HD64F3694GFYV Equivalent & Substitute Parts

Part Overview

The HD64F3694GFYV is a 16-bit H8/300H Tiny microcontroller manufactured by Renesas Electronics Corporation, featuring 32KB FLASH memory and a 48-LQFP package. This device is classified as obsolete, making identification of functionally equivalent alternatives essential for ongoing system support, design updates, and production continuity. Substitute parts must maintain compatibility across core processor architecture, memory configuration, I/O count, and package specifications to ensure seamless integration into existing applications.

Substiute Parts

HD64F3694GFYV

Renesas Electronics CorporationIn Stock: 1183HD64F3694GFYV Datasheet

Current PartRFQ

MC9S12C32CFAE25

NXP USA Inc.In Stock: 1803MC9S12C32CFAE25 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the HD64F3694GFYV is determined by the following critical parameters:

• Memory Configuration: Program memory must be 32KB FLASH with 2K x 8 RAM
• Package Compatibility: 48-LQFP (7x7) surface mount package required
• Core Architecture: 16-bit processor with equivalent instruction set compatibility
• I/O Pin Count: Minimum 29 I/O pins to support existing circuit designs
• Voltage Supply Range: Operating range must encompass or exceed 3V ~ 5.5V
• Data Conversion: A/D converter specification of 8x10b or equivalent

The MC9S12C32CFAE25 meets these substitution criteria through matching memory size, identical package footprint, compatible 16-bit architecture, and equivalent peripheral specifications.

Parameter Comparison

Engineering Selection Recommendations

The MC9S12C32CFAE25 is a qualified substitute for the HD64F3694GFYV based on the following engineering criteria:

• Memory Equivalence: Both devices feature identical 32KB FLASH and 2K x 8 RAM configurations, ensuring software compatibility at the memory level.
• Package Footprint: The 48-LQFP (7x7) package is identical, allowing direct PCB layout reuse without redesign.
• Compliance Status: Both parts maintain ROHS3 compliance and identical MSL ratings, supporting equivalent supply chain and manufacturing requirements.
• Product Availability: The MC9S12C32CFAE25 is classified as Active, providing long-term availability and supply continuity compared to the obsolete HD64F3694GFYV.
• Enhanced Specifications: The substitute offers higher operating speed (25MHz vs. 20MHz), extended voltage supply range (2.35V ~ 5.5V vs. 3V ~ 5.5V), and broader temperature range (-40°C ~ 85°C vs. -20°C ~ 75°C), providing design margin improvements.

Frequently Asked Questions (FAQ)

Q: Can the MC9S12C32CFAE25 directly replace the HD64F3694GFYV in existing designs?

A: Direct PCB replacement is supported due to identical 48-LQFP package footprint and matching memory configuration. However, firmware validation is required due to different processor architectures (H8/300H vs. HCS12). Instruction set compatibility must be assessed during integration.

Q: What are the key differences between these two microcontrollers?

A: The primary differences are processor architecture (Renesas H8/300H vs. NXP HCS12), manufacturer, and enhanced specifications in the substitute. The MC9S12C32CFAE25 provides higher clock speed, wider voltage range, and extended temperature operating range. Connectivity peripherals differ: the main part includes I2C and LVD, while the substitute includes CANbus, EBI/EMI, and SPI.

Q: Are there any pin-to-pin compatibility concerns?

A: Both devices use the 48-LQFP package with identical physical dimensions. Pin count matches at 48 pins. However, pin function assignments differ between the H8/300H and HCS12 architectures. Complete pinout verification against application schematics is required before implementation.

Q: What compliance certifications apply to both parts?

A: Both the HD64F3694GFYV and MC9S12C32CFAE25 are ROHS3 compliant, REACH unaffected, and classified under ECCN EAR99. Both maintain MSL 3 (168 Hours) moisture sensitivity ratings.

Q: Is the MC9S12C32CFAE25 available in the same packaging options?

A: The substitute is supplied in Tray packaging, while the main part packaging specification is not detailed. Both use identical 48-LQFP (7x7) case format for the die package itself. Confirm packaging requirements with your procurement specifications.

Q: What is the impact of the speed difference (20MHz vs. 25MHz)?

A: The substitute operates at 25MHz compared to the main part's 20MHz. This higher speed provides performance headroom but requires validation that firmware timing-critical operations remain within specification. Clock-dependent peripheral configurations may require adjustment.