H11B23SD Equivalent & Substitute Parts

Part Overview

The H11B23SD is an optoisolator with Darlington output and base connection, manufactured by onsemi. This component provides 5300Vrms isolation in a 6-SMD surface mount package. The part is currently obsolete, making equivalent substitutes necessary for ongoing production and maintenance applications requiring single-channel optoisolation with Darlington output configuration.

Substiute Parts

H11B23SD

onsemiIn Stock: 1004H11B23SD Datasheet

Current PartRFQ

H11B1SR2VM

onsemiIn Stock: 2140H11B1SR2VM Datasheet

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H11B2SM

Isocom Components 2004 LTDIn Stock: 12410H11B2SM Datasheet

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H11B2SMT&R

Isocom Components 2004 LTDIn Stock: 808H11B2SMT&R Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution for the H11B23SD is determined by the following critical parameters:

• Single-channel optoisolator configuration
• Darlington output with base connection
• 6-SMD surface mount package with gull wing leads
• DC input type
• Vce saturation maximum of 1V
• Operating temperature range compatibility

The substitute parts maintain these core functional characteristics while varying in isolation voltage rating, current transfer ratio, and maximum output voltage. Selection depends on whether the application requires the specific 5300Vrms isolation level or can operate with alternative isolation ratings.

Parameter Comparison

Engineering Selection Recommendations

H11B1SR2VM is the primary substitute for applications requiring high isolation voltage. This onsemi part maintains the same manufacturer lineage as the H11B23SD, offers active product status with RoHS3 compliance, and provides 4170Vrms isolation with improved current transfer ratio of 500% at 1mA. The operating temperature minimum extends to -40°C, which is acceptable for most industrial applications. Tape & Reel packaging supports automated assembly processes.

H11B2SM and H11B2SMT&R are functionally equivalent alternatives from Isocom Components 2004 LTD. Both maintain the full -55°C to 100°C operating temperature range and active product status with RoHS3 compliance. These parts feature identical Darlington output configuration and 6-SMD package. The primary trade-off is reduced switching speed (125µs/100µs versus 25µs/18µs), which is acceptable for applications not requiring high-frequency switching. H11B2SMT&R offers Tape & Reel packaging for production environments, while H11B2SM is supplied in tube packaging.

Selection between these substitutes depends on isolation voltage requirements and switching speed specifications of the target application.

Frequently Asked Questions (FAQ)

Q: Can H11B1SR2VM replace H11B23SD in all applications?

A: H11B1SR2VM is compatible with applications where 4170Vrms isolation is sufficient. The lower isolation rating may not be suitable for high-voltage isolation requirements exceeding 4170Vrms. Verify isolation voltage requirements before substitution.

Q: What is the difference between H11B2SM and H11B2SMT&R?

A: Both parts are electrically identical. The difference is packaging: H11B2SM is supplied in tube format, while H11B2SMT&R is supplied in Tape & Reel format. Tape & Reel packaging is preferred for automated pick-and-place assembly.

Q: Why do H11B2SM and H11B2SMT&R have slower switching times?

A: The turn-on and turn-off times are 125µs and 100µs respectively, compared to 25µs and 18µs for H11B23SD and H11B1SR2VM. This difference is inherent to the Isocom design and does not affect applications with lower switching frequency requirements.

Q: Are all substitute parts RoHS compliant?

A: H11B1SR2VM, H11B2SM, and H11B2SMT&R are all RoHS3 compliant. The original H11B23SD does not specify RoHS status.

Q: What is the moisture sensitivity level for these parts?

A: All parts listed have Moisture Sensitivity Level (MSL) of 1, indicating unlimited shelf life without moisture control requirements.

Q: Can these parts be used interchangeably in existing PCB designs?

A: All substitute parts use the same 6-SMD Gull Wing package and pinout configuration, enabling direct PCB footprint compatibility. Electrical parameter differences must be verified against circuit requirements before implementation.