GD25LQ64CSIG Equivalent & Substitute Parts

Part Overview

The GD25LQ64CSIG is a 64Mbit NOR Flash memory IC with SPI Quad I/O interface, manufactured by GigaDevice Semiconductor (HK) Limited. This non-volatile memory device operates at 120 MHz and is packaged in an 8-SOP surface mount configuration. The part is currently in Last Time Buy status, indicating end-of-life production. Identifying equivalent substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications requiring this memory capacity and interface specification.

Key Parameters

Parameter	Value
Memory Size	64Mbit
Memory Format	FLASH - NOR
Memory Interface	SPI - Quad I/O
Memory Organization	8M x 8
Clock Frequency	120 MHz
Voltage Supply Range	1.65V ~ 2V
Operating Temperature	-40°C ~ 85°C
Package Type	8-SOIC (0.209", 5.30mm Width)
Mounting Type	Surface Mount
Write Cycle Time (Page)	2.4ms
RoHS Status	ROHS3 Compliant
MSL Rating	3 (168 Hours)

Substitute Part Grouping Explanation

Substitution eligibility for the GD25LQ64CSIG is determined by strict alignment with the following core parameters:

Memory capacity: 64Mbit (8M x 8 organization)
Memory technology: FLASH - NOR
Interface protocol: SPI - Quad I/O
Package form factor: 8-SOIC (0.209", 5.30mm Width)
Voltage supply range: 1.65V ~ 2V
Operating temperature range: -40°C ~ 85°C
Surface mount configuration

The GD25LQ64ESIGR qualifies as a direct substitute based on matching all mandatory electrical and mechanical parameters. Differences in clock frequency (133 MHz vs. 120 MHz), access time specification, and packaging format (Tape & Reel vs. Tube) do not preclude substitution, as the substitute maintains backward compatibility with the core functional requirements.

Parameter Comparison

Parameter	GD25LQ64CSIG (Main Part)	GD25LQ64ESIGR (Substitute)
Manufacturer	GigaDevice Semiconductor (HK) Limited	GigaDevice Semiconductor (HK) Limited
Memory Size	64Mbit	64Mbit
Memory Format	FLASH - NOR	FLASH - NOR
Memory Interface	SPI - Quad I/O	SPI - Quad I/O
Memory Organization	8M x 8	8M x 8
Clock Frequency	120 MHz	133 MHz
Voltage Supply Range	1.65V ~ 2V	1.65V ~ 2V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C
Package Type	8-SOIC (0.209", 5.30mm Width)	8-SOIC (0.209", 5.30mm Width)
Mounting Type	Surface Mount	Surface Mount
Write Cycle Time (Page)	2.4ms	2.4ms
Product Status	Last Time Buy	Active
RoHS Status	ROHS3 Compliant	ROHS3 Compliant
MSL Rating	3 (168 Hours)	3 (168 Hours)
Packaging Format	Tube	Tape & Reel (TR)

Engineering Selection Recommendations

The GD25LQ64ESIGR is the qualified substitute for the GD25LQ64CSIG. Selection rationale is based on the following factors:

Both parts are manufactured by GigaDevice Semiconductor (HK) Limited and share the same base product number (GD25LQ64), ensuring design compatibility.
The substitute maintains identical electrical specifications for memory capacity, interface protocol, voltage supply range, and operating temperature.
The substitute operates at a higher clock frequency (133 MHz) compared to the main part (120 MHz), providing enhanced performance capability without compromising backward compatibility.
Both parts carry ROHS3 compliance and identical MSL ratings, meeting environmental and reliability standards.
The substitute is in Active product status, ensuring continued availability and supply chain stability, whereas the main part is in Last Time Buy status.
Packaging format differs (Tape & Reel vs. Tube), which may affect procurement logistics but does not impact electrical or mechanical compatibility.

Frequently Asked Questions (FAQ)

Q: Can the GD25LQ64ESIGR be used as a direct replacement for the GD25LQ64CSIG in existing designs?

A: Yes. The substitute maintains identical memory capacity, interface protocol, voltage supply range, operating temperature range, and package form factor. The design requires no modifications.

Q: What is the significance of the higher clock frequency in the GD25LQ64ESIGR?

A: The substitute operates at 133 MHz compared to the main part's 120 MHz. This represents enhanced performance capability and does not create compatibility issues in applications designed for the lower frequency specification.

Q: Are there differences in packaging that affect PCB assembly?

A: Both parts use the same 8-SOIC package form factor and surface mount configuration. The difference is in supply format: the main part is supplied in Tube packaging, while the substitute is supplied in Tape & Reel format. This affects procurement and handling but not PCB assembly or electrical performance.

Q: Do both parts meet the same compliance standards?

A: Yes. Both the GD25LQ64CSIG and GD25LQ64ESIGR are ROHS3 compliant, carry identical MSL ratings of 3 (168 Hours), and are REACH unaffected.

Q: Why is the main part listed as Last Time Buy?

A: Last Time Buy status indicates the manufacturer is discontinuing production. The GD25LQ64ESIGR, in Active status, ensures continued availability for new designs and ongoing production requirements.

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