HMC1052 Magnetoresistive Sensor Equivalent & Substitute Parts

Part Overview

The HMC1052 is a magnetoresistive sensor manufactured by Honeywell Aerospace, designed for dual-axis (X, Y) magnetic field detection using Wheatstone Bridge output configuration. This component operates across a wide supply voltage range and is suitable for applications requiring precise magnetic sensing in compact surface-mount packages.

The HMC1052 is classified as obsolete. Identifying equivalent and substitute parts is necessary to ensure design continuity, maintain supply chain reliability, and support long-term product availability for existing applications and new designs requiring compatible functionality.

Substiute Parts

HMC1052
Honeywell AerospaceIn Stock: 8094HMC1052 Datasheet
HMC1052
Current Part
HMC1052L-TR
Honeywell AerospaceIn Stock: 1953HMC1052L-TR Datasheet
HMC1052L-TR
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Key Parameters

Parameter Value
Technology Magnetoresistive
Sensing Axis X, Y (Dual-Axis)
Output Type Wheatstone Bridge
Sensing Range ±0.6mT
Supply Voltage 1.8V ~ 20V
Bandwidth 5MHz
Operating Temperature -40°C ~ 125°C (TA)
Mounting Type Surface Mount
RoHS Compliance RoHS Compliant
Moisture Sensitivity Level MSL 1 (Unlimited)

Substitute Part Grouping Explanation

Substitute parts for the HMC1052 are identified based on strict electrical and mechanical parameter compatibility. The following criteria determine valid substitution:

Core Electrical Parameters:

  • Magnetoresistive technology platform
  • Dual-axis (X, Y) sensing capability
  • Wheatstone Bridge output configuration
  • Identical sensing range (±0.6mT)
  • Matching supply voltage range (1.8V ~ 20V)
  • Equivalent bandwidth (5MHz)
  • Identical operating temperature range (-40°C ~ 125°C)

Mechanical & Compliance Parameters:

  • Surface-mount packaging
  • RoHS compliance status
  • MSL rating of 1 or lower
  • ECCN classification EAR99

The HMC1052L-TR meets all substitution criteria while offering active product status and improved supply availability.

Parameter Comparison

Parameter HMC1052 HMC1052L-TR
Manufacturer Honeywell Aerospace Honeywell Aerospace
Technology Magnetoresistive Magnetoresistive
Sensing Axis X, Y X, Y
Output Type Wheatstone Bridge Wheatstone Bridge
Sensing Range ±0.6mT ±0.6mT
Supply Voltage 1.8V ~ 20V 1.8V ~ 20V
Bandwidth 5MHz 5MHz
Operating Temperature -40°C ~ 125°C -40°C ~ 125°C
Mounting Type Surface Mount Surface Mount
Package Type 10-MSOP 16-LCC
Packaging Format Bulk Tape & Reel (TR)
Product Status Obsolete Active
RoHS Status RoHS Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited)
ECCN EAR99 EAR99

Engineering Selection Recommendations

HMC1052L-TR as Primary Substitute:

The HMC1052L-TR is the qualified substitute for the obsolete HMC1052. Both components share identical electrical specifications across all critical parameters: magnetoresistive technology, dual-axis sensing, Wheatstone Bridge output, ±0.6mT sensing range, 1.8V ~ 20V supply voltage, 5MHz bandwidth, and -40°C ~ 125°C operating temperature range.

Compliance & Availability Advantages:

The HMC1052L-TR carries active product status from Honeywell Aerospace, ensuring continued manufacturing support and supply chain availability. Both components maintain equivalent RoHS compliance (RoHS3 for HMC1052L-TR represents enhanced compliance over the original RoHS standard). MSL ratings are identical at Level 1, indicating unlimited moisture sensitivity protection.

Package Consideration:

The primary difference is packaging: HMC1052 uses 10-MSOP while HMC1052L-TR uses 16-LCC. Both are surface-mount packages with exposed pad configurations. PCB layout and footprint redesign is required for implementation. The Tape & Reel packaging format of HMC1052L-TR supports automated assembly processes.

Selection Criteria:

For new designs or redesigns of existing applications, HMC1052L-TR is the appropriate selection. For applications where 10-MSOP package geometry is mandatory, alternative magnetoresistive sensors with identical electrical specifications and 10-MSOP packaging should be evaluated from the Honeywell Aerospace product portfolio.

Frequently Asked Questions (FAQ)

Q: Can HMC1052L-TR directly replace HMC1052 without circuit modification?

A: Electrical substitution is valid. All electrical parameters are identical. However, package geometry differs (10-MSOP vs. 16-LCC), requiring PCB footprint and layout redesign. Pin configuration must be verified against application schematics.

Q: What is the difference between 10-MSOP and 16-LCC packages?

A: 10-MSOP (Micro Small Outline Package) is a 10-pin package with 0.118" width. 16-LCC (Leadless Ceramic Chip Carrier) is a 16-pin package with exposed pad. Both are surface-mount technologies suitable for automated assembly. Package selection depends on PCB space constraints and thermal management requirements.

Q: Are there supply chain advantages to using HMC1052L-TR?

A: Yes. HMC1052L-TR maintains active product status with Honeywell Aerospace, ensuring continued manufacturing and distribution. HMC1052 is obsolete, with limited remaining inventory. HMC1052L-TR is available in Tape & Reel format, supporting high-volume automated assembly.

Q: Do both parts meet the same compliance standards?

A: Both components are RoHS compliant and carry MSL Level 1 rating. HMC1052L-TR specifies ROHS3 compliance, representing current regulatory alignment. Both carry EAR99 ECCN classification. REACH status for HMC1052L-TR is listed as REACH Unaffected.

Q: What is the sensing range specification, and does it apply to both parts?

A: Both HMC1052 and HMC1052L-TR specify ±0.6mT sensing range. This represents the magnetic field detection capability across both X and Y axes. Sensing range is identical and does not vary between the two part numbers.

Q: Can HMC1052L-TR be used in applications originally designed for HMC1052?

A: Electrical compatibility is confirmed. Mechanical compatibility requires PCB redesign due to package differences. Thermal performance and signal integrity must be re-evaluated in the new package configuration. Design validation testing is required before production implementation.

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