GD25LE255EWIGR Equivalent & Substitute Parts

Part Overview

The GD25LE255EWIGR is a 256Mbit NOR Flash memory IC manufactured by GigaDevice Semiconductor (HK) Limited. This non-volatile memory device operates as a Serial Peripheral Interface (SPI) with Quad I/O and QPI capabilities, designed for embedded systems requiring high-density, low-power flash storage. The part is currently in active production status with 919 units available in new original inventory. Substitute parts are identified when equivalent electrical and mechanical parameters align with the original specification, enabling direct replacement in applications where component availability or supply chain requirements necessitate alternative sourcing.

Key Parameters

Parameter	Value
Memory Size	256Mbit
Memory Organization	32M x 8
Memory Interface	SPI - Quad I/O, QPI
Clock Frequency	133 MHz
Access Time	6 ns
Voltage Supply Range	1.65V ~ 2V
Operating Temperature Range	-40°C ~ 85°C
Package Type	8-WDFN Exposed Pad (8-WSON 5x6)
Mounting Type	Surface Mount
Write Cycle Time (Word/Page)	60µs / 2.4ms

Substitute Part Grouping Explanation

Substitution eligibility for the GD25LE255EWIGR is determined by strict equivalence across the following critical parameters:

Memory Capacity & Organization: 256Mbit capacity with 32M x 8 organization
Interface Protocol: SPI with Quad I/O and QPI support at 133 MHz
Electrical Specifications: Supply voltage range 1.65V ~ 2V, access time 6 ns
Thermal Operating Range: -40°C ~ 85°C
Physical Package: 8-WDFN with exposed pad in 5x6mm footprint
Memory Technology: FLASH - NOR (SLC) non-volatile architecture

The GD25LQ255EWIGR meets all substitution criteria, maintaining identical electrical performance, memory organization, interface capabilities, and package specifications as the primary part.

Parameter Comparison

Parameter	GD25LE255EWIGR	GD25LQ255EWIGR	Match Status
Memory Size	256Mbit	256Mbit	Equivalent
Memory Organization	32M x 8	32M x 8	Equivalent
Memory Interface	SPI - Quad I/O, QPI	SPI - Quad I/O, QPI	Equivalent
Clock Frequency	133 MHz	133 MHz	Equivalent
Access Time	6 ns	6 ns	Equivalent
Voltage Supply Range	1.65V ~ 2V	1.65V ~ 2V	Equivalent
Operating Temperature	-40°C ~ 85°C	-40°C ~ 85°C	Equivalent
Package Type	8-WDFN Exposed Pad	8-WDFN Exposed Pad	Equivalent
Mounting Type	Surface Mount	Surface Mount	Equivalent
Write Cycle Time (Word/Page)	60µs / 2.4ms	60µs / 2.4ms	Equivalent
Product Status	Active	Active	Equivalent
Memory Technology	FLASH - NOR (SLC)	FLASH - NOR (SLC)	Equivalent

Engineering Selection Recommendations

Both the GD25LE255EWIGR and GD25LQ255EWIGR are active production parts from GigaDevice Semiconductor (HK) Limited. The GD25LQ255EWIGR carries ROHS3 compliance certification and MSL rating of 3 (168 Hours), with documented ECCN and HTSUS classifications. Selection between these parts should be based on supply chain availability, inventory levels, and compliance documentation requirements for the target application. The GD25LQ255EWIGR currently maintains higher inventory availability at 3400 units compared to 919 units for the GD25LE255EWIGR.

Frequently Asked Questions (FAQ)

Q: Can the GD25LQ255EWIGR directly replace the GD25LE255EWIGR in existing designs?

A: Yes. Both parts share identical memory capacity, interface protocol, electrical specifications, operating temperature range, and physical package dimensions. No circuit modifications or firmware changes are required for direct substitution.

Q: Are there differences in supply voltage requirements between these parts?

A: No. Both parts operate within the same supply voltage range of 1.65V ~ 2V, ensuring compatibility with existing power supply designs.

Q: Do these parts have the same access time and clock frequency specifications?

A: Yes. Both parts specify 6 ns access time and 133 MHz clock frequency, maintaining identical performance characteristics for SPI Quad I/O and QPI operations.

Q: What is the significance of the 8-WSON (5x6) package specification?

A: The 8-WSON (5x6) package denotes an 8-pin Wafer-Level Chip Scale Package with 5mm x 6mm footprint dimensions. Both parts use this identical package, ensuring PCB layout compatibility without redesign.

Q: Are there compliance or certification differences between these parts?

A: The GD25LQ255EWIGR includes documented ROHS3 compliance and MSL rating information. Both parts are active production components from the same manufacturer with equivalent functional specifications.

Q: What write cycle times should be expected from these parts?

A: Both parts specify 60 microseconds for word write operations and 2.4 milliseconds for page write operations, providing identical performance for flash programming operations.

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