HFA1113IBZ Equivalent & Substitute Parts

Part Overview

The HFA1113IBZ is a buffer amplifier integrated circuit manufactured by Renesas Electronics Corporation, housed in an 8-SOIC surface mount package. This device functions as a single-circuit buffer amplifier with a slew rate of 2400V/µs and -3dB bandwidth of 850 MHz, designed for high-speed signal conditioning applications. The HFA1113IBZ is classified as obsolete, making identification of functionally compatible substitute components essential for ongoing design support and production continuity. Substitute parts must maintain compatibility across electrical performance parameters, package form factor, and operating environmental specifications.

Substiute Parts

HFA1113IBZ
Renesas Electronics CorporationIn Stock: 880HFA1113IBZ Datasheet
HFA1113IBZ
Current Part
OPA699ID
Texas InstrumentsIn Stock: 1152OPA699ID Datasheet
OPA699ID
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OPA699IDR
Texas InstrumentsIn Stock: 1261OPA699IDR Datasheet
OPA699IDR
Similar

Key Parameters

Parameter Value Unit
Amplifier Type Buffer
Number of Circuits 1
Slew Rate 2400 V/µs
-3dB Bandwidth 850 MHz
Current - Input Bias 25 µA
Voltage - Input Offset 8 mV
Current - Supply 21 mA
Current - Output / Channel 60 mA
Voltage - Supply Span (Min) 9 V
Voltage - Supply Span (Max) 11 V
Operating Temperature Range -40 to 85 °C
Package / Case 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours)

Substitute Part Grouping Explanation

Substitute parts for the HFA1113IBZ are identified based on strict alignment with the following critical parameters:

Package Compatibility: All substitute parts must use the 8-SOIC (0.154", 3.90mm Width) surface mount package to ensure direct PCB footprint compatibility without layout redesign.

Operating Temperature Range: Substitute parts must support the full -40°C to 85°C operating temperature range specified for the HFA1113IBZ.

Circuit Count: Substitute parts must provide a single amplifier circuit (1 circuit) to match the functional architecture of the original device.

Supply Voltage Range: The HFA1113IBZ operates within a 9V to 11V supply span. Substitute parts with broader supply voltage ranges (5V to 12V) are compatible, as they encompass the original operating window.

Regulatory Compliance: All substitute parts must maintain ROHS3 compliance and REACH unaffected status to satisfy current manufacturing and environmental regulations.

The OPA699ID and OPA699IDR (Texas Instruments) are classified as voltage feedback amplifiers rather than buffer amplifiers. These devices differ in amplifier topology but share identical electrical specifications, package form factor, and regulatory compliance status. The substitution is based on package compatibility, operating temperature alignment, single-circuit configuration, and supply voltage envelope overlap.

Parameter Comparison

Parameter HFA1113IBZ (Main) OPA699ID (Substitute) OPA699IDR (Substitute) Unit
Manufacturer Renesas Electronics Texas Instruments Texas Instruments
Product Status Obsolete Active Active
Amplifier Type Buffer Voltage Feedback Voltage Feedback
Number of Circuits 1 1 1
Slew Rate 2400 1400 1400 V/µs
-3dB Bandwidth 850 260 260 MHz
Current - Input Bias 25 3 3 µA
Voltage - Input Offset 8 1.5 1.5 mV
Current - Supply 21 15.5 15.5 mA
Current - Output / Channel 60 120 120 mA
Voltage - Supply Span (Min) 9 5 5 V
Voltage - Supply Span (Max) 11 12 12 V
Operating Temperature Range -40 to 85 -40 to 85 -40 to 85 °C
Package / Case 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width) 8-SOIC (0.154", 3.90mm Width)
Mounting Type Surface Mount Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 3 (168 Hours) 2 (1 Year) 2 (1 Year)
Packaging Format Tube Tape & Reel (TR)

Engineering Selection Recommendations

Active Product Status: The OPA699ID and OPA699IDR are both classified as active products with current manufacturing support from Texas Instruments. This status ensures long-term availability and supply chain stability compared to the obsolete HFA1113IBZ.

Regulatory Compliance: All three devices maintain ROHS3 compliance and REACH unaffected status, satisfying current environmental and regulatory requirements for component selection in manufacturing environments.

Package and Mounting Compatibility: The OPA699ID and OPA699IDR utilize identical 8-SOIC surface mount packaging with matching footprint dimensions (0.154", 3.90mm Width), enabling direct PCB layout compatibility without redesign.

Operating Temperature Alignment: All substitute parts support the full -40°C to 85°C operating temperature range, maintaining thermal performance specifications across the intended application environment.

Moisture Sensitivity Consideration: The OPA699ID and OPA699IDR feature MSL 2 (1 Year) rating, which is superior to the HFA1113IBZ MSL 3 (168 Hours) rating. This improvement reduces moisture-related handling and storage constraints during manufacturing and assembly processes.

Packaging Format Selection: The OPA699ID is supplied in Tube packaging, while the OPA699IDR is supplied in Tape & Reel (TR) format. Selection between these variants depends on production volume and assembly equipment compatibility. Tape & Reel format is standard for high-volume automated assembly operations.

Frequently Asked Questions (FAQ)

Q: Can the OPA699ID and OPA699IDR be used interchangeably with the HFA1113IBZ?

A: The OPA699ID and OPA699IDR share identical electrical specifications and package form factor. The primary difference is packaging format: OPA699ID uses Tube packaging while OPA699IDR uses Tape & Reel format. Both are electrically equivalent for circuit design purposes. Selection depends on production volume and assembly process requirements.

Q: What are the key electrical differences between the HFA1113IBZ and the OPA699 series?

A: The HFA1113IBZ is a buffer amplifier with 2400V/µs slew rate and 850 MHz bandwidth. The OPA699ID and OPA699IDR are voltage feedback amplifiers with 1400V/µs slew rate and 260 MHz bandwidth. The OPA699 series provides lower input bias current (3 µA vs. 25 µA) and lower input offset voltage (1.5 mV vs. 8 mV), with higher output current capability (120 mA vs. 60 mA).

Q: Are there any supply voltage compatibility issues when substituting the OPA699 series?

A: No. The HFA1113IBZ operates within a 9V to 11V supply span. The OPA699ID and OPA699IDR support a 5V to 12V supply span, which fully encompasses the original operating window. Direct voltage supply compatibility is maintained without modification.

Q: What is the significance of the MSL rating difference?

A: The HFA1113IBZ carries MSL 3 (168 Hours), while the OPA699ID and OPA699IDR carry MSL 2 (1 Year). MSL 2 indicates superior moisture resistance and longer shelf life under controlled storage conditions. This improvement reduces moisture-related component failures during manufacturing and assembly.

Q: Which packaging format should be selected for production?

A: The OPA699IDR (Tape & Reel format) is recommended for high-volume automated assembly operations, as this format integrates directly with standard pick-and-place equipment. The OPA699ID (Tube packaging) is suitable for lower-volume or manual assembly processes.

Q: Is PCB layout redesign required when substituting these parts?

A: No. Both the OPA699ID and OPA699IDR use the identical 8-SOIC (0.154", 3.90mm Width) package as the HFA1113IBZ. PCB footprints are directly compatible, eliminating layout redesign requirements.

Q: Are both substitute parts currently available from manufacturers?

A: Yes. Both the OPA699ID and OPA699IDR are classified as active products with current manufacturing support from Texas Instruments, ensuring reliable long-term availability and supply chain continuity.

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