GD25LQ64CWIGR Equivalent & Substitute Parts

Part Overview

The GD25LQ64CWIGR is a 64Mbit NOR Flash memory IC with SPI Quad I/O interface, manufactured by GigaDevice Semiconductor (HK) Limited. This device is classified as Last Time Buy, indicating discontinued production with limited inventory availability. The part is packaged in 8-WSON (5x6) surface mount configuration and operates across industrial temperature ranges (-40°C to 85°C). Due to its Last Time Buy status, identifying functionally equivalent substitute parts is essential for design continuity and long-term supply chain planning.

Substiute Parts

GD25LQ64CWIGR
GigaDevice Semiconductor (HK) LimitedIn Stock: 25059GD25LQ64CWIGR Datasheet
GD25LQ64CWIGR
Current Part
GD25LQ64EWIGR
GigaDevice Semiconductor (HK) LimitedIn Stock: 6053GD25LQ64EWIGR Datasheet
GD25LQ64EWIGR
MFR Recommended

Key Parameters

Parameter Value
Memory Size 64Mbit
Memory Format FLASH - NOR
Memory Interface SPI - Quad I/O
Memory Organization 8M x 8
Package / Case 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (5x6)
Voltage - Supply 1.65V ~ 2V
Operating Temperature -40°C ~ 85°C (TA)
Mounting Type Surface Mount
RoHS Status ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the GD25LQ64CWIGR is determined by strict alignment of the following critical parameters:

  • Memory capacity: 64Mbit (8M x 8 organization)
  • Memory technology: FLASH - NOR
  • Interface protocol: SPI - Quad I/O
  • Package type: 8-WSON (5x6) with exposed pad
  • Supply voltage range: 1.65V ~ 2V
  • Operating temperature range: -40°C ~ 85°C
  • Mounting configuration: Surface Mount
  • Compliance standards: ROHS3, MSL 3

The GD25LQ64EWIGR qualifies as a direct substitute based on matching all critical electrical and mechanical parameters. Both parts share identical memory capacity, interface protocol, package configuration, voltage specifications, and temperature operating range. The substitute part maintains full compatibility with existing PCB layouts and electrical interfaces.

Parameter Comparison

Parameter GD25LQ64CWIGR (Main Part) GD25LQ64EWIGR (Substitute)
Memory Size 64Mbit 64Mbit
Memory Format FLASH - NOR FLASH - NOR (SLC)
Memory Organization 8M x 8 8M x 8
Memory Interface SPI - Quad I/O SPI - Quad I/O
Clock Frequency 120 MHz 133 MHz
Access Time Not specified 6 ns
Write Cycle Time - Page 2.4ms 2.4ms
Voltage - Supply 1.65V ~ 2V 1.65V ~ 2V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Package / Case 8-WDFN Exposed Pad 8-WDFN Exposed Pad
Supplier Device Package 8-WSON (5x6) 8-WSON (5x6)
Mounting Type Surface Mount Surface Mount
RoHS Status ROHS3 Compliant ROHS3 Compliant
Moisture Sensitivity Level (MSL) 3 (168 Hours) 3 (168 Hours)
Product Status Last Time Buy Active

Engineering Selection Recommendations

The GD25LQ64EWIGR is a qualified substitute for the GD25LQ64CWIGR based on matching electrical specifications, package configuration, and compliance certifications. The substitute part offers improved performance characteristics with a higher clock frequency (133 MHz versus 120 MHz) and specified access time (6 ns), while maintaining identical page write cycle time and supply voltage requirements.

The GD25LQ64EWIGR carries Active product status with current inventory availability (6040 Pcs), providing supply chain continuity compared to the Last Time Buy status of the original part. Both parts maintain ROHS3 compliance and identical MSL ratings, ensuring equivalent environmental and regulatory compliance for manufacturing and field deployment.

Frequently Asked Questions (FAQ)

Q: Can the GD25LQ64EWIGR be used as a direct replacement for the GD25LQ64CWIGR in existing designs?

A: Yes. Both parts share identical memory capacity (64Mbit), interface protocol (SPI - Quad I/O), package configuration (8-WSON 5x6), supply voltage range (1.65V ~ 2V), and operating temperature range (-40°C ~ 85°C). PCB layouts and electrical interfaces require no modification.

Q: What are the performance differences between these parts?

A: The GD25LQ64EWIGR operates at a higher clock frequency (133 MHz versus 120 MHz) and specifies an access time of 6 ns. Page write cycle time remains identical at 2.4ms for both parts. These differences represent performance improvements in the substitute part.

Q: Are there packaging or handling differences?

A: Both parts use identical 8-WSON (5x6) surface mount packages with exposed pads. Moisture sensitivity levels are identical at MSL 3 (168 Hours). No differences in handling, storage, or assembly procedures are required.

Q: Why is the original part marked as Last Time Buy?

A: Last Time Buy status indicates the manufacturer has discontinued production. The GD25LQ64EWIGR, with Active status, represents the current production equivalent from the same manufacturer.

Q: Are compliance certifications equivalent?

A: Yes. Both parts carry ROHS3 compliance and identical regulatory classifications (ECCN 3A991B1A, HTSUS 8542.32.0071), ensuring equivalent compliance for manufacturing and export requirements.

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