HI7190IPZ Equivalent & Substitute Parts

Part Overview

The HI7190IPZ is a 24-bit Sigma-Delta analog-to-digital converter manufactured by Renesas Electronics Corporation, designed for precision data acquisition applications. It features a single differential input, programmable gain amplifier (PGA), and SPI digital interface. The device operates with dual supply voltages (±5V analog, 5V digital) and is rated for -40°C to 85°C operating temperature range.

The HI7190IPZ is classified as obsolete. Locating equivalent or substitute components is necessary for new designs, production continuity, or system upgrades where this part is no longer readily available through standard distribution channels.

Substiute Parts

HI7190IPZ

Renesas Electronics CorporationIn Stock: 827HI7190IPZ Datasheet

Current PartRFQ

HI7190IBZ

Renesas Electronics CorporationIn Stock: 1321HI7190IBZ Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

The HI7190IBZ qualifies as a direct functional substitute for the HI7190IPZ based on the following criteria:

Matching Electrical Parameters:

• 24-bit resolution
• 625 samples per second sampling rate
• Single differential input
• Sigma-Delta architecture
• SPI digital interface
• PGA configuration
• ±5V analog supply and 5V digital supply
• External reference type
• Identical operating temperature range (-40°C to 85°C)
• ROHS3 compliance

Difference:

• Package type: HI7190IPZ uses 20-DIP (through-hole), while HI7190IBZ uses 20-SOIC (surface mount)
• Product status: HI7190IPZ is obsolete; HI7190IBZ is active
• Moisture sensitivity: HI7190IPZ has MSL 1; HI7190IBZ has MSL 3

The electrical and functional specifications are identical. Substitution is valid when the application can accommodate surface-mount packaging and the associated moisture handling requirements.

Parameter Comparison

Engineering Selection Recommendations

The HI7190IBZ is the active production equivalent of the obsolete HI7190IPZ. Both devices are ROHS3 compliant and REACH unaffected, meeting current environmental and regulatory requirements.

Selection between these parts depends on board-level design constraints:

Choose HI7190IPZ only if:

• Existing through-hole PCB designs cannot be modified
• Legacy system maintenance requires exact package compatibility
• Inventory of this obsolete part is available

Choose HI7190IBZ for:

• New designs and production systems
• Surface-mount PCB implementations
• Long-term supply chain continuity (active product status)
• Applications where moisture sensitivity MSL 3 (168 hours) is acceptable

Both parts deliver identical electrical performance and functional capability. The primary consideration is packaging technology and product lifecycle status.

Frequently Asked Questions (FAQ)

Q: Can HI7190IBZ replace HI7190IPZ in existing designs?

A: Electrically and functionally, yes. The HI7190IBZ provides identical performance. However, it requires surface-mount assembly instead of through-hole insertion. PCB redesign is necessary if the original design uses through-hole mounting.

Q: What is the difference between 20-DIP and 20-SOIC packaging?

A: 20-DIP (Dual In-line Package) is a through-hole component inserted into PCB holes. 20-SOIC (Small Outline Integrated Circuit) is a surface-mount component soldered directly to PCB pads. SOIC packages are smaller and more suitable for high-density PCB layouts.

Q: Does the moisture sensitivity difference affect substitution?

A: The HI7190IPZ has MSL 1 (unlimited moisture exposure), while HI7190IBZ has MSL 3 (168-hour limit before reflow). For applications with standard moisture control during assembly, MSL 3 is acceptable. High-humidity or extended storage environments may require additional moisture management for the HI7190IBZ.

Q: Are both parts RoHS compliant?

A: Yes. Both HI7190IPZ and HI7190IBZ are ROHS3 compliant and REACH unaffected, meeting current environmental regulations.

Q: Why is HI7190IPZ listed as obsolete?

A: The HI7190IPZ through-hole package has been superseded by the HI7190IBZ surface-mount version. Renesas has transitioned production to the more modern SOIC package format. Existing inventory may be available, but new production orders should specify the HI7190IBZ.