HCPL-M600 Equivalent & Substitute Parts

Part Overview

The HCPL-M600 is a logic output optoisolator manufactured by Broadcom Limited, designed for high-speed digital isolation applications. This 3750Vrms isolation-rated component features open collector output with Schottky clamping, supporting 10MBd data rates and 10kV/µs common mode transient immunity. The part is currently active in production with 2216 units in stock. Substitute parts are identified when equivalent electrical and mechanical parameters are maintained across isolation voltage, output configuration, data rate, and package specifications.

Substiute Parts

HCPL-M600

Broadcom LimitedIn Stock: 2286HCPL-M600 Datasheet

Current PartRFQ

HCPL-M600-000E

Broadcom LimitedIn Stock: 15737HCPL-M600-000E Datasheet

DirectRFQ

FODM611

onsemiIn Stock: 6758FODM611 Datasheet

DirectRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitute parts for the HCPL-M600 are qualified based on the following critical parameters that determine functional equivalence:

• Isolation Voltage: 3750Vrms (exact match required)
• Output Configuration: Open Collector, Schottky Clamped (exact match required)
• Number of Channels: 1 (exact match required)
• Input Type: DC (exact match required)
• Data Rate: 10MBd or 10Mbps (functionally equivalent)
• Supply Voltage Range: 4.5V ~ 5.5V (exact match required)
• Operating Temperature Range: -40°C ~ 85°C (exact match required)
• Mounting Type: Surface Mount (exact match required)
• Package Type: 6-SOIC footprint with 5 leads (exact match required)

Two substitute parts meet these criteria: HCPL-M600-000E (Broadcom Limited, same manufacturer variant) and FODM611 (onsemi, cross-manufacturer equivalent).

Parameter Comparison

Engineering Selection Recommendations

HCPL-M600-000E is a direct manufacturer variant from Broadcom Limited with identical electrical specifications and package configuration. This substitute maintains all critical parameters including propagation delay and rise/fall time characteristics. The primary distinction is packaging format (Tube) and RoHS3 compliance status. Selection of this variant is appropriate when RoHS3 compliance is required or when tube packaging is preferred for automated assembly processes.

FODM611 is a cross-manufacturer equivalent from onsemi that maintains all critical isolation, output, and supply specifications. This part demonstrates superior common mode transient immunity (20kV/µs versus 10kV/µs) and higher maximum DC forward current (50mA versus 20mA). Propagation delay is slightly higher (100ns maximum versus 75ns maximum). This substitute is suitable for applications where enhanced noise immunity is beneficial and timing margins accommodate the increased propagation delay. RoHS3 compliance is available with this option.

Both substitute parts are active products with confirmed inventory availability and maintain the same 6-SOIC footprint for direct PCB compatibility.

Frequently Asked Questions (FAQ)

Q: Can HCPL-M600-000E be used as a direct replacement for HCPL-M600?

A: Yes. HCPL-M600-000E is a Broadcom Limited variant with identical electrical specifications, channel configuration, isolation voltage, output type, data rate, and package footprint. The primary differences are packaging format and RoHS compliance status. Electrical performance and PCB layout compatibility are equivalent.

Q: What are the key differences between HCPL-M600 and FODM611?

A: Both parts share identical isolation voltage (3750Vrms), output configuration (open collector, Schottky clamped), channel count (1), supply voltage range (4.5V ~ 5.5V), and package footprint (6-SOIC, 5 leads). FODM611 offers higher common mode transient immunity (20kV/µs versus 10kV/µs) and higher maximum DC forward current (50mA versus 20mA). FODM611 has slightly higher maximum propagation delay (100ns versus 75ns). The onsemi part is manufactured to ROHS3 compliance.

Q: Are there package compatibility concerns when substituting FODM611 for HCPL-M600?

A: Both parts use the same 6-SOIC footprint with 5 leads and identical pin assignments for surface mount assembly. PCB layout and footprint design require no modification. The supplier device package designation differs (5-Mini-Flat versus 5-SO), but this reflects internal packaging variation and does not affect PCB compatibility or electrical function.

Q: Which substitute should be selected for new designs?

A: Selection depends on specific design requirements. HCPL-M600-000E is appropriate when maintaining Broadcom sourcing or when RoHS3 compliance is mandatory. FODM611 is appropriate when enhanced common mode transient immunity (20kV/µs) provides design margin benefits or when onsemi supply chain preference exists. Both parts are active products with confirmed inventory.

Q: Do all three parts support the same data rate?

A: Yes. HCPL-M600 and HCPL-M600-000E specify 10MBd. FODM611 specifies 10Mbps. These designations are functionally equivalent for digital isolation applications. Propagation delay specifications (75ns maximum for Broadcom variants, 100ns maximum for onsemi) define the practical timing performance.