovery time of 50 ns. The part is currently in active production status with ROHS3 compliance and unlimited moisture sensitivity level (MSL 1).

Substitute parts are identified when equivalent electrical performance and mechanical compatibility are maintained across all critical parameters. Alternative part numbers may be required due to inventory availability, packaging format differences, or supply chain considerations while maintaining identical functional specifications.

Substiute Parts

HS1AL R3G

Taiwan Semiconductor CorporationIn Stock: 864HS1AL R3G Datasheet

Current PartRFQ

HS1AL RVG

Taiwan Semiconductor CorporationIn Stock: 2578HS1AL RVG Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the HS1AL R3G is determined by strict equivalence across the following critical parameters:

• Voltage Rating: DC reverse voltage must equal 50 V maximum
• Current Rating: Average rectified current must equal 1 A
• Forward Voltage Drop: Maximum forward voltage must equal 950 mV at 1 A
• Reverse Recovery Time: Must equal 50 ns
• Reverse Leakage Current: Must equal 5 µA at 50 V
• Junction Capacitance: Must equal 20 pF at 4 V, 1 MHz
• Package Type: Must be DO-219AB (Sub SMA) surface mount
• Operating Temperature Range: Must support -55°C to 150°C junction temperature
• Technology Classification: Must be Standard technology, Fast Recovery speed class

The HS1AL RVG meets all electrical and mechanical equivalence criteria and is classified as a parametric equivalent. The primary distinction is packaging format: HS1AL RVG is supplied in Cut Tape (CT) format, whereas HS1AL R3G packaging format is not specified in the provided data.

Parameter Comparison

Engineering Selection Recommendations

Both HS1AL R3G and HS1AL RVG are active production components manufactured by Taiwan Semiconductor Corporation with identical electrical specifications and mechanical compatibility. Selection between these parts is based on the following factors:

Compliance & Certification: Both parts maintain ROHS3 compliance, REACH unaffected status, and EAR99 export classification. Both carry MSL 1 (unlimited) moisture sensitivity level, indicating no special handling requirements during storage or assembly.

Inventory & Availability: HS1AL RVG is available in higher quantity (2549 pieces) compared to HS1AL R3G (799 pieces). Selection may be driven by supply chain requirements and lead time considerations.

Packaging Format: HS1AL RVG is supplied in Cut Tape (CT) format, which is standard for automated assembly processes. The packaging format of HS1AL R3G is not specified in the provided data. If packaging format compatibility with existing assembly equipment is a requirement, this parameter must be verified against specific manufacturing process requirements.

Functional Equivalence: All electrical parameters, thermal ratings, and performance characteristics are identical. Either part number can be substituted without circuit redesign or performance degradation.

Frequently Asked Questions (FAQ)

Q: Are HS1AL R3G and HS1AL RVG electrically identical?

A: Yes. Both parts share identical electrical specifications including 50 V reverse voltage rating, 1 A average rectified current, 950 mV forward voltage drop at 1 A, 50 ns reverse recovery time, and 5 µA reverse leakage current at 50 V. They are classified as parametric equivalents.

Q: What is the difference between HS1AL R3G and HS1AL RVG?

A: The primary difference is packaging format. HS1AL RVG is supplied in Cut Tape (CT) format. The packaging format for HS1AL R3G is not specified in the provided technical data. All other specifications, including mechanical package type (DO-219AB Sub SMA), are identical.

Q: Can HS1AL RVG be used as a direct replacement for HS1AL R3G in PCB assembly?

A: Direct substitution is possible from an electrical and mechanical standpoint, as both components use the DO-219AB (Sub SMA) surface mount package. However, packaging format compatibility with existing assembly equipment must be confirmed. If HS1AL R3G is supplied in a different tape format or reel configuration, equipment setup may require adjustment.

Q: Do both parts require special handling during storage?

A: No. Both HS1AL R3G and HS1AL RVG carry MSL 1 (Unlimited) moisture sensitivity level, indicating no moisture-sensitive device (MSD) precautions are required. Standard component storage conditions are sufficient.

Q: Are there any compliance or regulatory differences between these parts?

A: No. Both parts are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99 with identical HTSUS code 8541.10.0080. Regulatory and compliance status is identical.

Q: What is the operating temperature range for both parts?

A: Both HS1AL R3G and HS1AL RVG operate across a junction temperature range of -55°C to 150°C, supporting industrial and automotive temperature environments.

Q: Can these parts be used interchangeably in high-speed switching applications?

A: Yes. Both parts are classified as Fast Recovery diodes with 50 ns reverse recovery time, meeting the speed requirements for switching applications with switching frequencies up to the limits defined by the 50 ns trr specification.