H11AV1FR2VM Equivalent & Substitute Parts

Part Overview

The H11AV1FR2VM is an optoisolator transistor with base output manufactured by onsemi, designed for high-voltage isolation applications requiring 4170Vrms isolation rating. This component features a single-channel transistor output configuration in a 6-SMD surface mount package. The part is currently listed as obsolete, making equivalent and substitute parts necessary for ongoing design support and procurement continuity.

Substiute Parts

H11AV1FR2VM
onsemiIn Stock: 1061H11AV1FR2VM Datasheet
H11AV1FR2VM
Current Part
H11AV1SR2VM
Fairchild SemiconductorIn Stock: 12427H11AV1SR2VM Datasheet
H11AV1SR2VM
Similar
H11AV1X
Isocom Components 2004 LTDIn Stock: 1553H11AV1X Datasheet
H11AV1X
Similar

Key Parameters

Parameter Value
Manufacturer Part Number H11AV1FR2VM
Manufacturer onsemi
Category Optoisolators
Product Status Obsolete
Number of Channels 1
Voltage - Isolation 4170Vrms
Current Transfer Ratio (Min) 100% @ 10mA
Current Transfer Ratio (Max) 300% @ 10mA
Output Type Transistor with Base
Voltage - Output (Max) 70V
Vce Saturation (Max) 400mV
Operating Temperature -40°C ~ 100°C
Mounting Type Surface Mount
Package / Case 6-SMD, Gull Wing

Substitute Part Grouping Explanation

Substitute parts for the H11AV1FR2VM are identified based on the following critical parameters that define functional equivalence:

  • Isolation Voltage: Minimum 4170Vrms (equal or higher acceptable)
  • Number of Channels: 1 channel required
  • Output Type: Transistor with Base configuration
  • Current Transfer Ratio: 100% minimum @ 10mA
  • Vce Saturation: 400mV maximum
  • Input Type: DC
  • Voltage - Output (Max): 70V minimum

Two substitute parts meet these criteria with varying trade-offs in packaging and performance characteristics.

Parameter Comparison

Parameter H11AV1FR2VM (Main) H11AV1SR2VM (Substitute) H11AV1X (Substitute)
Manufacturer onsemi Fairchild Semiconductor Isocom Components 2004 LTD
Product Status Obsolete Active Active
Number of Channels 1 1 1
Voltage - Isolation 4170Vrms 4170Vrms 5300Vrms
Current Transfer Ratio (Min) 100% @ 10mA 100% @ 10mA 100% @ 10mA
Current Transfer Ratio (Max) 300% @ 10mA 300% @ 10mA 300% @ 10mA
Output Type Transistor with Base Transistor with Base Transistor with Base
Voltage - Output (Max) 70V 70V 70V
Vce Saturation (Max) 400mV 400mV 400mV
Operating Temperature -40°C ~ 100°C -40°C ~ 100°C -55°C ~ 100°C
Mounting Type Surface Mount Surface Mount Through Hole
Package / Case 6-SMD, Gull Wing 6-SMD, Gull Wing 6-DIP (0.300", 7.62mm)
Voltage - Forward (Vf) (Typ) 1.18V 1.18V 1.2V
Current - DC Forward (If) (Max) 60 mA 60 mA 60 mA

Engineering Selection Recommendations

H11AV1SR2VM (Fairchild Semiconductor): This substitute maintains identical electrical specifications and package configuration to the main part. Product status is active with established supply availability. This part provides direct functional equivalence with no design modifications required. Compliance certifications match the original specification.

H11AV1X (Isocom Components 2004 LTD): This substitute meets all critical electrical parameters and provides enhanced isolation voltage (5300Vrms versus 4170Vrms). However, it requires package conversion from surface mount (6-SMD) to through-hole (6-DIP), necessitating PCB layout modifications. Operating temperature range extends to -55°C, providing broader environmental coverage. Product status is active. RoHS3 compliance is documented for this part.

Selection between substitutes depends on design constraints: H11AV1SR2VM for direct replacement without layout changes; H11AV1X for applications requiring through-hole mounting or extended temperature range.

Frequently Asked Questions (FAQ)

Q: Can H11AV1SR2VM replace H11AV1FR2VM without design changes? A: Yes. H11AV1SR2VM maintains identical electrical specifications, isolation voltage, current transfer ratio, output voltage, and saturation characteristics. Package configuration (6-SMD, Gull Wing) and mounting type (surface mount) are identical. No circuit or PCB modifications are required.

Q: What are the key differences between H11AV1X and the main part? A: H11AV1X differs in three aspects: (1) Mounting type is through-hole (6-DIP) versus surface mount (6-SMD), requiring PCB layout redesign; (2) Isolation voltage is higher at 5300Vrms versus 4170Vrms; (3) Operating temperature range extends to -55°C minimum versus -40°C. All other electrical parameters remain equivalent.

Q: Is H11AV1X suitable for surface mount applications? A: No. H11AV1X is a through-hole component (6-DIP package). It cannot be directly used in surface mount designs without significant PCB layout modifications and component placement changes.

Q: What compliance certifications apply to these substitute parts? A: H11AV1FR2VM and H11AV1SR2VM share REACH Unaffected status and EAR99 ECCN classification. H11AV1X is RoHS3 compliant with REACH Unaffected status and EAR99 ECCN classification.

Q: Are all three parts functionally equivalent for isolation voltage requirements? A: H11AV1FR2VM and H11AV1SR2VM both provide 4170Vrms isolation. H11AV1X provides 5300Vrms isolation, which exceeds the requirement. All three meet the minimum isolation voltage specification of 4170Vrms.

Q: What is the current transfer ratio specification across all parts? A: All three parts specify identical current transfer ratio: minimum 100% @ 10mA and maximum 300% @ 10mA. This parameter is consistent across H11AV1FR2VM, H11AV1SR2VM, and H11AV1X.

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