GD25Q40CSIGR Equivalent & Substitute Parts

Part Overview

The GD25Q40CSIGR is a 4Mbit NOR Flash memory IC manufactured by GigaDevice Semiconductor with SPI and Quad I/O interface capabilities. This component is classified as "Not For New Designs," indicating it has reached end-of-life status. Organizations currently using this part in production or maintenance applications require qualified substitute components that maintain functional and electrical compatibility while meeting current supply chain availability and compliance requirements.

Substiute Parts

GD25Q40CSIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 16107GD25Q40CSIGR Datasheet

Current PartRFQ

MX25R4035FM1IH1

MacronixIn Stock: 24077MX25R4035FM1IH1 Datasheet

SimilarRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution eligibility for the GD25Q40CSIGR is determined by the following critical parameters:

• Memory capacity of 4Mbit with 512K x 8 organization
• SPI with Quad I/O interface support
• 8-pin SOIC package configuration
• Non-Volatile NOR Flash technology
• Operating voltage range compatibility with 2.7V ~ 3.6V minimum requirement
• Operating temperature range of -40°C ~ 85°C
• RoHS3 compliance and MSL 3 rating

The MX25R4035FM1IH1 qualifies as a functional substitute based on matching memory capacity, organization, interface type, package form factor, and compliance certifications. Variations in clock frequency, write cycle timing, and voltage supply floor do not preclude substitution when the application requirements fall within the substitute part's specifications.

Parameter Comparison

Engineering Selection Recommendations

The MX25R4035FM1IH1 is a qualified substitute for the GD25Q40CSIGR based on functional equivalence in memory capacity, interface protocol, and package pin configuration. Both components maintain ROHS3 compliance and identical moisture sensitivity ratings, satisfying regulatory and handling requirements.

The substitute part demonstrates enhanced electrical characteristics: extended lower voltage operation (1.65V floor versus 2.7V) and higher clock frequency support (108 MHz versus 104 MHz). These improvements provide operational margin in applications where the original part is no longer available.

Physical package dimensions differ between the two parts. The GD25Q40CSIGR occupies 5.30mm width while the MX25R4035FM1IH1 measures 3.90mm width in the 8-SOIC form factor. PCB layout compatibility must be verified for applications with space constraints or existing footprint designs.

Write cycle timing is longer in the substitute part. Applications with strict write performance requirements must confirm that page write times of 4ms (versus 2.4ms) and word write times of 100µs (versus 50µs) remain acceptable within system timing budgets.

Frequently Asked Questions (FAQ)

Q: Can the MX25R4035FM1IH1 directly replace the GD25Q40CSIGR in existing designs?

A: Pin-to-pin compatibility exists for the 8-pin SOIC package. However, PCB footprint dimensions differ due to body width variation (5.30mm versus 3.90mm). Verify that the existing PCB layout accommodates the substitute part's physical dimensions before implementation.

Q: What are the key differences between these two parts?

A: The primary differences are package body width, clock frequency capability, minimum supply voltage, and write cycle timing. The substitute part supports lower voltage operation and higher clock speeds but requires longer write cycles. Memory capacity, organization, interface type, and pin count remain identical.

Q: Are both parts suitable for new product designs?

A: Both components carry "Not For New Designs" status. Neither part is recommended for new development. Current production alternatives from both manufacturers should be evaluated for new applications.

Q: How do the voltage supply ranges affect substitution?

A: The GD25Q40CSIGR requires minimum 2.7V supply voltage. The MX25R4035FM1IH1 operates at 1.65V minimum. If your application supplies 2.7V or higher, both parts function identically in this parameter. Applications operating below 2.7V require the substitute part.

Q: Does the difference in write cycle time impact system performance?

A: Write cycle time affects flash programming speed. The substitute part requires approximately 1.7 times longer for page writes (4ms versus 2.4ms). Applications performing frequent flash writes must confirm that extended write times do not violate system timing requirements or user experience specifications.

Q: Are there compliance or certification differences?

A: Both parts maintain identical RoHS3 compliance, REACH unaffected status, and MSL 3 moisture sensitivity ratings. No compliance disadvantage exists when substituting the MX25R4035FM1IH1 for the GD25Q40CSIGR.