HMHA2801AR4 Equivalent & Substitute Parts

Part Overview

The HMHA2801AR4 is an optoisolator with transistor output manufactured by onsemi, designed for high-voltage isolation applications requiring 3750Vrms isolation rating. This component features a single channel configuration in a 4-Mini-Flat surface mount package. The part is currently listed as obsolete, making identification of active equivalent alternatives essential for ongoing production and design continuity.

Substiute Parts

HMHA2801AR4
onsemiIn Stock: 762HMHA2801AR4 Datasheet
HMHA2801AR4
Current Part
HMHA2801AR2
onsemiIn Stock: 80283HMHA2801AR2 Datasheet
HMHA2801AR2
Parametric Equivalent
HMHA2801AR2V
onsemiIn Stock: 18324HMHA2801AR2V Datasheet
HMHA2801AR2V
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer onsemi
Category Optoisolators
Number of Channels 1
Voltage - Isolation 3750Vrms
Current Transfer Ratio (Min) 80% @ 5mA
Current Transfer Ratio (Max) 160% @ 5mA
Output Type Transistor
Voltage - Output (Max) 80V
Current - Output / Channel 50mA
Vce Saturation (Max) 300mV
Operating Temperature -55°C ~ 100°C
Package / Case 4-SOIC (0.173", 4.40mm Width)
Mounting Type Surface Mount
Moisture Sensitivity Level (MSL) 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the HMHA2801AR4 are identified based on strict electrical and mechanical parameter matching. The following criteria determine substitution eligibility:

Critical Parameters for Substitution:

  • Voltage - Isolation: 3750Vrms (must match exactly)
  • Number of Channels: 1 (must match exactly)
  • Output Type: Transistor (must match exactly)
  • Current Transfer Ratio range: 80% - 160% @ 5mA (must match exactly)
  • Voltage - Output (Max): 80V (must match exactly)
  • Current - Output / Channel: 50mA (must match exactly)
  • Vce Saturation (Max): 300mV (must match exactly)
  • Operating Temperature: -55°C ~ 100°C (must match exactly)
  • Package / Case: 4-SOIC 4-Mini-Flat (must match exactly)

The HMHA2801AR4 has two active equivalent alternatives that maintain identical electrical specifications and mechanical compatibility. These substitutes differ only in packaging format (Tape & Reel versus Cut Tape & Digi-Reel), which affects supply chain and handling but not functional performance.

Parameter Comparison

Parameter HMHA2801AR4 HMHA2801AR2 HMHA2801AR2V
Manufacturer onsemi onsemi onsemi
Product Status Obsolete Active Active
Number of Channels 1 1 1
Voltage - Isolation 3750Vrms 3750Vrms 3750Vrms
Current Transfer Ratio (Min) 80% @ 5mA 80% @ 5mA 80% @ 5mA
Current Transfer Ratio (Max) 160% @ 5mA 160% @ 5mA 160% @ 5mA
Output Type Transistor Transistor Transistor
Voltage - Output (Max) 80V 80V 80V
Current - Output / Channel 50mA 50mA 50mA
Vce Saturation (Max) 300mV 300mV 300mV
Operating Temperature -55°C ~ 100°C -55°C ~ 100°C -55°C ~ 100°C
Package / Case 4-SOIC (0.173", 4.40mm Width) 4-SOIC (0.173", 4.40mm Width) 4-SOIC (0.173", 4.40mm Width)
Mounting Type Surface Mount Surface Mount Surface Mount
Packaging Format Bulk Tape & Reel (TR) Cut Tape (CT) & Digi-Reel®
RoHS Status Not specified ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited) 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected REACH Unaffected

Engineering Selection Recommendations

HMHA2801AR2 is the primary substitute for the obsolete HMHA2801AR4. This part maintains complete electrical and mechanical compatibility while offering active product status and ROHS3 compliance. The Tape & Reel packaging format is suitable for automated assembly processes and high-volume production environments.

HMHA2801AR2V serves as an alternative substitute with identical electrical specifications and ROHS3 compliance. The Cut Tape & Digi-Reel packaging format accommodates lower-volume requirements and manual assembly workflows while maintaining full functional equivalence.

Both substitute parts are manufactured by onsemi under the same base product number (HMHA2801) and share identical isolation voltage, current transfer ratio, output characteristics, and thermal operating range. Selection between HMHA2801AR2 and HMHA2801AR2V depends on procurement volume and assembly methodology rather than electrical performance.

Frequently Asked Questions (FAQ)

Q: Can HMHA2801AR2 directly replace HMHA2801AR4 in existing designs?

A: Yes. The HMHA2801AR2 maintains identical electrical specifications, isolation voltage, current transfer ratio, output voltage and current ratings, saturation characteristics, and operating temperature range. The 4-SOIC package dimensions and pin configuration are unchanged, enabling direct substitution without circuit modification.

Q: What is the difference between HMHA2801AR2 and HMHA2801AR2V?

A: Both parts are electrically and mechanically identical. The difference lies in packaging format: HMHA2801AR2 is supplied in Tape & Reel format for automated assembly, while HMHA2801AR2V is supplied in Cut Tape & Digi-Reel format for manual or lower-volume assembly. Functional performance is equivalent.

Q: Why is HMHA2801AR4 listed as obsolete?

A: The HMHA2801AR4 has been discontinued by onsemi. The active alternatives HMHA2801AR2 and HMHA2801AR2V provide identical functionality and are the recommended replacements for new designs and production continuity.

Q: Are there any compliance differences between the obsolete and substitute parts?

A: The substitute parts HMHA2801AR2 and HMHA2801AR2V carry ROHS3 compliance certification, while the obsolete HMHA2801AR4 does not specify this status. Both substitute parts maintain REACH Unaffected status and MSL Level 1 (Unlimited) moisture sensitivity rating, matching the original part's environmental specifications.

Q: What packaging considerations apply when switching from HMHA2801AR4 to substitutes?

A: The HMHA2801AR4 was supplied in bulk packaging. HMHA2801AR2 uses Tape & Reel format, standard for automated pick-and-place assembly. HMHA2801AR2V uses Cut Tape & Digi-Reel format, suitable for manual assembly or lower-volume applications. Both formats maintain the same 4-SOIC package dimensions and pin spacing, requiring no PCB layout modifications.

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