GD25VE16CSIGR Equivalent & Substitute Parts

Part Overview

The GD25VE16CSIGR is a 16Mbit NOR Flash memory IC with SPI Quad I/O interface, designed for non-volatile data storage applications requiring high-speed serial access. This device operates at 104 MHz clock frequency and is housed in an 8-SOIC surface mount package. The part is currently discontinued at DiGi Electronics, necessitating identification of functionally equivalent alternatives for ongoing production and maintenance applications.

Substiute Parts

GD25VE16CSIGR
GigaDevice Semiconductor (HK) LimitedIn Stock: 945GD25VE16CSIGR Datasheet
GD25VE16CSIGR
Current Part
GD25VQ16CSIGR
GigaDevice Semiconductor (HK) LimitedIn Stock: 787GD25VQ16CSIGR Datasheet
GD25VQ16CSIGR
Direct

Key Parameters

Parameter Value
Memory Type Non-Volatile FLASH
Memory Size 16Mbit
Memory Organization 2M x 8
Memory Interface SPI - Quad I/O
Clock Frequency 104 MHz
Voltage Supply Range 2.1V ~ 3.6V
Operating Temperature -40°C ~ 85°C
Package Type 8-SOIC (0.209", 5.30mm Width)
RoHS Status ROHS3 Compliant
MSL Rating 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the GD25VE16CSIGR is determined by the following critical parameters:

  • Memory capacity: 16Mbit (2M x 8 organization)
  • Interface protocol: SPI with Quad I/O capability
  • Clock frequency: 104 MHz minimum
  • Package: 8-SOIC form factor with identical pin pitch and dimensions
  • Supply voltage compatibility: Overlapping operational range
  • Temperature rating: Matching or exceeding -40°C to 85°C range
  • Compliance certifications: ROHS3 and REACH status alignment

The GD25VQ16CSIGR meets all substitution criteria as a direct equivalent from the same manufacturer, with identical memory specifications, interface characteristics, and package configuration.

Parameter Comparison

Parameter GD25VE16CSIGR (Main) GD25VQ16CSIGR (Substitute)
Memory Size 16Mbit 16Mbit
Memory Organization 2M x 8 2M x 8
Memory Interface SPI - Quad I/O SPI - Quad I/O
Clock Frequency 104 MHz 104 MHz
Voltage Supply Range 2.1V ~ 3.6V 2.3V ~ 3.6V
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Package / Case 8-SOIC (0.209", 5.30mm Width) 8-SOIC (0.209", 5.30mm Width)
Write Cycle Time - Word, Page Not specified 50µs, 3ms
RoHS Status ROHS3 Compliant ROHS3 Compliant
MSL Rating 3 (168 Hours) 3 (168 Hours)
Product Status Discontinued at DiGi Electronics Active

Engineering Selection Recommendations

The GD25VQ16CSIGR is a direct functional substitute for the discontinued GD25VE16CSIGR. Both devices share identical memory capacity, interface protocol, clock frequency, package configuration, and thermal operating range. The substitute part maintains ROHS3 compliance and equivalent MSL rating, ensuring compatibility with existing supply chain and manufacturing processes.

The primary distinction is product status: GD25VQ16CSIGR is currently in active production with verified availability, whereas GD25VE16CSIGR is discontinued. The substitute exhibits a marginally narrower supply voltage range (2.3V minimum versus 2.1V minimum), which is acceptable for applications operating within the 2.3V to 3.6V window. Write cycle timing specifications are provided for the substitute part, offering additional design reference data.

Frequently Asked Questions (FAQ)

Q: Can GD25VQ16CSIGR replace GD25VE16CSIGR in existing designs?

A: Yes. Both parts are functionally equivalent 16Mbit SPI Quad I/O Flash memory devices in 8-SOIC packaging with identical electrical and mechanical specifications. No circuit modifications are required for direct substitution.

Q: What is the difference between the two part numbers?

A: The GD25VE16CSIGR is discontinued, while GD25VQ16CSIGR is an active production equivalent from GigaDevice. The substitute offers the same performance characteristics with current availability.

Q: Are there voltage supply compatibility concerns?

A: The substitute part specifies a minimum supply voltage of 2.3V compared to 2.1V for the original. Applications operating at 2.1V to 2.3V require verification against the substitute datasheet. For systems operating at 2.3V or higher, no compatibility issues exist.

Q: Is the package footprint identical?

A: Yes. Both parts use 8-SOIC packaging with 0.209" width and 5.30mm body dimensions. PCB layouts and solder reflow profiles require no modification.

Q: Do compliance certifications match?

A: Yes. Both parts are ROHS3 compliant and REACH unaffected, with identical MSL rating of 3 (168 Hours). Manufacturing and storage procedures remain unchanged.

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