GD25LQ64CSIGR Equivalent & Substitute Parts

Part Overview

The GD25LQ64CSIGR is a 64Mbit NOR Flash memory IC with SPI Quad I/O interface, manufactured by GigaDevice Semiconductor (HK) Limited. This component operates at 120 MHz clock frequency and is housed in an 8-SOIC surface mount package. The part is currently in Last Time Buy status, indicating end-of-life production. Identifying equivalent substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications requiring this memory technology.

Substiute Parts

GD25LQ64CSIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 5692GD25LQ64CSIGR Datasheet

Current PartRFQ

GD25LQ64ESIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 36804GD25LQ64ESIGR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the GD25LQ64CSIGR is determined by strict equivalence across the following critical parameters:

• Memory capacity: 64Mbit (8M x 8 organization)
• Memory technology: FLASH - NOR
• Interface protocol: SPI - Quad I/O
• Package type: 8-SOIC (0.209", 5.30mm Width)
• Supply voltage range: 1.65V ~ 2V
• Operating temperature range: -40°C ~ 85°C (TA)
• Mounting configuration: Surface Mount

The GD25LQ64ESIGR qualifies as a direct substitute based on matching all critical parameters. Variations in clock frequency (133 MHz vs. 120 MHz) and access time (7 ns) represent performance enhancements that maintain backward compatibility with the original part specification.

Parameter Comparison

Engineering Selection Recommendations

The GD25LQ64ESIGR is suitable for applications currently using the GD25LQ64CSIGR. Both parts maintain identical memory capacity, interface protocol, package footprint, and electrical specifications. The GD25LQ64ESIGR offers improved performance characteristics with a higher clock frequency (133 MHz) and faster access time (7 ns), while maintaining full compatibility with existing designs.

The GD25LQ64ESIGR carries Active product status, ensuring continued availability and supply chain support. Both parts are ROHS3 compliant and carry identical moisture sensitivity levels (MSL 3, 168 Hours), supporting equivalent handling and storage requirements.

Frequently Asked Questions (FAQ)

Q: Can the GD25LQ64ESIGR directly replace the GD25LQ64CSIGR in existing designs?

A: Yes. Both parts share identical memory capacity (64Mbit), interface type (SPI - Quad I/O), package configuration (8-SOIC), supply voltage range (1.65V ~ 2V), and operating temperature range (-40°C ~ 85°C). The GD25LQ64ESIGR operates at higher clock frequency and faster access time, which are backward-compatible enhancements.

Q: Are there any PCB layout or footprint modifications required?

A: No. Both parts use the 8-SOIC (0.209", 5.30mm Width) package with identical pin configuration and mounting type (Surface Mount). Existing PCB layouts require no modification.

Q: What is the difference in performance between these parts?

A: The GD25LQ64ESIGR operates at 133 MHz clock frequency compared to 120 MHz for the GD25LQ64CSIGR, and provides 7 ns access time. Page write cycle time remains identical at 2.4ms for both parts.

Q: Do both parts meet the same compliance standards?

A: Yes. Both the GD25LQ64CSIGR and GD25LQ64ESIGR are ROHS3 compliant, REACH unaffected, and carry identical moisture sensitivity levels (MSL 3, 168 Hours).

Q: Why is the GD25LQ64CSIGR listed as Last Time Buy?

A: Last Time Buy status indicates the manufacturer is discontinuing production. The GD25LQ64ESIGR, with Active product status, represents the current production alternative for this memory capacity and interface type.