HD64F7017F28V Equivalent & Substitute Parts

Part Overview

The HD64F7017F28V is a 32-bit single-core microcontroller from Renesas Electronics Corporation based on the SH-2 SuperH architecture. This device integrates 128KB of FLASH program memory, 4KB of RAM, and operates at 28.7MHz with a supply voltage range of 4.5V to 5.5V. The IC is housed in a 112-QFP (20x20mm) surface mount package and includes integrated peripherals such as DMA, PWM, and watchdog timer functionality.

The HD64F7017F28V is classified as obsolete. Locating equivalent or substitute components is necessary for design continuation, production support, or system redesign when original inventory becomes unavailable or procurement timelines extend beyond acceptable limits.

Substiute Parts

HD64F7017F28V

Renesas Electronics CorporationIn Stock: 2167HD64F7017F28V Datasheet

Current PartRFQ

MCF52230CAL60

NXP USA Inc.In Stock: 1154MCF52230CAL60 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the HD64F7017F28V is based on the following critical parameters:

Memory Configuration: Program memory of 128KB FLASH and RAM capacity are primary matching criteria. The substitute must provide equivalent or greater memory resources to maintain firmware compatibility.

Package Compatibility: The 112-pin QFP/LQFP package footprint (20x20mm) determines physical and electrical pin compatibility. Substitutes must use the same or compatible package designation.

Core Performance: Clock speed and core architecture define processing capability. Substitutes operating at equal or higher frequencies with compatible instruction sets are acceptable.

Voltage Supply Range: Operating voltage must overlap or encompass the original 4.5V ~ 5.5V range to ensure compatibility with existing power distribution circuits.

Peripheral Integration: DMA, PWM, and watchdog timer functionality are standard requirements for embedded control applications.

Compliance Certifications: RoHS3 compliance and REACH status ensure regulatory alignment for current manufacturing and distribution.

Parameter Comparison

Engineering Selection Recommendations

The MCF52230CAL60 is an active product from NXP USA Inc. and represents a viable substitute for the obsolete HD64F7017F28V based on the following factors:

Memory Alignment: Both devices provide 128KB of FLASH program memory. The MCF52230CAL60 offers 32KB of RAM compared to 4KB in the original, providing additional headroom for data storage and stack operations.

Package Compatibility: Both devices use 112-pin packages with identical 20x20mm footprints. The QFP and LQFP designations are mechanically and electrically compatible for PCB mounting.

Regulatory Compliance: Both parts maintain ROHS3 compliance and REACH unaffected status, ensuring alignment with current manufacturing and distribution requirements.

Product Availability: The MCF52230CAL60 is classified as active, ensuring continued availability and supply chain stability compared to the obsolete status of the original part.

Voltage Supply Consideration: The MCF52230CAL60 operates at 3V ~ 3.6V, which differs from the original 4.5V ~ 5.5V range. System power architecture must be evaluated and potentially redesigned to accommodate this voltage requirement.

Performance Enhancement: The MCF52230CAL60 operates at 60MHz, providing 2.1x higher clock speed than the original 28.7MHz device, enabling improved processing performance.

Frequently Asked Questions (FAQ)

Q: Can the MCF52230CAL60 directly replace the HD64F7017F28V without firmware modification?

A: Direct replacement requires firmware validation. While both devices are 32-bit single-core microcontrollers with 128KB FLASH memory, they use different processor architectures (SH-2 SuperH versus Coldfire V2). Instruction set compatibility cannot be assumed. Firmware recompilation and functional testing are mandatory.

Q: What is the impact of the voltage supply difference between these devices?

A: The HD64F7017F28V requires 4.5V ~ 5.5V, while the MCF52230CAL60 operates at 3V ~ 3.6V. Existing power supply circuits must be redesigned or replaced to provide the lower voltage range. This may require additional voltage regulation components and PCB layout modifications.

Q: Are the 112-QFP and 112-LQFP packages mechanically interchangeable?

A: Both packages share identical 20x20mm footprints and 112-pin configurations. PCB footprints designed for either package type are compatible. However, soldering process parameters may differ slightly between QFP and LQFP variants due to lead geometry differences.

Q: How does the RAM difference affect system design?

A: The MCF52230CAL60 provides 32KB of RAM versus 4KB in the original device. This 8x increase in RAM capacity allows for larger data buffers, expanded stack space, and more complex data structures. Existing firmware designed for 4KB RAM will operate without modification, but the additional memory enables enhanced functionality.

Q: What are the connectivity differences between these devices?

A: The HD64F7017F28V provides EBI/EMI and SCI connectivity. The MCF52230CAL60 offers Ethernet, I2C, SPI, and UART/USART connectivity. System interface requirements must be evaluated to determine if the different connectivity options meet application needs.

Q: Is the MCF52230CAL60 suitable for applications requiring the -20°C ~ 75°C temperature range?

A: The MCF52230CAL60 operates across -40°C ~ 85°C, which encompasses the original -20°C ~ 75°C range. The substitute device meets or exceeds the original temperature specifications.