GD25LB32EWIGR Equivalent & Substitute Parts

Part Overview

The GD25LB32EWIGR is a 32Mbit NOR Flash memory IC manufactured by GigaDevice Semiconductor (HK) Limited. This SPI-based quad I/O memory device operates at 133 MHz with a 6 ns access time and is housed in an 8-WSON (5x6) surface mount package. The device is actively produced and widely used in embedded systems, IoT applications, and data storage solutions requiring non-volatile memory with fast read/write performance. Identifying equivalent substitute parts ensures design flexibility, supply chain continuity, and cost optimization while maintaining electrical and mechanical compatibility.

Substiute Parts

GD25LB32EWIGR
GigaDevice Semiconductor (HK) LimitedIn Stock: 974GD25LB32EWIGR Datasheet
GD25LB32EWIGR
Current Part
GD25LQ32EWIGR
GigaDevice Semiconductor (HK) LimitedIn Stock: 6759GD25LQ32EWIGR Datasheet
GD25LQ32EWIGR
Parametric Equivalent

Key Parameters

Parameter Value
Memory Size 32Mbit
Memory Type FLASH - NOR (SLC)
Memory Interface SPI - Quad I/O, QPI
Clock Frequency 133 MHz
Access Time 6 ns
Voltage Supply Range 1.65V ~ 2V
Write Cycle Time (Word/Page) 60µs / 2.4ms
Operating Temperature -40°C ~ 85°C
Package Type 8-WDFN Exposed Pad
Supplier Package 8-WSON (5x6)
Mounting Type Surface Mount

Substitute Part Grouping Explanation

Substitute parts for the GD25LB32EWIGR are determined by strict equivalence across the following critical parameters:

  • Memory Capacity: 32Mbit (4M x 8 organization)
  • Memory Technology: FLASH - NOR (SLC)
  • Interface Protocol: SPI - Quad I/O, QPI
  • Clock Frequency: 133 MHz
  • Access Time: 6 ns
  • Supply Voltage Range: 1.65V ~ 2V
  • Write Performance: 60µs word cycle, 2.4ms page cycle
  • Operating Temperature Range: -40°C ~ 85°C
  • Package Footprint: 8-WSON (5x6) with exposed pad
  • Mounting Technology: Surface Mount

The GD25LQ32EWIGR meets all substitution criteria as a parametric equivalent from the same manufacturer, ensuring pin-compatible, functionally identical operation within the specified electrical and thermal envelope.

Parameter Comparison

Parameter GD25LB32EWIGR GD25LQ32EWIGR
Manufacturer GigaDevice Semiconductor (HK) Limited GigaDevice Semiconductor (HK) Limited
Memory Size 32Mbit 32Mbit
Memory Organization 4M x 8 4M x 8
Memory Technology FLASH - NOR (SLC) FLASH - NOR (SLC)
Memory Interface SPI - Quad I/O, QPI SPI - Quad I/O, QPI
Clock Frequency 133 MHz 133 MHz
Access Time 6 ns 6 ns
Voltage Supply 1.65V ~ 2V 1.65V ~ 2V
Write Cycle Time (Word) 60µs 60µs
Write Cycle Time (Page) 2.4ms 2.4ms
Operating Temperature -40°C ~ 85°C -40°C ~ 85°C
Package Type 8-WDFN Exposed Pad 8-WDFN Exposed Pad
Supplier Package 8-WSON (5x6) 8-WSON (5x6)
Mounting Type Surface Mount Surface Mount
Product Status Active Active

Engineering Selection Recommendations

Both the GD25LB32EWIGR and GD25LQ32EWIGR are active production devices from GigaDevice Semiconductor (HK) Limited. The GD25LQ32EWIGR carries additional compliance certifications including RoHS3 compliance, REACH unaffected status, and defined ECCN/HTSUS classifications, making it suitable for applications with regulatory requirements. Selection between these parts should be based on supply availability, inventory levels, and specific compliance mandates of the end application. Both devices are electrically and mechanically interchangeable within the specified operating parameters.

Frequently Asked Questions (FAQ)

Q: Can the GD25LQ32EWIGR directly replace the GD25LB32EWIGR in existing designs?

A: Yes. Both devices share identical electrical specifications, memory capacity, interface protocol, clock frequency, access time, supply voltage range, and package footprint. Pin-to-pin compatibility is guaranteed, and no circuit modifications are required.

Q: Are there differences in the 8-WSON (5x6) package between these parts?

A: No. Both parts use the same 8-WSON (5x6) surface mount package with exposed pad. Physical dimensions, pin assignments, and thermal characteristics are identical.

Q: What is the significance of the voltage supply range 1.65V ~ 2V?

A: This narrow supply voltage window defines the operating envelope for both devices. Designs must maintain supply voltage within this range to ensure specified performance. Both parts operate identically across this range.

Q: Do these parts support the same memory interface protocols?

A: Yes. Both the GD25LB32EWIGR and GD25LQ32EWIGR support SPI - Quad I/O and QPI (Quad Peripheral Interface) at 133 MHz, enabling high-speed data transfer in applications requiring fast memory access.

Q: What is the significance of the 6 ns access time specification?

A: The 6 ns access time defines the maximum delay from address setup to valid data output during read operations. Both parts meet this specification, ensuring consistent timing performance in synchronous and asynchronous read cycles.

Q: Are there compliance or certification differences between these parts?

A: The GD25LQ32EWIGR includes documented RoHS3 compliance, REACH unaffected status, and ECCN/HTSUS classifications. The GD25LB32EWIGR specifications do not include these certifications in the provided data. Applications with regulatory requirements should verify compliance documentation with the manufacturer.

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