HM2P70PNE12CGF Equivalent & Substitute Parts

Part Overview

The HM2P70PNE12CGF is a 132-position backplane connector header manufactured by Amphenol ICC (FCI) from the Millipacs® series. This through-hole press-fit connector features a 2.00mm pitch and supports 1.5A current at 750Vrms. The part is currently classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support and new design implementations.

Substiute Parts

HM2P70PNE12CGF

Amphenol ICC (FCI)In Stock: 1155HM2P70PNE12CGF Datasheet

Current PartRFQ

HM2P70PNE12CGFLF

Amphenol ICC (FCI)In Stock: 747HM2P70PNE12CGFLF Datasheet

DirectRFQ

5352639-1

TE Connectivity AMP ConnectorsIn Stock: 15245352639-1 Datasheet

MFR RecommendedRFQ

CP2-HAB110-GA1-FJ

3MIn Stock: 797CP2-HAB110-GA1-FJ Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the HM2P70PNE12CGF is determined by the following critical parameters:

• Pitch (2.00mm): All substitutes must maintain identical 2.00mm pitch spacing for PCB compatibility
• Mounting Type (Through Hole): All substitutes must use through-hole mounting with press-fit termination
• Connector Type (Header, Male Pins): All substitutes must be male pin headers
• Current Rating (1.5A minimum): Electrical performance must meet or exceed 1.5A
• Voltage Rating (500Vrms minimum): Electrical performance must meet or exceed 500Vrms
• Operating Temperature (-55°C to 125°C): Thermal range must encompass or exceed the specified range

Substitutes are grouped into two categories:

Category 1 - Direct Functional Equivalents: Parts maintaining identical or near-identical position counts and ground pin configurations with active product status.

Category 2 - Functional Alternatives: Parts with different position counts or ground configurations that satisfy core electrical and mechanical parameters but require design verification for specific applications.

Parameter Comparison

Engineering Selection Recommendations

HM2P70PNE12CGFLF is the primary substitute for HM2P70PNE12CGF. Both parts are from the Amphenol ICC Millipacs® series with identical electrical and mechanical specifications. The HM2P70PNE12CGFLF maintains active product status and RoHS compliance, making it the direct replacement for obsolete inventory management and new designs requiring the same 132-position, 5+1 row configuration.

5352639-1 (TE Connectivity Z-PACK series) is a functional alternative for applications requiring 110-position headers with 5-row configuration. This part meets the core electrical parameters (1.5A, 500Vrms minimum) and operating temperature range. The reduced position count and absence of dedicated ground rows require design verification to confirm compatibility with existing PCB layouts and signal distribution schemes.

CP2-HAB110-GA1-FJ (3M MetPak™ CP2 series) is a functional alternative for CompactPCI hot-swap applications. This 154-position header with 5+2 row configuration provides increased ground pin density (44 ground positions versus 22). Voltage and current ratings are not specified in available documentation. Selection of this part requires confirmation that the increased position count and different ground distribution are compatible with target PCB designs.

Frequently Asked Questions (FAQ)

Q: Can HM2P70PNE12CGFLF be used as a direct replacement for HM2P70PNE12CGF?

A: Yes. Both parts share identical electrical specifications (1.5A, 750Vrms), mechanical configuration (132 positions, 5+1 rows, 2.00mm pitch), and mounting method (through-hole press-fit). The primary difference is product status: HM2P70PNE12CGFLF is active with RoHS compliance, while HM2P70PNE12CGF is obsolete.

Q: What are the key differences between the Amphenol and TE Connectivity options?

A: HM2P70PNE12CGFLF (Amphenol) maintains the 132-position configuration with 22 dedicated ground pins. The 5352639-1 (TE Connectivity) provides 110 positions with 5 rows and no dedicated ground row. The TE part has a lower voltage rating (500Vrms versus 750Vrms). Position count and ground distribution differences require PCB layout verification before substitution.

Q: Is the 3M CP2-HAB110-GA1-FJ suitable for general backplane applications?

A: The CP2-HAB110-GA1-FJ is designed for CompactPCI hot-swap applications and features 154 positions with enhanced ground distribution (44 ground pins). This part is suitable only for applications specifically requiring CompactPCI compatibility and the increased ground pin density. Standard backplane designs should use HM2P70PNE12CGFLF or 5352639-1.

Q: What packaging differences exist among these substitutes?

A: HM2P70PNE12CGF is supplied without specified packaging. HM2P70PNE12CGFLF uses tray packaging. 5352639-1 uses tube packaging. CP2-HAB110-GA1-FJ packaging is not specified. Packaging selection affects handling, storage, and integration into assembly processes but does not impact electrical or mechanical performance.

Q: Are all substitutes RoHS compliant?

A: HM2P70PNE12CGFLF is RoHS Compliant. 5352639-1 is ROHS3 Compliant. CP2-HAB110-GA1-FJ is RoHS Compliant. The original HM2P70PNE12CGF RoHS status is not specified. All active substitutes meet current RoHS requirements for new designs.