GD25LQ64CQIGR Equivalent & Substitute Parts

Part Overview

The GD25LQ64CQIGR is a 64Mbit NOR Flash memory IC with SPI and Quad I/O interface capabilities, manufactured by GigaDevice Semiconductor (HK) Limited. This component is classified as Last Time Buy, indicating discontinued production with limited inventory availability. The part is housed in an 8-USON (4x4) surface mount package and operates across industrial temperature ranges (-40°C to 85°C). Identifying equivalent and substitute parts is essential for design continuity, long-term supply chain planning, and transition to active production alternatives.

Substiute Parts

GD25LQ64CQIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 59315GD25LQ64CQIGR Datasheet

Current PartRFQ

GD25LQ64EQIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 6085GD25LQ64EQIGR Datasheet

MFR RecommendedRFQ

Key Parameters

Substitute Part Grouping Explanation

Substitution of the GD25LQ64CQIGR is determined by strict equivalence across the following critical parameters:

• Memory capacity: 64Mbit (8M x 8 organization)
• Memory technology: FLASH - NOR
• Interface protocol: SPI - Quad I/O compatibility
• Supply voltage range: 1.65V ~ 2V
• Operating temperature range: -40°C ~ 85°C
• Package form factor: 8-USON (4x4) surface mount
• Regulatory compliance: ROHS3 Compliant

The GD25LQ64EQIGR qualifies as a direct substitute based on matching all critical electrical and mechanical parameters. The substitute part maintains identical memory capacity, interface protocol, voltage specifications, and temperature operating range. Both parts are manufactured by the same supplier and share the same physical package footprint.

Parameter Comparison

Engineering Selection Recommendations

The GD25LQ64EQIGR is the designated manufacturer-recommended substitute for the GD25LQ64CQIGR. Selection of the substitute part is supported by the following factors:

• Identical electrical specifications across voltage supply, operating temperature, and memory capacity
• Matching physical package footprint (8-USON 4x4) enabling direct PCB compatibility
• Enhanced clock frequency (133 MHz vs. 120 MHz) providing performance headroom
• Active production status ensuring long-term supply availability and cost stability
• Equivalent regulatory compliance (ROHS3 Compliant)
• Same manufacturer lineage within the GD25LQ series

The transition from GD25LQ64CQIGR to GD25LQ64EQIGR presents no functional or mechanical incompatibility for applications requiring 64Mbit SPI Quad I/O NOR Flash memory in industrial temperature environments.

Frequently Asked Questions (FAQ)

Q: Can GD25LQ64EQIGR be used as a direct replacement for GD25LQ64CQIGR in existing designs?

A: Yes. Both parts share identical memory capacity (64Mbit), interface protocol (SPI - Quad I/O), supply voltage range (1.65V ~ 2V), operating temperature range (-40°C ~ 85°C), and physical package (8-USON 4x4). No PCB modifications or firmware changes are required.

Q: What is the difference between the main part and the substitute?

A: The primary differences are product status and performance specifications. GD25LQ64CQIGR is Last Time Buy with 120 MHz clock frequency. GD25LQ64EQIGR is Active production with 133 MHz clock frequency and includes QPI interface support. Both maintain identical page write cycle time (2.4ms) and core electrical parameters.

Q: Are there any package or pinout differences?

A: No. Both parts use the 8-XDFN Exposed Pad package with 8-USON (4x4) supplier device package designation. Pinout and footprint are identical, enabling direct PCB compatibility.

Q: What certifications apply to both parts?

A: Both GD25LQ64CQIGR and GD25LQ64EQIGR are ROHS3 Compliant and REACH Unaffected. Moisture Sensitivity Level is 3 (168 Hours) for both parts.

Q: Why is GD25LQ64CQIGR classified as Last Time Buy?

A: Last Time Buy status indicates the manufacturer has discontinued production of this specific part number. GD25LQ64EQIGR represents the active production alternative within the same product family.