GD5F4GQ4RBYIGY Equivalent & Substitute Parts

Part Overview

The GD5F4GQ4RBYIGY is a 4Gbit NAND Flash memory IC with SPI Quad I/O interface, manufactured by GigaDevice Semiconductor (HK) Limited. This component operates at 120 MHz clock frequency with a supply voltage range of 1.7V to 2V and is housed in an 8-WSON (6x8) package. The part is currently classified as obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new designs requiring this memory capacity and interface specification.

Substiute Parts

GD5F4GQ4RBYIGY

GigaDevice Semiconductor (HK) LimitedIn Stock: 872GD5F4GQ4RBYIGY Datasheet

Current PartRFQ

GD5F4GM8REWIGY

GigaDevice Semiconductor (HK) LimitedIn Stock: 1185GD5F4GM8REWIGY Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the GD5F4GQ4RBYIGY is determined by the following critical parameters:

• Memory Capacity: 4Gbit capacity requirement
• Memory Interface: SPI Quad I/O interface compatibility
• Supply Voltage: 1.7V ~ 2V operating range
• Operating Temperature Range: -40°C ~ 85°C
• Package Type: 8-WDFN Exposed Pad surface mount configuration
• Compliance: RoHS3 compliance status

The substitute part GD5F4GM8REWIGY meets these core substitution criteria while maintaining functional equivalence for the primary electrical and mechanical specifications.

Parameter Comparison

Engineering Selection Recommendations

The GD5F4GM8REWIGY serves as a functional substitute for the obsolete GD5F4GQ4RBYIGY based on the following engineering criteria:

Electrical Compatibility: Both parts maintain identical 4Gbit capacity, SPI Quad I/O interface, and 1.7V ~ 2V supply voltage specification, ensuring direct functional replacement in circuit designs.

Thermal Compatibility: Matching -40°C ~ 85°C operating temperature range permits use in equivalent thermal environments without design modification.

Package Compatibility: Both components utilize 8-WDFN Exposed Pad surface mount packages. Physical footprint differences between 8-WSON (6x8) and 8-WSON (5x6) variants require PCB layout verification prior to implementation.

Product Status: The substitute part maintains active product status, ensuring continued availability and manufacturing support compared to the obsolete main part.

Performance Consideration: The substitute operates at 104 MHz versus the main part's 120 MHz specification. System designs dependent on maximum clock frequency performance require validation against actual application timing requirements.

Frequently Asked Questions (FAQ)

Q: Can GD5F4GM8REWIGY directly replace GD5F4GQ4RBYIGY without PCB modification?

A: Electrical substitution is valid. Physical package dimensions differ (8-WSON 6x8 versus 5x6), requiring PCB footprint verification. Pin configuration compatibility must be confirmed against schematic documentation.

Q: What is the significance of the DTR (Dual Transfer Rate) feature in the substitute part?

A: DTR capability in GD5F4GM8REWIGY provides enhanced data transfer modes not present in the main part. This feature is backward compatible with standard SPI Quad I/O operation and does not prevent substitution.

Q: Does the 104 MHz clock frequency of the substitute affect system performance?

A: The substitute operates at 16 MHz lower frequency than the main part. Applications with timing-critical requirements must validate that 104 MHz operation meets system specifications. Non-timing-critical applications are unaffected.

Q: Are there compliance differences between the two parts?

A: The main part specifies ROHS3 compliance. The substitute part's compliance status is not provided in available documentation. Compliance verification is required for applications with regulatory requirements.

Q: What is the memory organization difference between these parts?

A: The main part uses 512M x 8 organization while the substitute uses 1G x 4 organization. Both configurations deliver 4Gbit total capacity and are functionally equivalent for SPI interface operation.