H3073-01 Equivalent & Substitute Parts

Part Overview

The H3073-01 is a Terminal Turret Connector manufactured by Harwin Inc., classified as a single-end, fork, hollow turret terminal with through-hole mounting and swage termination. This component is designed for applications requiring reliable electrical connection through printed circuit board assemblies. The H3073-01 is currently listed as obsolete, making identification of suitable substitute components essential for ongoing production support and legacy system maintenance.

Substiute Parts

H3073-01
Harwin Inc.In Stock: 1161H3073-01 Datasheet
H3073-01
Current Part
H2055-01
Harwin Inc.In Stock: 2294H2055-01 Datasheet
H2055-01
MFR Recommended

Key Parameters

Parameter H3073-01 Specification
Manufacturer Harwin Inc.
Category Terminals
Terminal Type Single End, Fork, Hollow
Mounting Type Through Hole
Termination Method Swage
Contact Material Brass Alloy
Contact Finish Tin
Insulation Non-Insulated
RoHS Status ROHS3 Compliant
MSL Rating 1 (Unlimited)
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution eligibility for the H3073-01 is determined by the following critical parameters:

  • Terminal configuration: Single end, fork, hollow geometry
  • Mounting methodology: Through-hole installation with swage termination
  • Material composition: Brass alloy contact with tin finish
  • Insulation classification: Non-insulated design
  • Environmental compliance: ROHS3 and REACH compliance status
  • Reliability rating: MSL 1 classification

The H2055-01 qualifies as a manufacturer-recommended substitute based on matching terminal type, mounting method, termination process, contact material, finish specification, and compliance certifications. Dimensional variations between the main part and substitute reflect different application requirements while maintaining functional compatibility within the turret terminal category.

Parameter Comparison

Parameter H3073-01 H2055-01
Manufacturer Harwin Inc. Harwin Inc.
Terminal Type Single End, Fork, Hollow Single End, Fork, Hollow
Mounting Type Through Hole Through Hole
Termination Swage Swage
Contact Material Brass Alloy Brass Alloy
Contact Finish Tin Tin
Insulation Non-Insulated Non-Insulated
Length - Above Board 0.344" ~ 0.363" (8.74mm ~ 9.23mm) 0.250" (6.35mm)
Mounting Hole Diameter 0.105" ~ 0.109" (2.67mm ~ 2.77mm) 0.094" ~ 0.097" (2.39mm ~ 2.46mm)
Board Thickness 0.063" (1.60mm) 0.094" (2.39mm)
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 1 (Unlimited) 1 (Unlimited)
Product Status Obsolete Active

Engineering Selection Recommendations

The H2055-01 is the manufacturer-recommended substitute for the obsolete H3073-01. Both components maintain ROHS3 compliance and REACH unaffected status, ensuring regulatory alignment for current production environments. The H2055-01 carries active product status with confirmed inventory availability, providing supply chain continuity for applications transitioning from the H3073-01.

Selection of the H2055-01 requires verification that dimensional differences, specifically the reduced length above board (6.35mm versus 8.74mm–9.23mm) and mounting hole diameter (2.39mm–2.46mm versus 2.67mm–2.77mm), are compatible with the target application's mechanical and electrical requirements. Board thickness accommodation (2.39mm for H2055-01 versus 1.60mm for H3073-01) must be evaluated for the intended circuit board assembly.

Frequently Asked Questions (FAQ)

Q: Why is the H3073-01 being phased out? A: The H3073-01 is classified as obsolete by the manufacturer. The H2055-01 represents the active product line continuation within Harwin's turret terminal portfolio.

Q: What are the primary dimensional differences between H3073-01 and H2055-01? A: The H2055-01 features a shorter above-board length (6.35mm versus 8.74mm–9.23mm), smaller mounting hole diameter (2.39mm–2.46mm versus 2.67mm–2.77mm), and accommodates thicker board assemblies (2.39mm versus 1.60mm).

Q: Are both parts electrically equivalent? A: Both components share identical terminal configuration, contact material (brass alloy), finish specification (tin), and insulation classification (non-insulated). Electrical equivalence is maintained across the substitution.

Q: Do compliance certifications remain consistent? A: Yes. Both the H3073-01 and H2055-01 maintain ROHS3 compliance, REACH unaffected status, and MSL 1 rating, ensuring regulatory continuity.

Q: What factors should determine substitution feasibility? A: Mechanical compatibility is the primary consideration. The application must accommodate the H2055-01's reduced above-board height and smaller mounting hole diameter, and the circuit board must support the 2.39mm thickness requirement.

Q: Is the H2055-01 currently available? A: Yes. The H2055-01 is listed as active product status with 2256 pieces in stock as new original inventory.

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