HMPP-3860-TR2 Equivalent & Substitute Parts

Part Overview

The HMPP-3860-TR2 is an RF Diode PIN - Single manufactured by Broadcom Limited, rated for 50V peak reverse voltage and 1A maximum current in a MiniPak 1412 package. This component is classified as Obsolete, making identification of functionally equivalent alternatives essential for ongoing design support and procurement continuity. Substitute parts must maintain RF performance characteristics while meeting or exceeding the electrical specifications of the original design.

Substiute Parts

HMPP-3860-TR2

Broadcom LimitedIn Stock: 902HMPP-3860-TR2 Datasheet

Current PartRFQ

CLA4605-085LF

Skyworks Solutions Inc.In Stock: 6611CLA4605-085LF Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the HMPP-3860-TR2 is determined by the following critical parameters:

• Diode Type: PIN - Single configuration required for RF switching and attenuation applications
• Voltage Rating: Minimum 50V peak reverse voltage to maintain design margin
• Current Capacity: Minimum 1A to support circuit current requirements
• RF Characteristics: Capacitance and resistance values must support the intended RF frequency band and impedance matching
• Operating Temperature: Must support the thermal environment of the application
• Package Compatibility: Physical and electrical compatibility with PCB layout and assembly process

The substitute part CLA4605-085LF meets or exceeds all critical parameters while offering improved electrical performance and active product status.

Parameter Comparison

Engineering Selection Recommendations

The CLA4605-085LF is the manufacturer-recommended substitute for the HMPP-3860-TR2. Selection is supported by the following factors:

• Electrical Superiority: The substitute provides higher voltage rating (60V vs. 50V), increased current capacity (1.5 A vs. 1 A), and lower forward resistance (2Ohm vs. 22Ohm), all of which enhance circuit performance and reliability margins.
• Active Product Status: CLA4605-085LF is actively manufactured by Skyworks Solutions Inc., ensuring long-term availability and supply chain stability compared to the obsolete HMPP-3860-TR2.
• Compliance: Both parts maintain MSL 1 (Unlimited) moisture sensitivity and REACH Unaffected status. CLA4605-085LF additionally carries RoHS3 Compliance certification.
• Thermal Performance: The substitute supports higher junction temperature (175°C vs. 150°C), providing additional thermal margin in demanding applications.

Package differences (MiniPak 1412 vs. 3-QFN 2x2) require PCB layout verification and assembly process validation prior to production implementation.

Frequently Asked Questions (FAQ)

Q: Can CLA4605-085LF be used as a direct drop-in replacement for HMPP-3860-TR2?

A: Electrical substitution is valid based on parameter compatibility. However, package differences (MiniPak 1412 vs. 3-QFN 2x2) require PCB footprint redesign and assembly process qualification. The substitute's superior electrical ratings provide design margin.

Q: Why does CLA4605-085LF have higher capacitance (0.45pF vs. 0.2pF)?

A: Capacitance is measured at different bias voltages (6V vs. 50V). The substitute's capacitance specification at lower bias voltage reflects its improved RF characteristics. Actual capacitance at 50V bias will be lower and must be verified against application requirements.

Q: Is the lower forward resistance (2Ohm vs. 22Ohm) beneficial?

A: Yes. Lower forward resistance reduces power dissipation and improves RF switching efficiency. The substitute's 1W power dissipation rating supports higher power applications compared to the original part.

Q: What compliance certifications apply to the substitute?

A: CLA4605-085LF carries RoHS3 Compliance, REACH Unaffected status, and MSL 1 (Unlimited) moisture sensitivity rating. Both parts are classified as EAR99 for export control purposes.

Q: How does package change affect implementation?

A: The 3-QFN (2x2) package is smaller than MiniPak 1412, potentially reducing PCB area. Assembly equipment compatibility, solder reflow profiles, and thermal management characteristics must be validated for the new package geometry.