GD25Q64CPIG Equivalent & Substitute Parts

Part Overview

The GD25Q64CPIG is a 64Mbit NOR Flash memory IC with SPI and Quad I/O interface capabilities, operating at 120 MHz. This component is classified as Obsolete, which necessitates identification of functionally equivalent alternatives for ongoing system support and new design considerations. The part is housed in an 8-DIP package and operates across the industrial temperature range of -40°C to 85°C.

Substiute Parts

GD25Q64CPIG

GigaDevice Semiconductor (HK) LimitedIn Stock: 840GD25Q64CPIG Datasheet

Current PartRFQ

GD25Q64CSIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 55331GD25Q64CSIGR Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the GD25Q64CPIG is determined by strict equivalence across the following critical parameters:

• Memory capacity: 64Mbit
• Memory technology: FLASH - NOR
• Interface protocol: SPI - Quad I/O
• Clock frequency: 120 MHz
• Supply voltage range: 2.7V ~ 3.6V
• Operating temperature range: -40°C ~ 85°C
• Memory organization: 8M x 8

The GD25Q64CSIGR meets all functional and electrical requirements for substitution. The primary difference is packaging format: the substitute uses 8-SOIC (0.209", 5.30mm Width) instead of 8-DIP (0.260", 6.60mm). This packaging difference requires PCB layout and socket compatibility verification during integration.

Parameter Comparison

Engineering Selection Recommendations

The GD25Q64CSIGR provides functional equivalence to the GD25Q64CPIG across all electrical and memory interface specifications. Both components maintain ROHS3 compliance and identical MSL ratings. The substitute part carries a "Not For New Designs" status, indicating limited future availability.

Selection between these parts depends on PCB design constraints. The 8-DIP package of the main part accommodates through-hole or DIP socket mounting, while the 8-SOIC package of the substitute requires surface-mount footprint design. Pin-to-pin compatibility must be verified against the specific pinout documentation for each package variant.

Frequently Asked Questions (FAQ)

Q: Can GD25Q64CSIGR directly replace GD25Q64CPIG on existing PCBs?

A: Direct replacement requires PCB redesign. The main part uses 8-DIP packaging while the substitute uses 8-SOIC packaging. These packages have different footprints, pin spacing, and mounting methods. Adapter solutions or PCB layout modification is necessary.

Q: Are the electrical specifications identical between these parts?

A: Yes. Both parts share identical memory capacity (64Mbit), interface protocol (SPI - Quad I/O), clock frequency (120 MHz), supply voltage range (2.7V ~ 3.6V), and operating temperature range (-40°C ~ 85°C).

Q: What is the significance of the product status difference?

A: The main part is classified as Obsolete, indicating end-of-life status. The substitute is classified as Not For New Designs, indicating limited production and future availability. Neither status supports long-term procurement for new product development.

Q: Are there any compliance or certification differences?

A: Both parts maintain identical RoHS3 compliance, REACH unaffected status, and MSL ratings. No compliance differences exist between the two variants.

Q: What determines whether these parts are substitutable?

A: Substitutability is determined by matching memory capacity, technology type, interface protocol, clock frequency, voltage specifications, and operating temperature range. Package format differences do not affect functional substitutability but require design accommodation.