GD5F4GQ4RBYIGR Equivalent & Substitute Parts

Part Overview

The GD5F4GQ4RBYIGR is a 4Gbit NAND Flash memory IC with SPI Quad I/O interface, manufactured by GigaDevice Semiconductor (HK) Limited. This component operates at 120 MHz clock frequency with a supply voltage range of 1.7V to 2V and is housed in an 8-WSON (6x8) package. The product is currently classified as Obsolete, necessitating identification of functionally equivalent alternatives for ongoing system support and new designs requiring this memory capacity and interface specification.

Substiute Parts

GD5F4GQ4RBYIGR
GigaDevice Semiconductor (HK) LimitedIn Stock: 3320GD5F4GQ4RBYIGR Datasheet
GD5F4GQ4RBYIGR
Current Part
GD5F4GM8REWIGR
GigaDevice Semiconductor (HK) LimitedIn Stock: 1011GD5F4GM8REWIGR Datasheet
GD5F4GM8REWIGR
MFR Recommended

Key Parameters

Parameter Value
Memory Size 4Gbit
Memory Format FLASH
Technology FLASH - NAND
Memory Interface SPI - Quad I/O
Clock Frequency 120 MHz
Voltage - Supply 1.7V ~ 2V
Operating Temperature -40°C ~ 85°C (TA)
Package / Case 8-WDFN Exposed Pad
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant

Substitute Part Grouping Explanation

Substitution of the GD5F4GQ4RBYIGR is determined by the following critical parameters:

  • Memory Capacity: 4Gbit capacity requirement
  • Memory Interface: SPI Quad I/O interface compatibility
  • Supply Voltage: 1.7V ~ 2V operating range
  • Operating Temperature: -40°C ~ 85°C range
  • Package Type: 8-WDFN Exposed Pad surface mount configuration
  • Compliance: ROHS3 compliance status

The substitute part GD5F4GM8REWIGR maintains compatibility across these core parameters while offering enhanced performance characteristics within the same product family.

Parameter Comparison

Parameter GD5F4GQ4RBYIGR (Main) GD5F4GM8REWIGR (Substitute)
Memory Size 4Gbit 4Gbit
Memory Format FLASH FLASH
Technology FLASH - NAND FLASH - NAND (SLC)
Memory Interface SPI - Quad I/O SPI - Quad I/O, DTR
Clock Frequency 120 MHz 104 MHz
Voltage - Supply 1.7V ~ 2V 1.7V ~ 2V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Package / Case 8-WDFN Exposed Pad 8-WDFN Exposed Pad
Mounting Type Surface Mount Surface Mount
Product Status Obsolete Active
Access Time Not specified 9 ns
Write Cycle Time - Word, Page Not specified 600µs

Engineering Selection Recommendations

The GD5F4GM8REWIGR serves as the primary substitute for the obsolete GD5F4GQ4RBYIGR. Both components share identical memory capacity (4Gbit), supply voltage range (1.7V ~ 2V), operating temperature range (-40°C ~ 85°C), and package configuration (8-WDFN Exposed Pad). The substitute maintains SPI Quad I/O interface compatibility with the addition of DTR (Double Transfer Rate) capability.

The substitute part is classified as Active product status, ensuring continued availability and manufacturing support. Both components comply with ROHS3 requirements, supporting equivalent environmental and regulatory compliance profiles.

The GD5F4GM8REWIGR operates at 104 MHz clock frequency compared to the main part's 120 MHz specification. This represents a 13% reduction in maximum clock frequency. System designs operating at or below 104 MHz clock rates will experience full functional compatibility. Designs requiring operation specifically at 120 MHz must evaluate timing margins and potential performance impact.

Frequently Asked Questions (FAQ)

Q: Can GD5F4GM8REWIGR directly replace GD5F4GQ4RBYIGR in existing designs?

A: Direct replacement is possible when system clock frequency requirements do not exceed 104 MHz. Both components share identical memory capacity, supply voltage, operating temperature range, and package configuration. Verify that your application's clock frequency specification accommodates the 104 MHz maximum of the substitute part.

Q: What is the difference between the memory organization specifications?

A: The main part specifies 512M x 8 organization while the substitute specifies 1G x 4 organization. Both configurations deliver 4Gbit total capacity. The difference reflects internal memory architecture; functional capacity and interface behavior remain equivalent for SPI Quad I/O applications.

Q: Are there package dimension differences between these parts?

A: Both components use 8-WDFN Exposed Pad packages. The main part specifies 6x8 dimensions while the substitute specifies 5x6 dimensions. Verify PCB footprint compatibility before implementation. Physical package size differences may require layout modifications.

Q: What does DTR (Double Transfer Rate) capability mean for the substitute part?

A: DTR capability in the GD5F4GM8REWIGR enables data transfer on both rising and falling clock edges, potentially improving data throughput. This feature is optional and does not affect standard SPI Quad I/O operation. Existing designs using standard single data rate operation will function without modification.

Q: Is the substitute part suitable for new designs?

A: Yes. The GD5F4GM8REWIGR is classified as Active product status, ensuring manufacturing availability and long-term support. It is the recommended choice for new designs requiring 4Gbit SPI Quad I/O NAND Flash memory in the 8-WDFN package.

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