HCPL-2601#060 Equivalent & Substitute Parts

Part Overview

The HCPL-2601#060 is a logic output optoisolator manufactured by Broadcom Limited, designed for high-speed digital isolation applications. This 3750Vrms isolation device features open collector output with Schottky clamping, 10MBd data rate capability, and 10kV/µs common mode transient immunity in an 8-DIP through-hole package. The product is discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives for ongoing system support and new designs.

Substiute Parts

HCPL-2601#060

Broadcom LimitedIn Stock: 1006HCPL-2601#060 Datasheet

Current PartRFQ

6N137F

Toshiba Semiconductor and StorageIn Stock: 41136N137F Datasheet

MFR RecommendedRFQ

TLP2601(F)

Toshiba Semiconductor and StorageIn Stock: 851TLP2601(F) Datasheet

MFR RecommendedRFQ

TLP2601(LF1,F)

Toshiba Semiconductor and StorageIn Stock: 825TLP2601(LF1,F) Datasheet

MFR RecommendedRFQ

TLP2601(TP1,F)

Toshiba Semiconductor and StorageIn Stock: 1172TLP2601(TP1,F) Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the HCPL-2601#060 is determined by the following critical parameters:

Mandatory Compatibility Criteria:

• Single channel configuration (1 input, 0 side 2 inputs)
• Open collector output with Schottky clamping
• 10MBd data rate capability
• DC input type
• 4.5V to 5.5V supply voltage range
• Through-hole or surface-mount package options
• 8-pin DIP or 8-SMD package footprint

Acceptable Parameter Variations:

• Isolation voltage: 2500Vrms minimum (lower than original 3750Vrms)
• Common mode transient immunity: 200V/µs minimum (lower than original 10kV/µs)
• Output current: 25 mA minimum (lower than original 50 mA)
• Propagation delay: up to 75ns (faster than original 100ns)
• Operating temperature: 0°C to 70°C or -40°C to 85°C

The substitute parts identified are Toshiba TLP2601 series devices, which maintain functional equivalence in isolation topology, data rate, and package compatibility while offering active product status and RoHS compliance.

Parameter Comparison

Engineering Selection Recommendations

For Through-Hole Applications (Direct Package Replacement):

TLP2601(F) is the primary substitute for through-hole mounting. This device maintains the 8-DIP package format, supports -40°C to 85°C operating temperature range, and provides RoHS compliance. The reduced isolation voltage (2500Vrms vs. 3750Vrms) and lower common mode transient immunity (1kV/µs vs. 10kV/µs) are acceptable for applications where the original specifications exceed system requirements.

6N137F provides an alternative through-hole option with 50mA output current matching the original device. However, the 0°C to 70°C operating temperature range and 200V/µs common mode transient immunity may limit applicability in extended temperature or high-speed transient environments.

For Surface-Mount Applications:

TLP2601(TP1,F) is recommended for new designs requiring surface-mount technology. This variant maintains the -40°C to 85°C temperature range and 1kV/µs common mode transient immunity while offering 8-SMD gull wing packaging.

TLP2601(LF1,F) provides a surface-mount alternative with 0°C to 70°C operating temperature specification.

Compliance Considerations:

All Toshiba TLP2601 variants are RoHS compliant, addressing regulatory requirements not met by the discontinued Broadcom device. Product status is active for all recommended substitutes, ensuring long-term availability and supply chain stability.

Frequently Asked Questions (FAQ)

Q: Can TLP2601(F) directly replace HCPL-2601#060 in existing designs?

A: Yes, for applications where the isolation voltage requirement is 2500Vrms or lower and common mode transient immunity of 1kV/µs is sufficient. The 8-DIP package footprint is identical, and electrical interface (4.5V to 5.5V supply, 10MBd data rate, open collector output) is compatible. Verify that your circuit does not depend on the original device's 3750Vrms isolation or 10kV/µs CMTI specifications.

Q: What is the difference between TLP2601(F), TLP2601(LF1,F), and TLP2601(TP1,F)?

A: The primary differences are mounting type and operating temperature range. TLP2601(F) is through-hole 8-DIP with -40°C to 85°C range. TLP2601(LF1,F) and TLP2601(TP1,F) are both surface-mount 8-SMD variants; TLP2601(LF1,F) operates 0°C to 70°C while TLP2601(TP1,F) operates -40°C to 85°C. All three share identical electrical specifications for isolation voltage, data rate, and output characteristics.

Q: Why is 6N137F listed as a substitute if it has lower CMTI than TLP2601?

A: 6N137F maintains 50mA output current matching the original HCPL-2601#060, whereas TLP2601 variants provide 25mA. For applications requiring higher output current, 6N137F is a valid alternative. However, the 200V/µs CMTI specification is significantly lower than both the original device and TLP2601 options, making it suitable only for applications with slower transient environments.

Q: Is RoHS compliance required for my application?

A: All recommended Toshiba substitutes are RoHS compliant. If your design or supply chain mandates RoHS compliance, the discontinued HCPL-2601#060 is not suitable for new procurement. Toshiba TLP2601 series devices meet this requirement.

Q: Can I use a surface-mount TLP2601 variant in a through-hole application?

A: No. Surface-mount variants (TLP2601(LF1,F) and TLP2601(TP1,F)) require SMD soldering processes and cannot be directly installed in through-hole PCB designs. Use TLP2601(F) for through-hole applications.

Q: What happens if my circuit requires 3750Vrms isolation?

A: The available substitutes provide 2500Vrms isolation, which is lower than the original specification. If your application requires 3750Vrms isolation, these substitutes are not appropriate. Consult alternative optoisolator families with higher isolation ratings.