HS150 25R F Equivalent & Substitute Parts

Part Overview

The HS150 25R F is a 150-watt wirewound chassis mount resistor manufactured by Ohmite, rated at 25 ohms with ±1% tolerance. This component is designed for high-power applications requiring stable resistance performance in aluminum-housed configurations with flanged mounting. The part is currently in active production status with 1011 units in stock. Substitute parts are identified when equivalent electrical specifications and mechanical compatibility allow direct replacement in circuit designs.

Substiute Parts

HS150 25R F
OhmiteIn Stock: 1084HS150 25R F Datasheet
HS150 25R F
Current Part
HS100 25R F
OhmiteIn Stock: 1018HS100 25R F Datasheet
HS100 25R F
Parametric Equivalent

Key Parameters

Parameter Value
Resistance 25 Ohms
Tolerance ±1%
Power Rating 150W
Composition Wirewound
Temperature Coefficient 100ppm/°C
Housing Type Aluminum
Mounting Feature Flanges
Lead Style Solder Lugs
RoHS Status RoHS Compliant

Substitute Part Grouping Explanation

The HS100 25R F qualifies as a parametric equivalent based on the following matching criteria:

  • Resistance value: 25 Ohms (identical)
  • Tolerance: ±1% (identical)
  • Composition: Wirewound (identical)
  • Temperature Coefficient: ±100ppm/°C (equivalent specification)
  • Housing Type: Aluminum (identical)
  • Mounting Feature: Flanges (identical)
  • Lead Style: Solder Lugs (identical)

The primary difference is the power rating: HS100 25R F is rated at 100W versus the 150W rating of the HS150 25R F. This substitution is valid only in applications where the circuit design power dissipation does not exceed 100 watts.

Parameter Comparison

Parameter HS150 25R F HS100 25R F
Manufacturer Ohmite Ohmite
Resistance 25 Ohms 25 Ohms
Tolerance ±1% ±1%
Power Rating 150W 100W
Composition Wirewound Wirewound
Temperature Coefficient 100ppm/°C ±100ppm/°C
Housing Type Aluminum Aluminum
Mounting Feature Flanges Flanges
Lead Style Solder Lugs Solder Lugs
Size (L x W) 3.846" x 1.870" (97.70mm x 47.50mm) 2.566" x 1.075" (65.20mm x 27.30mm)
Height - Seated (Max) 0.949" (24.10mm) 0.949" (24.10mm)
RoHS Status RoHS Compliant ROHS3 Compliant
Product Status Active Active
Inventory 1011 Pcs 928 Pcs

Engineering Selection Recommendations

Both the HS150 25R F and HS100 25R F are active production components with current RoHS compliance certifications. The HS150 25R F is the primary specification for applications requiring 150-watt power dissipation capacity. The HS100 25R F serves as a substitute only when circuit design power dissipation remains below 100 watts. Physical dimensions differ between the two models; the HS100 25R F occupies less board space while maintaining identical mounting height. Both components feature identical electrical specifications for resistance, tolerance, and temperature coefficient, ensuring functional equivalence within their respective power ratings.

Frequently Asked Questions (FAQ)

Q: Can HS100 25R F replace HS150 25R F in all applications?

A: No. The HS100 25R F is suitable only for applications where power dissipation does not exceed 100 watts. Applications requiring the full 150-watt capacity must use the HS150 25R F.

Q: Are the physical dimensions compatible between these parts?

A: Both parts share identical mounting height (0.949" / 24.10mm) and flanged mounting features. However, the HS100 25R F has smaller length and width dimensions (2.566" x 1.075" versus 3.846" x 1.870"), which may affect board layout compatibility.

Q: Do both parts meet current RoHS requirements?

A: Yes. The HS150 25R F is RoHS Compliant, and the HS100 25R F is ROHS3 Compliant. Both meet current environmental compliance standards.

Q: What is the temperature coefficient difference between these parts?

A: The HS150 25R F specifies 100ppm/°C, while the HS100 25R F specifies ±100ppm/°C. Both values represent equivalent thermal stability performance for this resistor category.

Q: Are solder lug connections identical on both parts?

A: Yes. Both the HS150 25R F and HS100 25R F use solder lugs for lead connection, ensuring compatible assembly processes.

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