HM2P66PD5111N9LLF Equivalent & Substitute Parts

Part Overview

The HM2P66PD5111N9LLF is a 146-position backplane connector header manufactured by Amphenol ICC (FCI) in the Millipacs® series. This through-hole press-fit connector features 110 signal positions plus 36 ground positions arranged in a 5+2 row configuration with 0.079" (2.00mm) pitch. The connector is actively produced and widely used in high-density backplane applications requiring robust electrical and mechanical performance across industrial temperature ranges.

Equivalent and substitute parts are identified when component availability, lead time, or design requirements necessitate alternative sourcing while maintaining functional compatibility within specified electrical and mechanical parameters.

Substiute Parts

HM2P66PD5111N9LLF
Amphenol ICC (FCI)In Stock: 846HM2P66PD5111N9LLF Datasheet
HM2P66PD5111N9LLF
Current Part
5352639-1
TE Connectivity AMP ConnectorsIn Stock: 15245352639-1 Datasheet
5352639-1
MFR Recommended

Key Parameters

Parameter Value
Connector Type Header, Male Pins
Number of Positions 146 (110 + 36 Ground)
Pitch 0.079" (2.00mm)
Number of Rows 5 + 2
Mounting Type Through Hole
Termination Press-Fit
Current Rating 1.5 A
Voltage Rating 750Vrms
Operating Temperature -55°C ~ 125°C
Contact Finish Gold (30.0µin / 0.76µm)
RoHS Status RoHS Compliant
MSL Rating 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the HM2P66PD5111N9LLF is determined by the following critical parameters:

  • Connector pitch: 0.079" (2.00mm) — must match exactly
  • Mounting type: Through hole press-fit termination — must match exactly
  • Current rating: Minimum 1.5 A — substitute must meet or exceed
  • Voltage rating: Minimum 750Vrms — substitute must meet or exceed
  • Operating temperature range: -55°C ~ 125°C — substitute must cover or exceed this range
  • Contact finish: Gold plating — preferred for signal integrity and corrosion resistance
  • RoHS compliance: Required for regulated applications

The substitute part 5352639-1 (TE Connectivity AMP Connectors, Z-PACK series) shares the core mechanical and electrical characteristics of 0.079" (2.00mm) pitch, through-hole press-fit construction, and identical current rating (1.5 A). However, the substitute features a reduced position count (110 positions versus 146) and a lower voltage rating (500Vrms versus 750Vrms), which restricts its application scope to designs not requiring the full 146-position density or operating below 500Vrms.

Parameter Comparison

Parameter HM2P66PD5111N9LLF (Main) 5352639-1 (Substitute)
Manufacturer Amphenol ICC (FCI) TE Connectivity AMP Connectors
Series Millipacs® Z-PACK
Connector Type Header, Male Pins Header, Male Pins
Number of Positions 146 (110 + 36 Ground) 110
Pitch 0.079" (2.00mm) 0.079" (2.00mm)
Number of Rows 5 + 2 5
Mounting Type Through Hole Through Hole
Termination Press-Fit Press-Fit
Current Rating 1.5 A 1.5 A
Voltage Rating 750Vrms 500Vrms
Operating Temperature -55°C ~ 125°C -55°C ~ 125°C
RoHS Status RoHS Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited)
Product Status Active Active

Engineering Selection Recommendations

Both the HM2P66PD5111N9LLF and 5352639-1 maintain active product status with current manufacturing support. Both connectors comply with RoHS directives (RoHS Compliant and ROHS3 Compliant respectively) and carry MSL 1 ratings, indicating no moisture sensitivity constraints during storage and handling.

Selection between these parts depends on application-specific requirements:

The HM2P66PD5111N9LLF is the primary choice for applications requiring the full 146-position density, 750Vrms voltage capability, and the integrated 36 ground positions within a single connector footprint. Its higher voltage rating accommodates industrial and high-reliability applications with elevated voltage specifications.

The 5352639-1 is suitable for applications where 110 positions satisfy the signal routing requirement and the 500Vrms voltage rating is adequate. This substitute offers an alternative sourcing path when HM2P66PD5111N9LLF availability is constrained. Both parts share identical current ratings, temperature ranges, and press-fit termination technology, ensuring mechanical and thermal compatibility in through-hole PCB applications.

Frequently Asked Questions (FAQ)

Q: Can 5352639-1 be used as a direct replacement for HM2P66PD5111N9LLF?

A: No. The 5352639-1 is a functional substitute only for applications that do not require the full 146-position count or the 750Vrms voltage rating. The substitute provides 110 positions (versus 146) and supports 500Vrms (versus 750Vrms). Verify that your design accommodates these reductions before substitution.

Q: What is the significance of the pitch specification in connector substitution?

A: Pitch (0.079" / 2.00mm) defines the center-to-center spacing between adjacent contact positions. Both the main part and substitute share identical pitch, ensuring PCB footprint compatibility. Pitch mismatch would render a connector mechanically incompatible with the PCB layout.

Q: Are there differences in packaging between these connectors?

A: Yes. The HM2P66PD5111N9LLF is supplied in Tray packaging, while the 5352639-1 is supplied in Tube packaging. Packaging affects handling, storage, and automated assembly processes but does not impact electrical or mechanical performance.

Q: Do both connectors support the same operating temperature range?

A: Yes. Both the HM2P66PD5111N9LLF and 5352639-1 operate across -55°C to 125°C, ensuring thermal compatibility in applications spanning industrial and extended temperature environments.

Q: What does RoHS compliance mean for these connectors?

A: RoHS compliance indicates the connector meets restrictions on hazardous substances (lead, cadmium, mercury, and others) as defined by EU Directive 2011/65/EU. Both parts comply with RoHS requirements, making them suitable for regulated markets and environmentally conscious procurement policies.

Q: How does the ground position configuration differ between these parts?

A: The HM2P66PD5111N9LLF integrates 36 dedicated ground positions within its 146-position array, providing distributed ground connectivity across the backplane. The 5352639-1 provides 110 positions without specified ground position allocation, requiring external ground management or separate ground connectors in the system design.

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