HCPL-817-W6AE Equivalent & Substitute Parts

Part Overview

The HCPL-817-W6AE is a 5000Vrms optoisolator with transistor output manufactured by Broadcom Limited. This single-channel, 4-DIP through-hole component provides galvanic isolation for DC input signals with a maximum output current of 50mA per channel. The part is currently active in production with 665 units in stock.

Substitute parts are necessary when the original HCPL-817-W6AE becomes unavailable, when higher isolation voltage ratings are required, or when alternative current transfer ratio specifications better match application requirements.

Substiute Parts

HCPL-817-W6AE
Broadcom LimitedIn Stock: 679HCPL-817-W6AE Datasheet
HCPL-817-W6AE
Current Part
ISP817A
Isocom Components 2004 LTDIn Stock: 12821ISP817A Datasheet
ISP817A
MFR Recommended
ISP817BX
Isocom Components 2004 LTDIn Stock: 870ISP817BX Datasheet
ISP817BX
MFR Recommended
ISP817CX
Isocom Components 2004 LTDIn Stock: 2718ISP817CX Datasheet
ISP817CX
MFR Recommended
TPC816A C9G
Taiwan Semiconductor CorporationIn Stock: 735TPC816A C9G Datasheet
TPC816A C9G
Parametric Equivalent

Key Parameters

Parameter Value
Manufacturer Part Number HCPL-817-W6AE
Manufacturer Broadcom Limited
Category Optoisolators
Number of Channels 1
Voltage - Isolation 5000Vrms
Current Transfer Ratio (Min) 80% @ 5mA
Current Transfer Ratio (Max) 160% @ 5mA
Rise / Fall Time (Typ) 4µs, 3µs
Output Type Transistor
Voltage - Output (Max) 70V
Current - Output / Channel 50mA
Vce Saturation (Max) 200mV
Operating Temperature -30°C ~ 100°C
Package / Case 4-DIP (0.400", 10.16mm)
Mounting Type Through Hole
RoHS Status ROHS3 Compliant
Product Status Active

Substitute Part Grouping Explanation

Substitution eligibility for the HCPL-817-W6AE is determined by the following critical parameters:

Mandatory Compatibility Parameters:

  • Number of Channels: 1
  • Output Type: Transistor
  • Input Type: DC
  • Mounting Type: Through Hole
  • Current - Output / Channel: 50mA
  • Voltage - Forward (Vf) (Typ): 1.2V
  • Current - DC Forward (If) (Max): 50mA
  • Vce Saturation (Max): 200mV
  • Rise / Fall Time (Typ): 4µs, 3µs
  • Operating Temperature: -30°C ~ 100°C

Allowable Variation Parameters:

  • Voltage - Isolation: Equal to or greater than 5000Vrms
  • Current Transfer Ratio (Min/Max): Equal to or greater than 80% @ 5mA minimum
  • Voltage - Output (Max): Equal to or greater than 70V
  • Package / Case: 4-DIP format (physical dimensions may vary within DIP standard)

Substitute parts are grouped into two categories: MFR Recommended substitutes (ISP817A, ISP817BX, ISP817CX from Isocom Components 2004 LTD) and Parametric Equivalents (TPC816A C9G from Taiwan Semiconductor Corporation).

Parameter Comparison

Parameter HCPL-817-W6AE ISP817A ISP817BX ISP817CX TPC816A C9G
Manufacturer Broadcom Limited Isocom Components 2004 LTD Isocom Components 2004 LTD Isocom Components 2004 LTD Taiwan Semiconductor Corporation
Number of Channels 1 1 1 1 1
Voltage - Isolation 5000Vrms 5300Vrms 5300Vrms 5300Vrms 5000Vrms
Current Transfer Ratio (Min) 80% @ 5mA 80% @ 5mA 130% @ 5mA 300% @ 5mA 80% @ 5mA
Current Transfer Ratio (Max) 160% @ 5mA 160% @ 5mA 260% @ 5mA 600% @ 5mA 160% @ 5mA
Rise / Fall Time (Typ) 4µs, 3µs 4µs, 3µs 4µs, 3µs 4µs, 3µs 4µs, 3µs
Output Type Transistor Transistor Transistor Transistor Transistor
Voltage - Output (Max) 70V 80V 80V 80V 70V
Current - Output / Channel 50mA 50mA 50mA 50mA 50mA
Vce Saturation (Max) 200mV 200mV 200mV 200mV 200mV
Operating Temperature -30°C ~ 100°C -30°C ~ 100°C -30°C ~ 100°C -30°C ~ 100°C -30°C ~ 100°C
Package / Case 4-DIP (0.400", 10.16mm) 4-DIP (0.300", 7.62mm) 4-DIP (0.300", 7.62mm) 4-DIP (0.300", 7.62mm) 4-DIP (0.400", 10.16mm)
Mounting Type Through Hole Through Hole Through Hole Through Hole Through Hole
RoHS Status ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant ROHS3 Compliant
Product Status Active Active Active Active Obsolete
Inventory (Pcs) 665 12790 808 2685 718

Engineering Selection Recommendations

ISP817A (Isocom Components 2004 LTD): This MFR recommended substitute provides identical current transfer ratio specifications (80%-160% @ 5mA) and matching rise/fall times. The isolation voltage is increased to 5300Vrms, and maximum output voltage is 80V. Physical package dimensions differ (0.300" vs 0.400" DIP), requiring PCB layout verification. Product status is active with high inventory availability (12790 units). ROHS3 compliance is maintained.

ISP817BX (Isocom Components 2004 LTD): This MFR recommended substitute offers higher current transfer ratio specifications (130%-260% @ 5mA), providing improved gain characteristics. Isolation voltage is 5300Vrms with 80V maximum output voltage. Physical package dimensions differ (0.300" vs 0.400" DIP). Product status is active with moderate inventory (808 units). ROHS3 compliance is maintained.

ISP817CX (Isocom Components 2004 LTD): This MFR recommended substitute provides the highest current transfer ratio specifications (300%-600% @ 5mA) among all substitutes. Isolation voltage is 5300Vrms with 80V maximum output voltage. Physical package dimensions differ (0.300" vs 0.400" DIP). Product status is active with good inventory availability (2685 units). ROHS3 compliance is maintained.

TPC816A C9G (Taiwan Semiconductor Corporation): This parametric equivalent matches the original part's isolation voltage (5000Vrms), current transfer ratio (80%-160% @ 5mA), and package dimensions (0.400" DIP). However, product status is obsolete, limiting long-term availability. Inventory is limited (718 units). ROHS3 compliance is maintained. This option is suitable only when exact parametric matching is required and obsolescence risk is acceptable.

Frequently Asked Questions (FAQ)

Q: Can ISP817A, ISP817BX, or ISP817CX be used as direct drop-in replacements for HCPL-817-W6AE?

A: These Isocom parts are functionally compatible but require PCB layout verification due to different DIP package dimensions (0.300" vs 0.400"). All three maintain identical rise/fall times (4µs, 3µs), output current (50mA), saturation voltage (200mV), and operating temperature range (-30°C to 100°C). Hole spacing and board footprints must be confirmed before substitution.

Q: What is the difference between ISP817A, ISP817BX, and ISP817CX?

A: The three Isocom variants differ only in current transfer ratio specifications. ISP817A matches the original (80%-160% @ 5mA). ISP817BX provides higher gain (130%-260% @ 5mA). ISP817CX provides the highest gain (300%-600% @ 5mA). All other electrical and thermal parameters are identical. Selection depends on circuit requirements for input-to-output current transfer characteristics.

Q: Why do the Isocom substitutes have higher isolation voltage (5300Vrms vs 5000Vrms)?

A: Higher isolation voltage is an allowable parameter variation that maintains backward compatibility. A 5300Vrms rated part can be used in applications designed for 5000Vrms isolation without functional degradation. This represents an improvement in isolation capability.

Q: Is TPC816A C9G a viable long-term substitute?

A: TPC816A C9G is a parametric equivalent with identical isolation voltage and current transfer ratio specifications. However, its obsolete product status and limited inventory (718 units) make it unsuitable for new designs or long-term production. It is appropriate only for legacy system maintenance where exact parametric matching is critical and immediate availability is not required.

Q: What are the compliance and regulatory considerations for these substitutes?

A: All substitute parts (ISP817A, ISP817BX, ISP817CX, and TPC816A C9G) maintain ROHS3 compliance, matching the original HCPL-817-W6AE. All parts carry EAR99 ECCN classification and REACH Unaffected status. Moisture sensitivity level is 1 (Unlimited) for all parts, indicating no special handling requirements during storage or assembly.

Q: Can package dimension differences affect circuit performance?

A: Package dimension differences (0.300" DIP for Isocom parts vs 0.400" DIP for the original) affect only PCB layout and hole spacing. Electrical performance, isolation characteristics, and switching behavior remain unchanged. PCB redesign or adapter solutions may be required for physical compatibility.

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