H11A3FVM Optoisolator Equivalent & Substitute Parts

Part Overview

The H11A3FVM is an optoisolator transistor with base output manufactured by onsemi, designed for high-voltage isolation applications. This component features a 7500Vpk isolation rating and single-channel transistor output configuration in a 6-SMD surface mount package. The product is currently obsolete, making identification of compatible substitute parts essential for ongoing system support and new design implementations where equivalent functionality is required.

Substiute Parts

H11A3FVM
onsemiIn Stock: 1105H11A3FVM Datasheet
H11A3FVM
Current Part
4N25SR2M
onsemiIn Stock: 943354N25SR2M Datasheet
4N25SR2M
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H11A3X
Isocom ComponentsIn Stock: 1809H11A3X Datasheet
H11A3X
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Key Parameters

Parameter Value
Manufacturer Part Number H11A3FVM
Manufacturer onsemi
Category Optoisolators
Number of Channels 1
Voltage - Isolation 7500Vpk
Current Transfer Ratio (Min) 20% @ 10mA
Output Type Transistor with Base
Voltage - Output (Max) 30V
Voltage - Forward (Vf) (Typ) 1.18V
Current - DC Forward (If) (Max) 60 mA
Vce Saturation (Max) 400mV
Turn On / Turn Off Time (Typ) 2µs, 2µs
Operating Temperature -40°C ~ 100°C
Mounting Type Surface Mount
Package / Case 6-SMD, Gull Wing
Product Status Obsolete

Substitute Part Grouping Explanation

Substitution eligibility for the H11A3FVM is determined by the following critical parameters:

  • Number of Channels: Must be 1 channel
  • Output Type: Must be Transistor with Base
  • Voltage - Output (Max): Must be 30V or greater
  • Current Transfer Ratio (Min): Must be 20% @ 10mA or higher
  • Voltage - Forward (Vf): Must be compatible with 1.18V typical specification
  • Current - DC Forward (If) (Max): Must support 60 mA maximum
  • Operating Temperature Range: Must encompass -40°C ~ 100°C minimum
  • Input Type: Must be DC

The H11A3FVM has two identified substitute parts: 4N25SR2M and H11A3X. Both maintain the core functional parameters of single-channel transistor output optoisolators with compatible electrical characteristics. However, substitution considerations include isolation voltage rating differences and package type variations.

Parameter Comparison

Parameter H11A3FVM (Main) 4N25SR2M H11A3X
Manufacturer onsemi onsemi Isocom Components
Number of Channels 1 1 1
Voltage - Isolation 7500Vpk 4170Vrms 5300Vrms
Current Transfer Ratio (Min) 20% @ 10mA 20% @ 10mA 20% @ 10mA
Output Type Transistor with Base Transistor with Base Transistor with Base
Voltage - Output (Max) 30V 30V 30V
Voltage - Forward (Vf) (Typ) 1.18V 1.18V 1.2V
Current - DC Forward (If) (Max) 60 mA 60 mA 60 mA
Vce Saturation (Max) 400mV 500mV 400mV
Turn On / Turn Off Time (Typ) 2µs, 2µs 2µs, 2µs Not specified
Operating Temperature -40°C ~ 100°C -40°C ~ 100°C -55°C ~ 100°C
Mounting Type Surface Mount Surface Mount Through Hole
Package / Case 6-SMD, Gull Wing 6-SMD, Gull Wing 6-DIP (0.300", 7.62mm)
Product Status Obsolete Active Active

Engineering Selection Recommendations

4N25SR2M Substitution: This part maintains identical package configuration (6-SMD, Gull Wing) and electrical characteristics with the H11A3FVM, enabling direct board-level replacement without layout modifications. The 4N25SR2M is manufactured by onsemi and carries Active product status with ROHS3 compliance certification. The isolation voltage rating of 4170Vrms is lower than the H11A3FVM's 7500Vpk specification; substitution is appropriate only when system isolation requirements do not mandate the higher voltage rating. The Vce saturation specification increases from 400mV to 500mV, which may impact switching performance in current-sensitive applications.

H11A3X Substitution: This part provides equivalent electrical functionality with Active product status and ROHS3 compliance. The H11A3X is manufactured by Isocom Components and features a 6-DIP through-hole package, requiring board redesign and layout modifications compared to the surface-mount H11A3FVM. The isolation voltage rating of 5300Vrms is lower than the main part. The operating temperature range extends to -55°C, providing broader low-temperature capability. Current output per channel is specified at 50mA, which is lower than the H11A3FVM's unspecified maximum. This substitution is suitable for applications where through-hole mounting is preferred and isolation voltage requirements are compatible.

Frequently Asked Questions (FAQ)

Q: Can the 4N25SR2M directly replace the H11A3FVM without board modifications?

A: Yes. Both parts use identical 6-SMD, Gull Wing surface mount packaging. Pin configuration and electrical interface compatibility allow direct substitution without PCB layout changes. Verify that system isolation voltage requirements are satisfied by the 4N25SR2M's 4170Vrms rating.

Q: What is the primary difference between the two substitute parts?

A: The 4N25SR2M maintains surface mount packaging identical to the H11A3FVM, while the H11A3X requires through-hole mounting. The H11A3X offers extended low-temperature operation to -55°C. Both parts have lower isolation voltage ratings than the original component.

Q: Is the H11A3X suitable for high-speed switching applications?

A: The H11A3X does not specify turn-on/turn-off time parameters. The H11A3FVM and 4N25SR2M both specify 2µs switching times. If switching speed is critical to system performance, the 4N25SR2M is the preferred substitute.

Q: What compliance certifications apply to the substitute parts?

A: Both 4N25SR2M and H11A3X carry ROHS3 compliance certification and REACH Unaffected status. Both are classified under ECCN EAR99 and HTSUS 8541.49.8000.

Q: Does the higher Vce saturation of the 4N25SR2M affect circuit performance?

A: The 4N25SR2M specifies 500mV maximum Vce saturation compared to 400mV for the H11A3FVM. This 100mV difference may impact power dissipation and switching characteristics in applications with tight saturation voltage requirements. Evaluate circuit tolerance specifications before substitution.

Q: Can I use the H11A3X in a surface mount assembly process?

A: No. The H11A3X is a through-hole component with 6-DIP package configuration. Surface mount assembly equipment cannot process this part. Board redesign and manual insertion or selective soldering is required.

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