HMC750LP4E Equivalent & Substitute Parts

Part Overview

The HMC750LP4E is a limiting amplifier integrated circuit manufactured by Analog Devices Inc., designed for single-channel differential output applications. This component is classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing design requirements and production continuity. The part is housed in a 24-VFQFN Exposed Pad surface mount package and operates across a -40°C to 85°C temperature range with a supply voltage span of 4.6V to 5.4V.

Substiute Parts

HMC750LP4E
Analog Devices Inc.In Stock: 1307HMC750LP4E Datasheet
HMC750LP4E
Current Part
HMC865LC3
Analog Devices Inc.In Stock: 798HMC865LC3 Datasheet
HMC865LC3
MFR Recommended

Key Parameters

Parameter Value
Manufacturer Part Number HMC750LP4E
Manufacturer Analog Devices Inc.
Category Linear, Amplifiers
Amplifier Type Limiting
Number of Circuits 1
Output Type Differential
Voltage - Input Offset 3 mV
Current - Supply 106 mA
Voltage - Supply Span (Min) 4.6 V
Voltage - Supply Span (Max) 5.4 V
Operating Temperature -40°C ~ 85°C
Mounting Type Surface Mount
Package / Case 24-VFQFN Exposed Pad
Product Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
REACH Status REACH Unaffected
ECCN EAR99

Substitute Part Grouping Explanation

Substitution of the HMC750LP4E is determined by alignment of the following critical parameters:

Functional Classification: Both the main part and substitute must operate within the Linear Amplifiers category with surface mount packaging suitable for automated assembly.

Manufacturer Continuity: Analog Devices Inc. maintains both the obsolete HMC750LP4E and the active substitute HMC865LC3, ensuring consistent design support and supply chain reliability.

Compliance & Regulatory Alignment: Both parts share identical REACH Status (REACH Unaffected) and ECCN classification (EAR99), maintaining regulatory compliance across substitution.

Packaging Technology: Both components utilize VFQFN Exposed Pad surface mount packages with integrated thermal management, supporting equivalent PCB layout and assembly processes.

Supply Voltage Compatibility: The substitute part operates within a 3.13V to 3.47V supply range, which differs from the main part's 4.6V to 5.4V specification. This represents a fundamental electrical difference requiring circuit redesign consideration.

Moisture Sensitivity: The main part carries MSL 1 (Unlimited), while the substitute carries MSL 3 (168 Hours), indicating different handling and storage requirements during manufacturing.

Parameter Comparison

Parameter HMC750LP4E (Main Part) HMC865LC3 (Substitute)
Manufacturer Analog Devices Inc. Analog Devices Inc.
Category Linear, Amplifiers Linear, Amplifiers
Product Status Obsolete Active
Mounting Type Surface Mount Surface Mount
Package Type 24-VFQFN Exposed Pad 16-VFCQFN Exposed Pad
Current - Supply 106 mA 90 mA
Voltage - Supply (Min) 4.6 V 3.13 V
Voltage - Supply (Max) 5.4 V 3.47 V
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
Moisture Sensitivity Level (MSL) 1 (Unlimited) 3 (168 Hours)

Engineering Selection Recommendations

Active Product Status: The HMC865LC3 carries Active product status, ensuring long-term availability, technical support, and continued manufacturing from Analog Devices Inc. The HMC750LP4E is classified as Obsolete, making the substitute the appropriate selection for new designs and production continuity.

Regulatory Compliance: Both parts maintain identical REACH and ECCN classifications, supporting equivalent compliance documentation and export control requirements across applications.

Supply Chain Continuity: Current inventory of 763 units of the HMC865LC3 is available through authorized distribution channels, providing immediate component availability for production requirements.

Design Considerations: The HMC865LC3 operates at a reduced supply voltage range (3.13V to 3.47V) compared to the HMC750LP4E (4.6V to 5.4V). Circuit redesign is required to accommodate this voltage specification change. Additionally, the package transition from 24-pin to 16-pin configuration necessitates PCB layout modification and schematic redesign.

Moisture Handling: The substitute part requires stricter moisture control during storage and assembly (MSL 3, 168 Hours) compared to the main part (MSL 1, Unlimited). Manufacturing processes must incorporate appropriate bake-out procedures and dry-pack storage protocols.

Frequently Asked Questions (FAQ)

Q: Can the HMC865LC3 be used as a direct pin-for-pin replacement for the HMC750LP4E?

A: No. The HMC865LC3 uses a 16-pin package configuration compared to the HMC750LP4E's 24-pin package. PCB layout redesign and schematic modification are required for substitution.

Q: What is the primary reason for substituting the HMC750LP4E?

A: The HMC750LP4E is classified as Obsolete. The HMC865LC3 is an Active product from the same manufacturer, ensuring continued availability, technical support, and manufacturing continuity.

Q: Are there supply voltage compatibility issues between these parts?

A: Yes. The HMC750LP4E operates at 4.6V to 5.4V, while the HMC865LC3 operates at 3.13V to 3.47V. Circuit power supply redesign is necessary to accommodate the substitute part's lower voltage requirements.

Q: Do both parts meet the same regulatory requirements?

A: Yes. Both parts carry identical REACH Status (REACH Unaffected) and ECCN classification (EAR99), maintaining equivalent regulatory compliance.

Q: What are the moisture sensitivity differences between these parts?

A: The HMC750LP4E carries MSL 1 (Unlimited moisture sensitivity), while the HMC865LC3 carries MSL 3 (168 Hours). The substitute part requires stricter moisture control during manufacturing, storage, and assembly processes.

Q: Is the current consumption significantly different between these parts?

A: The HMC750LP4E draws 106 mA, while the HMC865LC3 draws 90 mA. The substitute part operates at lower current, which may reduce overall system power consumption.

Q: What package considerations apply to this substitution?

A: The transition from 24-VFQFN to 16-VFCQFN requires PCB redesign. Both packages use Exposed Pad thermal management and surface mount assembly, but pin counts and footprints differ significantly.

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