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GLF2012T1R0M Equivalent & Substitute Parts
Part Overview
The GLF2012T1R0M is a 1 µH shielded drum core wirewound inductor manufactured by TDK Corporation, rated for 850 mA with 70mOhm DC resistance in a 0805 (2012 Metric) surface mount package. This component is classified as obsolete, necessitating identification of equivalent substitute parts for ongoing production and maintenance applications. Substitute parts must maintain the same inductance value, package form factor, and shielding characteristics while accommodating variations in current rating and DC resistance within acceptable design margins.
Substiute Parts
Key Parameters
| Parameter | GLF2012T1R0M |
|---|---|
| Inductance | 1 µH |
| Inductance Tolerance | ±20% |
| Current Rating | 850 mA |
| DC Resistance (DCR) | 70mOhm |
| Saturation Current (Isat) | 275mA |
| Package / Case | 0805 (2012 Metric) |
| Shielding | Shielded |
| Core Type | Ferrite |
| Operating Temperature Range | -20°C ~ 105°C |
| Mounting Type | Surface Mount |
Substitute Part Grouping Explanation
Substitution eligibility for the GLF2012T1R0M is determined by the following mandatory parameters:
- Inductance Value: Must be 1 µH (identical)
- Package / Case: Must be 0805 (2012 Metric) (identical)
- Shielding: Must be shielded (identical)
- Core Material: Must be ferrite (identical)
- Mounting Type: Must be surface mount (identical)
Allowable variations in substitute parts include:
- Current Rating: May differ from 850 mA provided the substitute rating meets or exceeds the application requirement
- DC Resistance (DCR): May vary; higher DCR values are acceptable if thermal and power dissipation constraints are satisfied
- Inductance Tolerance: May differ from ±20%
- Operating Temperature Range: May differ; substitute range must encompass the application operating conditions
- Product Status: Active or Not For New Designs status is acceptable for substitution purposes
Parameter Comparison
| Parameter | GLF2012T1R0M | MLZ2012A1R0MT000 | LQM21FN1R0N00D |
|---|---|---|---|
| Manufacturer | TDK Corporation | TDK Corporation | Murata Electronics |
| Inductance | 1 µH | 1 µH | 1 µH |
| Inductance Tolerance | ±20% | ±20% | ±30% |
| Current Rating (Amps) | 850 mA | 900 mA | 220 mA |
| Saturation Current (Isat) | 275mA | 280mA | 220mA |
| DC Resistance (DCR) | 70mOhm | 100mOhm | 260mOhm Max |
| Package / Case | 0805 (2012 Metric) | 0805 (2012 Metric) | 0805 (2012 Metric) |
| Shielding | Shielded | Shielded | Shielded |
| Core Type | Drum Core, Wirewound | Multilayer | Multilayer |
| Operating Temperature Range | -20°C ~ 105°C | -55°C ~ 125°C | -40°C ~ 85°C |
| Product Status | Obsolete | Not For New Designs | Active |
| RoHS Status | Not specified | ROHS3 Compliant | ROHS3 Compliant |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) | 1 (Unlimited) |
Engineering Selection Recommendations
MLZ2012A1R0MT000 (TDK Corporation): This substitute maintains TDK Corporation manufacturing continuity and provides superior current rating (900 mA vs. 850 mA). The part is classified as Not For New Designs but remains available with 5400 pieces in stock. ROHS3 compliance is confirmed. The increased DC resistance (100mOhm vs. 70mOhm) and extended operating temperature range (-55°C ~ 125°C) must be evaluated against specific application thermal and performance requirements. The multilayer construction differs from the original drum core wirewound design.
LQM21FN1R0N00D (Murata Electronics): This substitute is classified as Active product status, ensuring long-term availability and supply chain stability. ROHS3 compliance is confirmed. However, the current rating (220 mA) is significantly lower than the original part (850 mA), and the DC resistance (260mOhm Max) is substantially higher. This substitute is suitable only for applications with reduced current requirements. The operating temperature range (-40°C ~ 85°C) is narrower than the original specification.
Frequently Asked Questions (FAQ)
Q: Can MLZ2012A1R0MT000 be used as a direct replacement for GLF2012T1R0M?
A: MLZ2012A1R0MT000 meets the mandatory substitution criteria: identical 1 µH inductance, 0805 package, shielded ferrite core, and surface mount configuration. The higher current rating (900 mA) and extended temperature range provide design margin. However, the increased DC resistance (100mOhm vs. 70mOhm) results in higher power dissipation. Thermal analysis is required to confirm suitability for the specific application.
Q: Is LQM21FN1R0N00D suitable for high-current applications?
A: No. LQM21FN1R0N00D is rated for 220 mA maximum current, which is significantly below the original GLF2012T1R0M rating of 850 mA. This substitute is applicable only to applications with current requirements not exceeding 220 mA.
Q: What is the difference between drum core wirewound and multilayer inductor construction?
A: The GLF2012T1R0M uses drum core wirewound construction, while both substitute parts use multilayer construction. Both designs achieve the same inductance value and package form factor. Multilayer inductors typically offer improved high-frequency performance and different Q characteristics. The choice between construction types depends on application frequency response and EMI requirements.
Q: Are all three parts RoHS compliant?
A: The GLF2012T1R0M RoHS status is not specified in the provided data. MLZ2012A1R0MT000 and LQM21FN1R0N00D are both ROHS3 compliant. Verification of RoHS compliance requirements for the application is necessary before final part selection.
Q: What is the impact of increased DC resistance in the MLZ2012A1R0MT000 substitute?
A: The MLZ2012A1R0MT000 has 100mOhm DCR compared to 70mOhm in the original part. At rated current (850 mA), this results in additional power dissipation of approximately 13.6 mW. Thermal design analysis is required to ensure the component and surrounding circuit board can dissipate this additional heat within acceptable operating temperature limits.
Q: Can these parts be used interchangeably in existing designs?
A: Interchangeability is limited to the 0805 package form factor and PCB footprint. Electrical performance differences, particularly in current rating and DC resistance, require circuit-level validation. Thermal and performance testing is recommended before production implementation.
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