GD25LB32ESIGR Equivalent & Substitute Parts

Part Overview

The GD25LB32ESIGR is a 32Mbit NOR Flash memory IC manufactured by GigaDevice Semiconductor (HK) Limited. This SPI/Quad I/O device operates at 133 MHz with a 6 ns access time and is housed in an 8-SOP package. The part is currently in active production status with 692 units available in inventory. Substitute parts are identified when equivalent electrical and mechanical parameters are maintained across the same memory category, interface protocol, and package specification.

Substiute Parts

GD25LB32ESIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 772GD25LB32ESIGR Datasheet

Current PartRFQ

GD25LE32ESIGR

GigaDevice Semiconductor (HK) LimitedIn Stock: 2689GD25LE32ESIGR Datasheet

Parametric EquivalentRFQ

Key Parameters

Substitute Part Grouping Explanation

The GD25LE32ESIGR qualifies as a parametric equivalent to the GD25LB32ESIGR based on the following criteria:

Electrical Parameter Equivalence:

• Identical memory capacity: 32Mbit
• Identical memory organization: 4M x 8
• Identical interface protocol: SPI - Quad I/O, QPI
• Identical clock frequency: 133 MHz
• Identical access time: 6 ns
• Identical write cycle timing: 60µs (word), 2.4ms (page)
• Identical supply voltage range: 1.65V ~ 2V
• Identical operating temperature range: -40°C ~ 85°C

Mechanical Parameter Equivalence:

• Identical package type: 8-SOIC (0.209", 5.30mm Width)
• Identical mounting type: Surface Mount
• Identical supplier device package: 8-SOP

Manufacturer & Status:

• Same manufacturer: GigaDevice Semiconductor (HK) Limited
• Both parts in active production status

Parameter Comparison

Engineering Selection Recommendations

Both the GD25LB32ESIGR and GD25LE32ESIGR are active production parts from GigaDevice Semiconductor (HK) Limited with identical electrical and mechanical specifications. Selection between these parts may be based on packaging format availability: the GD25LB32ESIGR is supplied in Tape & Reel (TR) format with 692 units in stock, while the GD25LE32ESIGR is available in Cut Tape (CT) and Digi-Reel® format with 2653 units in stock. The GD25LE32ESIGR carries ROHS3 compliance, REACH Unaffected status, and MSL rating of 3 (168 Hours). Both parts are electrically interchangeable in applications requiring 32Mbit SPI/Quad I/O NOR Flash memory with 133 MHz operation in 8-SOP packages.

Frequently Asked Questions (FAQ)

Q: Are GD25LB32ESIGR and GD25LE32ESIGR pin-compatible? A: Yes. Both parts use the 8-SOP package with identical pinout and electrical characteristics, enabling direct substitution on PCB layouts designed for either part number.

Q: What is the difference between these two part numbers? A: The primary differences are packaging format (Tape & Reel vs. Cut Tape/Digi-Reel) and inventory availability. All electrical and mechanical parameters are identical.

Q: Can I use GD25LE32ESIGR as a drop-in replacement for GD25LB32ESIGR? A: Yes. The GD25LE32ESIGR is a parametric equivalent with identical memory capacity, interface protocol, timing specifications, voltage requirements, temperature range, and package dimensions.

Q: Are there any compliance differences between these parts? A: The GD25LE32ESIGR includes documented ROHS3 compliance, REACH Unaffected status, and MSL rating. Compliance documentation for the GD25LB32ESIGR should be verified with the manufacturer or authorized distributor.

Q: What packaging options are available? A: GD25LB32ESIGR is supplied in Tape & Reel (TR) format. GD25LE32ESIGR is available in Cut Tape (CT) and Digi-Reel® format. Both use 8-SOP package configuration.

Q: Are these parts suitable for high-temperature applications? A: Both parts operate across the -40°C to 85°C temperature range, suitable for industrial and automotive applications within this specification.