GDZ12B-HG3-08 Equivalent & Substitute Parts

Part Overview

The GDZ12B-HG3-08 is a 12 V Zener diode rated for 200 mW power dissipation in a surface mount SOD-323 package. Manufactured by Vishay General Semiconductor - Diodes Division, this component is classified as Active and carries AEC-Q101 automotive qualification. The device operates across a temperature range of -65°C to 150°C with ±2% voltage tolerance and is ROHS3 compliant.

Substitute parts become necessary when the primary manufacturer part experiences extended lead times, inventory constraints, or supply chain disruptions. Equivalent components must maintain identical electrical specifications and mechanical compatibility to ensure direct replacement without circuit redesign.

Substiute Parts

GDZ12B-HG3-08
Vishay General Semiconductor - Diodes DivisionIn Stock: 909GDZ12B-HG3-08 Datasheet
GDZ12B-HG3-08
Current Part
UDZ12B-7
Diodes IncorporatedIn Stock: 80269UDZ12B-7 Datasheet
UDZ12B-7
Parametric Equivalent

Key Parameters

Parameter Specification
Voltage - Zener (Nom) 12 V
Tolerance ±2%
Power - Max 200 mW
Impedance (Max) 30 Ohms
Current - Reverse Leakage @ Vr 100 nA @ 9 V
Operating Temperature Range -65°C ~ 150°C
Package / Case SOD-323
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution of the GDZ12B-HG3-08 is determined by strict equivalence across the following critical parameters:

Electrical Specifications:

  • Zener voltage: 12 V nominal
  • Voltage tolerance: ±2%
  • Maximum power dissipation: 200 mW
  • Maximum impedance: 30 Ohms
  • Reverse leakage current: 100 nA @ 9 V

Mechanical & Environmental Specifications:

  • Package type: SOD-323
  • Mounting configuration: Surface Mount
  • Operating temperature range: -65°C to 150°C
  • Moisture sensitivity: MSL 1 (Unlimited)

Compliance & Regulatory:

  • RoHS3 compliance
  • REACH unaffected status
  • ECCN: EAR99
  • HTSUS: 8541.10.0050

Substitute parts must match all parameters listed above without deviation. Parts that differ in any electrical specification, package type, or compliance status are not considered equivalent.

Parameter Comparison

Parameter GDZ12B-HG3-08 (Vishay) UDZ12B-7 (Diodes Inc.)
Manufacturer Vishay General Semiconductor - Diodes Division Diodes Incorporated
Category Diodes, Zener Diodes, Zener
Voltage - Zener (Nom) 12 V 12 V
Tolerance ±2% ±2%
Power - Max 200 mW 200 mW
Impedance (Max) 30 Ohms 30 Ohms
Current - Reverse Leakage @ Vr 100 nA @ 9 V 100 nA @ 9 V
Operating Temperature Range -65°C ~ 150°C -65°C ~ 150°C
Mounting Type Surface Mount Surface Mount
Package / Case SOD-323 SOD-323
Supplier Device Package SOD-323 SOD-323
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level 1 (Unlimited) 1 (Unlimited)
REACH Status REACH Unaffected REACH Unaffected
ECCN EAR99 EAR99
HTSUS 8541.10.0050 8541.10.0050
Product Status Active Active

Engineering Selection Recommendations

The UDZ12B-7 manufactured by Diodes Incorporated is a direct parametric equivalent to the GDZ12B-HG3-08. Both components are Active products with identical electrical and mechanical specifications across all critical parameters.

Selection Basis:

Both parts maintain Active product status, ensuring continued manufacturer support and availability. Both are ROHS3 compliant and REACH unaffected, satisfying regulatory requirements for current and future applications. The GDZ12B-HG3-08 carries AEC-Q101 automotive qualification; this qualification status is specific to the Vishay part and is not replicated in the UDZ12B-7 specification data provided. Applications requiring explicit AEC-Q101 certification must verify qualification status with Diodes Incorporated before substitution.

Electrical performance is identical across both parts: 12 V nominal zener voltage with ±2% tolerance, 200 mW maximum power dissipation, 30 Ohms maximum impedance, and 100 nA reverse leakage current at 9 V. Operating temperature range, package type, and moisture sensitivity are equivalent.

The UDZ12B-7 is available in significantly higher inventory (80,200 pieces) compared to the GDZ12B-HG3-08 (898 pieces), making it suitable for applications where supply continuity is a priority.

Frequently Asked Questions (FAQ)

Q: Can the UDZ12B-7 replace the GDZ12B-HG3-08 in all applications?

A: The UDZ12B-7 is electrically and mechanically equivalent to the GDZ12B-HG3-08 across all provided specifications. However, the GDZ12B-HG3-08 carries AEC-Q101 automotive qualification while the UDZ12B-7 specification data does not indicate this certification. Applications requiring explicit AEC-Q101 compliance must confirm qualification status with the manufacturer before substitution.

Q: Are the packages identical?

A: Both parts use the SOD-323 package in surface mount configuration. Physical dimensions, lead spacing, and PCB footprint are equivalent, enabling direct board-level substitution without layout modifications.

Q: What are the key electrical parameters that must match for substitution?

A: Zener voltage (12 V), voltage tolerance (±2%), maximum power dissipation (200 mW), maximum impedance (30 Ohms), and reverse leakage current (100 nA @ 9 V) must all match exactly. Any deviation in these parameters disqualifies a part as an equivalent substitute.

Q: Do both parts meet the same environmental and compliance standards?

A: Both parts are ROHS3 compliant, REACH unaffected, and carry identical ECCN (EAR99) and HTSUS (8541.10.0050) classifications. Both operate across -65°C to 150°C and have MSL 1 (Unlimited) moisture sensitivity ratings.

Q: What is the difference in inventory availability?

A: The GDZ12B-HG3-08 has 898 pieces in stock, while the UDZ12B-7 has 80,200 pieces available. The UDZ12B-7 offers significantly higher inventory depth for applications requiring larger quantities or extended supply assurance.

Q: Can these parts be used interchangeably on the same PCB assembly?

A: Yes. Both parts are surface mount devices in identical SOD-323 packages with equivalent electrical specifications. No circuit design changes, PCB layout modifications, or assembly process adjustments are required for substitution.

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