H11B2 Optoisolator Equivalent & Substitute Parts

Part Overview

The H11B2 is a 5300Vrms isolation optoisolator with Darlington output and base connection, manufactured by onsemi in a 6-DIP through-hole package. This component is classified as obsolete, making substitute part identification necessary for ongoing design support and procurement planning. The H11B2 provides single-channel isolation suitable for applications requiring high voltage isolation with Darlington output configuration.

Substiute Parts

H11B2

onsemiIn Stock: 2311H11B2 Datasheet

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H11B1M

onsemiIn Stock: 12380H11B1M Datasheet

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H11B2

onsemiIn Stock: 2311H11B2 Datasheet

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Key Parameters

Substitute Part Grouping Explanation

Substitution for the H11B2 optoisolator is determined by the following critical parameters:

• Single-channel configuration with Darlington output and base connection
• 6-DIP through-hole package format (0.300", 7.62mm)
• DC input type
• Isolation voltage rating of 5300Vrms or higher
• Operating temperature range compatibility
• Current transfer ratio performance at specified input current
• Output voltage and saturation characteristics

The H11B1M qualifies as a substitute based on matching package, channel configuration, output type, and input type. However, the H11B1M operates at a lower isolation voltage (4170Vrms) and exhibits different electrical performance characteristics in current transfer ratio, output voltage rating, and forward current specifications.

Parameter Comparison

Engineering Selection Recommendations

The H11B2 is obsolete; the H11B1M is the active substitute from onsemi. Selection between these parts depends on application isolation voltage requirements:

• If the application requires 5300Vrms isolation, the H11B2 remains the specified part, though procurement from legacy inventory only.
• If the application can operate at 4170Vrms isolation, the H11B1M is the recommended active substitute. The H11B1M provides higher current transfer ratio (500% vs. 200%), higher maximum output voltage (30V vs. 25V), and ROHS3 compliance.
• The H11B1M has a narrower operating temperature range (-40°C to 100°C vs. -55°C to 100°C). Applications requiring operation below -40°C must retain the H11B2.
• Both parts share identical package format, input type, output type, and switching time characteristics, enabling direct socket compatibility in most applications.
• The H11B1M requires lower forward current (80 mA max vs. 100 mA max), which may reduce input circuit power dissipation.

Frequently Asked Questions (FAQ)

Q: Can H11B1M directly replace H11B2 in existing designs?

A: Direct socket replacement is possible due to identical 6-DIP package and pin configuration. However, the lower isolation voltage rating (4170Vrms vs. 5300Vrms) must be evaluated against application requirements. If the design specifies 5300Vrms isolation as a requirement, substitution is not appropriate.

Q: What are the key electrical differences between H11B2 and H11B1M?

A: The H11B1M provides higher current transfer ratio (500% vs. 200% @ 1mA), higher maximum output voltage (30V vs. 25V), and lower maximum forward current (80 mA vs. 100 mA). The H11B2 maintains higher isolation voltage (5300Vrms vs. 4170Vrms) and wider operating temperature range (-55°C to 100°C vs. -40°C to 100°C).

Q: Is the H11B1M compliant with current environmental standards?

A: The H11B1M is ROHS3 compliant and REACH unaffected. The H11B2 is REACH unaffected but does not specify RoHS compliance status.

Q: What is the impact of different current transfer ratios?

A: Current transfer ratio determines the output current relative to input current. The H11B1M's higher ratio (500%) means greater output current for the same input current, potentially reducing input drive requirements compared to the H11B2 (200%).

Q: Are there temperature range considerations for substitution?

A: The H11B2 operates from -55°C to 100°C, while the H11B1M operates from -40°C to 100°C. Applications requiring operation below -40°C must use the H11B2.

Q: Do both parts use the same packaging format?

A: Yes. Both H11B2 and H11B1M use 6-DIP (0.300", 7.62mm) through-hole packages with identical pin configurations, enabling direct board-level replacement.