GD25LE64CLIGR Equivalent & Substitute Parts

Part Overview

The GD25LE64CLIGR is a 64Mbit NOR Flash memory IC with SPI and Quad I/O interface capability, operating at 133 MHz. Manufactured by GigaDevice Semiconductor (HK) Limited, this component is packaged in a 21-WLCSP (Wafer Level Chip Scale Package) configuration. The part is currently in Last Time Buy status, indicating end-of-life production. Identifying equivalent and substitute parts is necessary to ensure design continuity and maintain supply chain reliability for applications requiring this memory capacity and interface specification.

Key Parameters

Parameter	Value
Memory Size	64Mbit
Memory Type	Non-Volatile FLASH
Memory Technology	FLASH - NOR
Memory Organization	8M x 8
Memory Interface	SPI - Quad I/O
Clock Frequency	133 MHz
Write Cycle Time (Page)	2.4ms
Supply Voltage	1.65V ~ 2V
Operating Temperature	-40°C ~ 85°C
Mounting Type	Surface Mount
Package Type	21-WLCSP
RoHS Status	ROHS3 Compliant
Moisture Sensitivity Level	MSL 1 (Unlimited)

Substitute Part Grouping Explanation

Substitution eligibility for the GD25LE64CLIGR is determined by the following critical parameters:

Memory Capacity: 64Mbit (8M x 8 organization)
Memory Technology: FLASH - NOR type
Interface Protocol: SPI with Quad I/O capability
Operating Frequency: 133 MHz minimum
Supply Voltage Range: 1.65V ~ 2V compatibility
Operating Temperature Range: -40°C ~ 85°C
Compliance: ROHS3 and REACH status alignment

The GD25LE64ELIGR qualifies as a substitute part because it maintains identical memory capacity, technology, interface protocol, frequency specification, voltage range, and temperature operating range. Both parts are manufactured by GigaDevice Semiconductor (HK) Limited within the same product series (GD25LE). The primary difference is the package configuration: GD25LE64CLIGR uses 21-WLCSP while GD25LE64ELIGR uses 16-WLCSP. Package selection depends on PCB layout constraints and mechanical design requirements.

Parameter Comparison

Parameter	GD25LE64CLIGR (Main Part)	GD25LE64ELIGR (Substitute)
Manufacturer	GigaDevice Semiconductor (HK) Limited	GigaDevice Semiconductor (HK) Limited
Memory Size	64Mbit	64Mbit
Memory Organization	8M x 8	8M x 8
Memory Technology	FLASH - NOR	FLASH - NOR (SLC)
Memory Interface	SPI - Quad I/O	SPI - Quad I/O, QPI
Clock Frequency	133 MHz	133 MHz
Write Cycle Time (Page)	2.4ms	2.4ms
Access Time	Not specified	6 ns
Supply Voltage	1.65V ~ 2V	1.65V ~ 2V
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C
Mounting Type	Surface Mount	Surface Mount
Package Type	21-WLCSP	16-WLCSP
Packaging Format	Not specified	Tape & Reel (TR)
Product Status	Last Time Buy	Active
RoHS Status	ROHS3 Compliant	Not specified
Moisture Sensitivity Level	MSL 1 (Unlimited)	Not specified

Engineering Selection Recommendations

The GD25LE64ELIGR is the primary substitute for the GD25LE64CLIGR based on functional equivalence and product lifecycle status. The main part is in Last Time Buy status, indicating limited future availability. The substitute part is in Active status, ensuring continued supply and manufacturing support.

Selection between these parts should be based on:

PCB Layout Compatibility: The 21-WLCSP package (main part) and 16-WLCSP package (substitute) have different footprints. Verify that your PCB design can accommodate the selected package geometry.
Supply Chain Continuity: The substitute part's Active status provides superior long-term availability compared to the main part's Last Time Buy designation.
Compliance Requirements: Both parts meet ROHS3 compliance. Verify REACH status requirements for your specific application and region.
Interface Capability: The substitute part includes QPI (Quad Peripheral Interface) in addition to standard SPI Quad I/O, providing enhanced interface flexibility without compromising backward compatibility.

Frequently Asked Questions (FAQ)

Q: Can GD25LE64ELIGR be used as a direct replacement for GD25LE64CLIGR?

A: Functional substitution is possible because both parts share identical memory capacity (64Mbit), technology (FLASH - NOR), interface protocol (SPI - Quad I/O), operating frequency (133 MHz), voltage range (1.65V ~ 2V), and temperature range (-40°C ~ 85°C). However, package substitution requires PCB redesign because the main part uses 21-WLCSP while the substitute uses 16-WLCSP. These packages have different pin counts and footprints.

Q: What is the difference between 21-WLCSP and 16-WLCSP packages?

A: WLCSP (Wafer Level Chip Scale Package) designations indicate the number of solder balls in the package array. The 21-WLCSP contains 21 connection points, while the 16-WLCSP contains 16 connection points. This difference affects PCB layout, routing complexity, and mechanical fit. Verify your PCB design specifications before selecting either package variant.

Q: Why is the main part listed as Last Time Buy?

A: Last Time Buy status indicates that the manufacturer has announced end-of-life production for this part number. This means existing inventory will be depleted and no new manufacturing runs are planned. The GD25LE64ELIGR substitute part is in Active status, ensuring continued availability and manufacturing support for future production needs.

Q: Are there any interface differences between the two parts?

A: Both parts support SPI with Quad I/O operation at 133 MHz. The substitute part (GD25LE64ELIGR) additionally supports QPI (Quad Peripheral Interface) mode. This enhanced capability is backward compatible and does not affect standard SPI Quad I/O operation. Existing firmware and driver implementations will function without modification.

Q: What compliance certifications apply to these parts?

A: The main part (GD25LE64CLIGR) is ROHS3 compliant and REACH unaffected. The substitute part (GD25LE64ELIGR) compliance status should be verified with the manufacturer or authorized distributor for your specific application requirements and regional regulations.

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